Delamination behavior and energy release rate evaluation of CFRP/SPCC hybrid laminates under ENF test: Corrected with residual thermal stresses

2020 ◽  
Vol 236 ◽  
pp. 111890 ◽  
Author(s):  
Muhammad Akhsin Muflikhun ◽  
Ryo Higuchi ◽  
Tomohiro Yokozeki ◽  
Takahira Aoki
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Thermal Stresses ◽  
Hybrid Laminates ◽  
Rate Evaluation ◽  
Enf Test ◽  
Delamination Behavior

Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging

2020 ◽  
Vol 2020 (1) ◽  
pp. 000094-000099
Author(s):  
Yuji Okada ◽  
Atsushi Fujii ◽  
Kenta Ono ◽  
Yoshiharu Kariya
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Thermal Stresses ◽  
Material Selection ◽  
Basic Material ◽  
Model Structure ◽  
Critical Energy Release Rate ◽  
Interlayer Dielectric ◽  
Polymer Interface

Abstract In order to improve the performance and reliability of the package, the interlayer dielectric (Polymer) must not be delaminated and materials should not fracture due to thermal stresses during the operation or the manufacturing process. If the reliability of the package can be known in advance by simulation, it can be expected to greatly help in material selection and package design. Firstly, we created material-specific master curves (time–temperature superposition) by considering the measurement results of the Peel Test at the Cu/Polymer interface and the mechanical properties of polymer. The critical Energy Release Rate (𝒢𝒸) could be calculated by its master curve. Secondary, we calculated the Energy Release Rate (𝒢) from Finite Element Analysis (FEA) in the package model structure. Finally, delamination is judged by normalizing 𝒢/𝒢𝒸. This study has made it possible to simulate the delamination possibility of Cu/Polymer interface at arbitrary temperatures and displacement rates from basic material data and FEA analysis of the package model structure.

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

2017 ◽  
Author(s):  
Jing Wang ◽  
Yuling Niu ◽  
Seungbae Park
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Solder Reflow ◽  
Delamination Behavior

In this study, the moisture induced delamination behavior of a plastic ball grid array package under the solder reflow process was investigated by the finite element analysis. The entire moisture history of the PBGA package was simulated for preconditioning at moisture sensitivity level 1 and the subsequent exposure to a soldering reflow. A fracture mechanics based analysis was used to investigate the combined effects of temperature, moisture and vapor pressure on the delamination behavior at the die/molding compound and die/die attach interfaces during solder reflow. For determining the total strain energy release rate and total stress intensity factor under a multiphysics environment like reflow, researchers commonly used the principle of superposition to combine the results from individual thermal stress, hygroscopic stress and vapor pressure induced stress analyses. In this study, a new method was proposed to obtain the total strain energy release rate and total stress intensity factor under the multi-physics environment in a single fracture analysis instead of three. Two different methods-virtual crack closure technique (VCCT) and crack tip opening displacement method (CTOD) were employed and compared in studying the variation of strain energy release rates during lead-free solder reflow. The relationship between the strain energy release rate and crack length was also obtained. The developments of the stress intensity factors due to individual effect of thermal mismatch, hygroscopic swelling and vapor pressure were calculated. The mode mixity was also determined under different temperatures and crack length.

scholarly journals Energy release rate in the presence of residual and thermal stresses

2015 ◽  
Vol 59 ◽  
pp. 73-78 ◽  
Author(s):  
Jeong Soon Park ◽  
Young Hwan Choi ◽  
Jungdo Kim ◽  
Seyoung Im
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Thermal Stresses

An Application of Finite Element-Based Fracture Mechanics Analysis to Cord-Rubber Structures

1996 ◽  
Vol 24 (3) ◽  
pp. 220-235 ◽  
Author(s):  
T. G. Ebbott
Keyword(s):  
Finite Element ◽  
Energy Release Rate ◽  
Energy Release ◽  
Crack Growth ◽  
Release Rate ◽  
Fatigue Behavior ◽  
Internal Crack ◽  
Materials Testing ◽  
Element Analysis ◽  
Rate Evaluation

Abstract A finite element-based method to analyze the severity of internal cracks in cord-rubber structures is presented. The method includes materials testing to characterize rubber fatigue behavior, a global-local finite element analysis to provide the detail necessary to model explicitly an internal crack, and use of the J-integral and virtual crack closure techniques for energy release rate evaluation. Analysis of the multiaxial and cyclic fracture situation is carried out by considering the cycle of each mode of fracture separately and then combining the effect of each mode to determine the total effect. Crack growth rates in the structure are assumed to be the same as the crack growth rate in a laboratory specimen at the same level of cyclic energy release rate. Results are presented for a material change in a critical tire region.

scholarly journals Analytical Fracture Mechanics Analysis of the Pull-Out Test Including the Effects of Friction and Thermal Stresses

2000 ◽  
Vol 9 (6) ◽  
pp. 096369350000900 ◽  
Author(s):  
John A. Nairn
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Thermal Stresses ◽  
Interfacial Crack ◽  
Single Fibre ◽  
Finite Elements Analysis ◽  
Accurate Analysis ◽  
Pull Out ◽  
Microbond Test

The energy release rate for propagation of a debond in a single-fibre pull out test was derived analytically. The key finding was that an accurate analysis can be derived by a global energy analysis that includes effects of residual stresses and interfacial friction but does not need to include the details of the stress state at the interfacial crack tip. By comparison to finite elements analysis, it was verified that the analytical results are very accurate provided the debond tip is not too close to either end of the specimen. By casting the results in terms of net-specimen stress, it was possible to derive a general energy release rate result that applies to both the pull-out test and the related microbond test. The energy release rate expressions can be used to determine interfacial fracture toughness from single-fibre pull-out tests or microbond tests.

Fracture Mechanics of Composites With Residual Thermal Stresses

1997 ◽  
Vol 64 (4) ◽  
pp. 804-810 ◽  
Author(s):  
J. A. Nairn
Keyword(s):  
Residual Stresses ◽  
Boundary Conditions ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Thermal Stresses ◽  
Double Cantilever Beam ◽  
Effective Properties ◽  
Displacement Boundary ◽  
Effective Mechanical Properties

The problem of calculating the energy release rate for crack growth in an arbitrary composite in the presence of residual stresses is considered. First, a general expression is given for arbitrary, mixed traction, and displacement boundary conditions. This general result is then applied to a series of specific problems including statistically homogeneous composites under traction or displacement boundary conditions, delamination of double cantilever beam specimens, and microcracking in the transverse plies of laminates. In many examples, the energy release rate in the presence of residual stresses can be reduced to finding the effect of damage on the effective mechanical properties of the composite. Because these effective properties can be evaluated by isothermal stress analysis, the effect of residual stresses on the energy release rate can be evaluated without recourse to any thermal elasticity stress analyses.

Characterization of the Bonded Connection in Hybrid-Steel-GFRP-Laminates

2017 ◽  
Vol 742 ◽  
pp. 408-415 ◽  
Author(s):  
Arne Busch ◽  
Robert Brandt
Keyword(s):  
Energy Release Rate ◽  
Glass Fiber ◽  
Energy Release ◽  
Release Rate ◽  
Lightweight Design ◽  
Quantitative Description ◽  
High Strength ◽  
Reinforced Plastics ◽  
Hybrid Laminates ◽  
Functional Components

Intrinsic hybrid laminates are well established since many years in aerospace engineering, e.g. Glass Laminate Aluminium Reinforced Epoxy (GLARE) is widely used as a substitute for aluminium sheets of the outer shell of modern aircrafts. The reduction of density and an increased stiffness by compounding glass fiber and aluminium makes GLARE advantageous. Driven by environmental protection acts and the need for lightweight design material compounds attract more awareness in the automotive engineering as well. Functional components like chassis springs are well predestined for the application of glass fiber reinforced plastics (GFRP). Therefore, an intrinsic hybrid made up by GFRP and a high strength steel has recently been developed and characterized. This investigation sets the focus on the interface between GFRP and steel. Double cantilever beam tests (mode I) and shear tests (mode II) are conducted in order to measure the energy release rate and the shear strength of the considered interface. A variety of surface treatments of steel layer has been characterized by this approach. The results show up that good adhesion can be achieved by silane and titanium dioxide primers, however, the variation within the data is significantly higher than for other surface treatment variants. Furthermore, the increase of the energy release rate by fiber bridging effects is considered as well and an approach for its quantitative description by a power law is presented.

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