Influence of dispersion state of carbon nanotubes on electrical conductivity of copper matrix composites

2018 ◽  
Vol 752 ◽  
pp. 376-380 ◽  
Author(s):  
Ping Yang ◽  
Xin You ◽  
Jianhong Yi ◽  
Dong Fang ◽  
Rui Bao ◽  
...  
2011 ◽  
Vol 391-392 ◽  
pp. 524-529 ◽  
Author(s):  
Wen Liang Chen ◽  
Chun Ping Huang ◽  
Li Ming Ke

Carbon nanotubes(CNTs) reinforced copper matrix composites were successfully produced by Friction Stir Processing (FSP). The effect of applying multiple FSP passes on the forming of composites was studied, the microstructure, microhardness and conductivity of the good forming composite were analyzed. The experimental results showed that CNTs uniformly distributed and good forming composite can be obtained by three FSP passes. Compared to the parent material, the grain size of the composite has significantly refined, and the microhardness of the composite has also greatly improved, but the conductivity of the composite has a small decrease.


2020 ◽  
Vol 7 (1) ◽  
pp. 015069
Author(s):  
Luong Van Duong ◽  
Nguyen Van Luan ◽  
Nguyen Ngoc Anh ◽  
Tran Bao Trung ◽  
Le Danh Chung ◽  
...  

2019 ◽  
Vol 8 (1) ◽  
pp. 285-292 ◽  
Author(s):  
Jiang Feng ◽  
Shuhua Liang ◽  
Xiuhua Guo ◽  
Yi Zhang ◽  
Kexing Song

Abstract Copper matrix composites reinforced with 1, 3, 5, 7 vol.% Cu-coated SiC whiskers of consistent orientation (SiCw/Cu) were prepared by powder metallurgy and hot extrusion. The microstructure of composites was investigated by scanning electron microscopy. The SiC whiskers were arranged along the direction of hot extrusion and distributed uniformly. The composites were fabricated into specimens with different whisker orientations, and their electrical conductivity was tested. The effects of SiC whiskers orientation and content on the electrical conductivity of composites were investigated through experiment. Results show that the SiC whiskers content was the major factor affecting the electrical conductivity of the composites. With increasing SiC whisker orientations angel, the electrical conductivity of composites is improved. The electrical conductivity model has been established by taking into account the SiC whiskers content, whisker orientation and microstructure parameters, and the results were in good agreement with experimental data. Graphical abstract: Copper matrix composites reinforced with SiC whiskers of consistent orientation were prepared. The orientation of SiC whiskers changes from 0∘ to 90∘, resulting in electrical conductivity anisotropy of composites.


2009 ◽  
Vol 79-82 ◽  
pp. 1579-1582
Author(s):  
Chang Chun Wang ◽  
Guang Hui Min ◽  
Suk Bong Kang

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.


2017 ◽  
Vol 696 ◽  
pp. 80-89 ◽  
Author(s):  
Hu Wang ◽  
Zhao-Hui Zhang ◽  
Hong-Mei Zhang ◽  
Zheng-Yang Hu ◽  
Sheng-Lin Li ◽  
...  

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