Covalent polymer functionalization of graphene for improved dielectric properties and thermal stability of epoxy composites

The epoxy nanocomposites filled with 0.1, 0.5, and 1 wt% nanodiamonds (nanoD) were prepared and their properties were compared with neat epoxy network or epoxy nanocomposite filled with 1 wt% multiwalled carbon nanotubes (MWCNTs). The obtained nanoD-epoxy composites increased significantly thermal stability of prepared nanocomposites in comparison with neat epoxy matrix. The exponential decay of light transmittance with increasing concentration of nanoD in sample was observed. The values of storage modulus G` and glass transition temperature Tg significantly decreased by addition of nanoD to epoxy network. This is caused by inhibition of cross-linking reaction of epoxy- and amino- groups by nanoD.

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Significantly enhanced electrical and dielectric properties, and thermal stability of poly(3,4-ethylenedioxythiophene) coated on functionalized multiwalled carbon nanotubes

Synthetic Metals ◽

10.1016/j.synthmet.2020.116572 ◽

2020 ◽

Vol 269 ◽

pp. 116572

Author(s):

Mohsina Taj ◽

S.R. Manohara

Keyword(s):

Carbon Nanotubes ◽

Thermal Stability ◽

Dielectric Properties ◽

Multiwalled Carbon Nanotubes ◽

Multiwalled Carbon ◽

Electrical And Dielectric Properties ◽

Functionalized Multiwalled Carbon Nanotubes ◽

Thermal Stability Of

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The Thermal Stability of Fluorine Doped Silicon Oxide Films Formed by Ecrcvd With SiF4 and O2 Gases

MRS Proceedings ◽

10.1557/proc-443-119 ◽

1996 ◽

Vol 443 ◽

Cited By ~ 3

Author(s):

Seoghyeong Lee ◽

Jae-Yoon Yoo ◽

Jong-Wan Park

Keyword(s):

Thermal Stability ◽

Dielectric Properties ◽

Plasma Treatment ◽

Exposure Time ◽

Moisture Absorption ◽

Silicon Oxide ◽

Reliability Test ◽

Air Exposure ◽

Doped Silicon ◽

Thermal Stability Of

AbstractThe reliability of SiOF films for intermetal dielectrics in multilevel interconnections of ULSIs is investigated. SiOF films were deposited by ECRCVD using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films were carried out in terms of air exposure time. The reliability test of Cu / TiN / SiOF / Si specimen was carried out in terms of temperatures by RTA in N2 ambient. After O2 plasma treatment, no appreciable peak directly related to moisture absorption was detected. The C-V characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu / TiN / SiOF / Si system was found to be reliable up to 600 °C.

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Effect of silica content on thermal stability of fumed silica/epoxy composites

Polymer Degradation and Stability ◽

10.1016/j.polymdegradstab.2008.08.006 ◽

2008 ◽

Vol 93 (12) ◽

pp. 2133-2137 ◽

Cited By ~ 74

Author(s):

J. Tarrío-Saavedra ◽

J. López-Beceiro ◽

S. Naya ◽

R. Artiaga

Keyword(s):

Thermal Stability ◽

Fumed Silica ◽

Silica Content ◽

Epoxy Composites ◽

Thermal Stability Of

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Effects of physicochemical treatments of illite on the thermo-mechanical properties and thermal stability of illite/epoxy composites

Journal of Industrial and Engineering Chemistry ◽

10.1016/j.jiec.2010.10.012 ◽

2011 ◽

Vol 17 (1) ◽

pp. 77-82 ◽

Cited By ~ 16

Author(s):

Euigyung Jeong ◽

Jae Won Lim ◽

Kyeong-won Seo ◽

Young-Seak Lee

Keyword(s):

Mechanical Properties ◽

Thermal Stability ◽

Epoxy Composites ◽

Thermal Stability Of

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Thermal and Mechanical Interfacial Behaviors of Graphene Oxide-Reinforced Epoxy Composites Cured by Thermal Latent Catalyst

Materials ◽

10.3390/ma12081354 ◽

2019 ◽

Vol 12 (8) ◽

pp. 1354 ◽

Cited By ~ 6

Author(s):

Shahina Riaz ◽

Soo-Jin Park

Keyword(s):

Thermal Stability ◽

Fracture Toughness ◽

Graphene Oxide ◽

Mechanical Performance ◽

Gradual Increase ◽

Diglycidyl Ether ◽

Crack Deflection ◽

Epoxy Composites ◽

Curing Agent ◽

Thermal Stability Of

A series of composites was prepared from a diglycidyl ether of bisphenol A (DGEBA) with different graphene filler contents to improve their mechanical performance and thermal stability. Graphene oxide (GO) and GO modified with hexamethylene tetraamine (HMTA) were selected as reinforcing agents. As a latent cationic initiator and curing agent, N-benzylepyrizinium hexafluoroantimonate (N-BPH) was used. The effect of fillers and their contents on the mechanical properties and thermal stability of the composites were studied. Fracture toughness improved by 23% and 40%, and fracture energy was enhanced by 1.94- and 2.27-fold, for the composites containing 0.04 wt.% GO and HMTA-GO, respectively. The gradual increase in fracture toughness at higher filler contents was attributed to both crack deflection and pinning mechanisms. Maximum thermal stability in the composites was achieved by using up to 0.1 wt.% graphene fillers.

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