The effect of substrate surface roughness on the nucleation of cubic boron nitride films

2006 ◽  
Vol 15 (1) ◽  
pp. 55-60 ◽  
Author(s):  
C.Y. Chan ◽  
S. Eyhusen ◽  
X.M. Meng ◽  
I. Bello ◽  
S.T. Lee ◽  
...  
2006 ◽  
Vol 100 (1) ◽  
pp. 014909 ◽  
Author(s):  
X. T. Zhou ◽  
T. K. Sham ◽  
C. Y. Chan ◽  
W. J. Zhang ◽  
I. Bello ◽  
...  

1993 ◽  
Vol 316 ◽  
Author(s):  
T. A. Friedmann ◽  
D. L. Medlin ◽  
P. B. Mirkarimi ◽  
K. F. McCarty ◽  
E. J. Klaus ◽  
...  

ABSTRACTWe are studying the boron nitride system by using a pulsed excimer laser to ablate from hexagonal BN (hBN) targets to form cubic BN (cBN) films. We are depositing BN films on heated (25 - 800°C) Si (100) surfaces and are using a broad-beam ion source operated with Ar and N2 source gasses to produce BN films with a high percentage of sp3-bonded cBN. In order to understand and optimize the growth and nucleation of cBN films, parametric studies of the growth parameters have been performed. The best films to date show >85% sp3-bonded BN as determined from Fourier-transform infrared (FTIR) reflection spectroscopy. High resolution transmission electron microscopy (TEM) and selected area electron diffraction confirm the presence of cBN in these samples. The films are polycrystalline and show grain sizes up to 30- 40 nm. We find from both the FTIR and TEM analyses that the cBN content in these films evolves with growth time. Initially, the films are deposited as hBN and the cBN nucleates on this hBN underlayer. Importantly, the position of the cBN IR phonon also changes with growth time. Initially this mode appears near 1130 cm-1 and the position decreases with growth time to a constant value of 1085 cm-1. Since in bulk cBN this IR mode appears at 1065 cm-1, a large compressive stress induced by the ion bombardment is suggested. In addition, we report on the variation in cBN percentage with temperature.


2002 ◽  
Vol 16 (06n07) ◽  
pp. 952-957 ◽  
Author(s):  
D. Sheeja ◽  
B. K. Tay ◽  
H. M. Lam ◽  
S. K. Ng

The Co-Cr-Mo alloy is extensively used for tribological applications, including orthopaedic components in total joint replacements. High quality diamond-like carbon (DLC) coatings on metal/alloy substrates are of great interest as they are able to protect them from severe wear and thus prolong the life span of the component. Since the roughness of the metal/alloy varies depending on the applications, a study has been carried out to investigate the effect of substrate surface roughness on the microstructure, sliding life, wear-resistance, coefficient of friction, adhension and hardness of DLC coatings prepared on Co-Cr-Mo alloy substrates under the same deposition condition. The microstructure of the films studied using Raman spectroscopy suggests that the film prepared on a smoother surface contains slightly higher fraction of sp 3 bonded carbon atoms. The characterization using a pin-on-disk tribometer reveals that, the film prepared on the roughest sample (Ra ~ 0.06 μm) exhibits a very short life span of about 20 cycles compared to the film that is prepared on a relatively smoother surface (Ra ~ 0.02 μm), which exhibits a life span of about 340,000 cycles. In order to investigate the origin of this improved property of the DLC film on the smoother surface, adhesive strength and hardness of the films were studied by using a micro-scratch tester and a Nano-indenter, respectively. The results suggest that the film prepared on the smoother surface exhibits better adhesion (higher critical load) and relatively higher hardness.


2010 ◽  
Vol 132 (4) ◽  
Author(s):  
K. N. Prabhu ◽  
G. Kumar

The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn–37Pb, Sn–3.5Ag, and Sn–9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented by the exponential power law (EPL): ϕ=exp(−Kτn). The EPL parameter K has the significance of accelerating the kinetics of relaxation while the parameter n represents the resistance to spreading process (spread resistance parameter). EPL parameters exhibited a decreasing trend with an increase in surface roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems.


2006 ◽  
Vol 55 (10) ◽  
pp. 5441
Author(s):  
Tian Ling ◽  
Ding Yi ◽  
Chen Hao ◽  
Liu Jun-Kai ◽  
Deng Jin-Xiang ◽  
...  

1997 ◽  
Vol 295 (1-2) ◽  
pp. 137-141 ◽  
Author(s):  
Yukiko Yamada ◽  
Yoshinao Tatebayashi ◽  
Osamu Tsuda ◽  
Toyonobu Yoshida

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