High strength and electrical conductivity of copper matrix composites reinforced by carbon nanotube-graphene oxide hybrids with hierarchical structure and nanoscale twins

Abstract Copper matrix composites reinforced with 1, 3, 5, 7 vol.% Cu-coated SiC whiskers of consistent orientation (SiCw/Cu) were prepared by powder metallurgy and hot extrusion. The microstructure of composites was investigated by scanning electron microscopy. The SiC whiskers were arranged along the direction of hot extrusion and distributed uniformly. The composites were fabricated into specimens with different whisker orientations, and their electrical conductivity was tested. The effects of SiC whiskers orientation and content on the electrical conductivity of composites were investigated through experiment. Results show that the SiC whiskers content was the major factor affecting the electrical conductivity of the composites. With increasing SiC whisker orientations angel, the electrical conductivity of composites is improved. The electrical conductivity model has been established by taking into account the SiC whiskers content, whisker orientation and microstructure parameters, and the results were in good agreement with experimental data. Graphical abstract: Copper matrix composites reinforced with SiC whiskers of consistent orientation were prepared. The orientation of SiC whiskers changes from 0∘ to 90∘, resulting in electrical conductivity anisotropy of composites.

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Preparation of Ag/reduced graphene oxide reinforced copper matrix composites through spark plasma sintering: An investigation of microstructure and mechanical properties

Ceramics International ◽

10.1016/j.ceramint.2020.02.142 ◽

2020 ◽

Vol 46 (9) ◽

pp. 13569-13579 ◽

Cited By ~ 2

Author(s):

Reza sayyad ◽

Mohammad Ghambari ◽

Touradj Ebadzadeh ◽

Amir Hossein Pakseresht ◽

Ehsan Ghasali

Keyword(s):

Mechanical Properties ◽

Graphene Oxide ◽

Reduced Graphene Oxide ◽

Spark Plasma Sintering ◽

Copper Matrix ◽

Matrix Composites ◽

Copper Matrix Composites ◽

Plasma Sintering ◽

Reduced Graphene ◽

Spark Plasma

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Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.79-82.1579 ◽

2009 ◽

Vol 79-82 ◽

pp. 1579-1582

Author(s):

Chang Chun Wang ◽

Guang Hui Min ◽

Suk Bong Kang

Keyword(s):

Electrical Conductivity ◽

Hot Pressing ◽

Coating Layer ◽

Annealing Treatment ◽

Copper Matrix ◽

Matrix Composites ◽

Copper Matrix Composites ◽

Conducting Property ◽

Reinforcement Content ◽

Electrical Conducting

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.

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