UV irradiation effects on the bonding structure and electrical properties of ultra low-k SiOC(–H) thin films for 45 nm technology node

2011 ◽  
Vol 11 (5) ◽  
pp. S109-S113 ◽  
Author(s):  
Chi Kyu Choi ◽  
Chang Young Kim ◽  
R. Navamathavan ◽  
Heang Seuk Lee ◽  
Jong-Kwan Woo ◽  
...  
2015 ◽  
Vol 119 (2) ◽  
pp. 659-665
Author(s):  
M. Manouchehrian ◽  
M. M. Larijani ◽  
S. M. Elahi ◽  
M. A. Moghri Moazzen

2006 ◽  
Vol 13 (3-4) ◽  
pp. 413-417 ◽  
Author(s):  
Zhi-Wei He ◽  
Xue-Qin Liu ◽  
Da-Yin Xu ◽  
Yong-Ping Guo ◽  
Yin-Yue Wang

RSC Advances ◽  
2020 ◽  
Vol 10 (56) ◽  
pp. 34130-34136
Author(s):  
So Young Park ◽  
Eun Hye Kwon ◽  
Yeong Don Park

When the top part of the solution was irradiated with UV light, the dip-coated P3HT film showed enhanced crystallinity and electrical properties.


2007 ◽  
Vol 124-126 ◽  
pp. 185-188
Author(s):  
Jin Heong Yim ◽  
Young Kwon Park ◽  
Jong Ki Jeon

The porous SSQ (silsesquioxane) films were prepared by using alkoxy silyl substituted cyclodextrin (sCD) and methyl substituted cyclodextrin (tCD) based porogen. The mechanical and electrical properties of these deposited films were investigated for the applications as low dielectric materials. The mechanical properties of porous film by using sCD are worse than those by using tCD due to its high pore interconnection length. sCD templated porous films show almost constant pore diameter as a function of porogen concentration due to strong linear polymerization of the sCD molecules through polycondensation.


2008 ◽  
Vol 5 (5) ◽  
pp. 1164-1167 ◽  
Author(s):  
M. Fernández-Rodríguez ◽  
V. J. Rico ◽  
A. R. González-Elipe ◽  
A. Álvarez-Herrero

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