Thermoelectric water-cooling device applied to electronic equipment

The finite element model (FE) of temperature field of straight thin-walled samples in laser cladding IN718 was established, and the growth of microstructure was simulated by cellular automata (CA) method through macro-micro coupling (CA-FE). The effects of different cooling conditions on microstructure, hardness, and properties of laser-cladding layer were studied by designing cooling device. The results show that the simulation results are in good agreement with the microstructure of the cladding layer observed by the experiment. With the scanning strategy of reducing laser power layer-by-layer, the addition of water cooling device and the processing condition of 0.7 mm Z-axis lift, excellent thin-walled parts can be obtained. With the increase of cladding layers, the pool volume increases, the temperature value increases, the temperature gradient, cooling rate, solidification rate, K value gradually decrease, and eventually tend to be stable, in addition, the hardness shows a fluctuating downward trend. Under the processing conditions of layer-by-layer power reduction and water cooling device, the primary dendrite arm spacing reduced to about 8.3 μm, and the average hardness at the bottom of cladding layer increased from 260 HV to 288 HV. The yield strength and tensile strength of the tensile parts prepared under forced water cooling increased to a certain extent, while the elongation slightly decreased.

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Diode-Pumped Yb:YAG Thin Disk Laser with a Novel Multi-Pass Pump and Cooling Arrangement

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.423-426.2074 ◽

2013 ◽

Vol 423-426 ◽

pp. 2074-2077

Author(s):

Qiong Ge Song ◽

Guang Hua Cheng ◽

Jiang Feng Zhu

Keyword(s):

Resonant Cavity ◽

Thin Disk ◽

Water Cooling ◽

Recycle Water ◽

Cooling Device ◽

Spherical Lens ◽

Pump System ◽

Disk Laser ◽

Thin Disk Laser ◽

Diode Pumped

We demonstrate a Yb:YAG thin disk laser with multi-pass diode-pumped structure and direct water cooling device. In the pump system, four passes of the pump radiation are focused on the thin disk using a center-punched spherical lens. The thin disk serves as the window of a copper tank and is directly cooled with recycle water-contacted method. The thin disk laser has a low pump at the threshold of operation. We obtained 450 mW output power around 1030 nm in a simple F-P resonant cavity.

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J0610102 Investigation of Cooling Performance of Water Cooling Device with Micro Fin Array

The Proceedings of Mechanical Engineering Congress Japan ◽

10.1299/jsmemecj.2015._j0610102- ◽

2015 ◽

Vol 2015 (0) ◽

pp. _J0610102--_J0610102-

Author(s):

Kazuma OBATA ◽

Takashi FUKUE ◽

Koichi HIROSE ◽

Mamoru KIKUCHI ◽

Yasuhiko UEDA ◽

...

Keyword(s):

Water Cooling ◽

Cooling Device ◽

Cooling Performance

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Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Journal of Electronic Packaging ◽

10.1115/1.4002012 ◽

2010 ◽

Vol 132 (3) ◽

Cited By ~ 29

Author(s):

Yueguang Deng ◽

Jing Liu

Keyword(s):

Heat Flux ◽

Liquid Metal ◽

Thermal Resistance ◽

High Performance ◽

Heat Dissipation ◽

High Heat ◽

High Heat Flux ◽

Water Cooling ◽

Cooling Device ◽

Liquid Metal Cooling

Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.

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Application of Micro-Tube Water-Cooling Device for the Improvement of Heat Management in Mixed White Light Emitting Diode Modules

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.308-310.2422 ◽

2011 ◽

Vol 308-310 ◽

pp. 2422-2427 ◽

Cited By ~ 3

Author(s):

Maw Tyan Sheen ◽

Ming Der Jean ◽

Yu Tsun Lai

Keyword(s):

Thermal Management ◽

White Light ◽

Heat Dissipation ◽

Cooling System ◽

Light Emitting Diode ◽

Thermal Dissipation ◽

Water Cooling ◽

Cooling Device ◽

Heat Management ◽

Light Emitting

This paper introduces a module using the RGB-based LED design to improve the thermal management of a mixied white light LED and describes a system for heat dissipation in illuminated, high-power LED arrays. Mixed light LEDs can be produced by combining appropriate amounts of light from the red, green and blue LEDs in an array. A LED cooling system, using a micro- tube water-cooling device, was fabricated. Recycling water in the system, gave more efficient convection and the heat created by the LEDs was easily removed, in the experiments. It was shown that micro-tube water-cooling systems rendered an improvement in thermal management that effectively decreases the thermal resistance and provides very good thermal dissipation. Furthermore, the results of experiment and simulation demonstrated that a micro-tube water-cooling system is very effective in heat dissipation in LEDs and the fabrication of practical micro-water tube cooling devices for mixing light LEDs was feasible and useful

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A Study on Micro Water-Cooling Device

The Proceedings of Conference of Hokkaido Branch ◽

10.1299/jsmehokkaido.2003.43.92 ◽

2003 ◽

Vol 2003.43 (0) ◽

pp. 92-93

Author(s):

Masahiro IKEGAWA ◽

Masahiko YAMADA ◽

Tomoo HAYASHI ◽

Taiga TAKAHASHI

Keyword(s):

Water Cooling ◽

Cooling Device

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Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Volume 1: Thermal Management ◽

10.1115/ipack2015-48607 ◽

2015 ◽

Cited By ~ 1

Author(s):

Kazuma Obata ◽

Takashi Fukue ◽

Koichi Hirose ◽

Mamoru Kikuchi ◽

Yasuhiko Ueda ◽

...

Keyword(s):

Electric Vehicles ◽

Heat Sink ◽

Heat Dissipation ◽

Vortex Generator ◽

Heat Sinks ◽

Vortex Generators ◽

Water Cooling ◽

Power Devices ◽

Cooling Device ◽

Flow Passage

This study describes a possibility of an improvement of water cooling devices for high-power electronic devices such as inverters for electric vehicles by using a combination of micro heat sinks and miniature vortex generators. Power devices such as IGBT (Insulated Gate Bipolar Transistor) are widely used for controlling an operation of electronic vehicles and hybrid vehicles. Due to the improvement of the performance of the power devices, the heat dissipation density from these devices becomes higher. The water cooling is the commonest method for dissipating heat from the inverter of the electronic vehicles. Therefore the improvement of the water cooling technology is significantly needed in order to manage the increase of the heat dissipation density. We are now trying to develop a high-performance water cooling device for dissipating the high heat flux from the inverters in the electric vehicles by using a combination of a fine miniature heat sink and a miniature vortex generator. The combination of the miniature heat sink and the vortex generator may increase heat transfer performance of the heat exchanger while inhibiting an increase of pressure drop by generating a swirling turbulent flow in a clearance between the heat sink fins. In this study, the water cooling performance in the narrow flow passage, which simulates the flow passage in the water cooling device, with the miniature heat sink and the miniature vortex generators was investigated by using 3-dimentional CFD analysis. From the analysis, we conclude that the combination of the miniature heat sink and the vortex generator was effective for the heat transfer enhancement in the narrow flow passage of the water cooling device while inhibiting the generation of the pressure drop when we can use the combination with the appropriate manner.

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