J0610102 Investigation of Cooling Performance of Water Cooling Device with Micro Fin Array

2015 ◽  
Vol 2015 (0) ◽  
pp. _J0610102--_J0610102-
Author(s):  
Kazuma OBATA ◽  
Takashi FUKUE ◽  
Koichi HIROSE ◽  
Mamoru KIKUCHI ◽  
Yasuhiko UEDA ◽  
...  
Keyword(s):  
Water Cooling ◽  
Cooling Device ◽  
Cooling Performance

scholarly journals Effect of Cooling Method on Formability of Laser Cladding IN718 Alloy

Materials ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3734
Author(s):  
Jianyu Yang ◽  
Xudong Li ◽  
Fei Li ◽  
Wenxiao Wang ◽  
Zhijie Li ◽  
...  
Keyword(s):  
Laser Cladding ◽  
Primary Dendrite ◽  
Solidification Rate ◽  
Processing Condition ◽  
Layer By Layer ◽  
Water Cooling ◽  
Cooling Device ◽  
K Value ◽  
Cladding Layer ◽  
Thin Walled

The finite element model (FE) of temperature field of straight thin-walled samples in laser cladding IN718 was established, and the growth of microstructure was simulated by cellular automata (CA) method through macro-micro coupling (CA-FE). The effects of different cooling conditions on microstructure, hardness, and properties of laser-cladding layer were studied by designing cooling device. The results show that the simulation results are in good agreement with the microstructure of the cladding layer observed by the experiment. With the scanning strategy of reducing laser power layer-by-layer, the addition of water cooling device and the processing condition of 0.7 mm Z-axis lift, excellent thin-walled parts can be obtained. With the increase of cladding layers, the pool volume increases, the temperature value increases, the temperature gradient, cooling rate, solidification rate, K value gradually decrease, and eventually tend to be stable, in addition, the hardness shows a fluctuating downward trend. Under the processing conditions of layer-by-layer power reduction and water cooling device, the primary dendrite arm spacing reduced to about 8.3 μm, and the average hardness at the bottom of cladding layer increased from 260 HV to 288 HV. The yield strength and tensile strength of the tensile parts prepared under forced water cooling increased to a certain extent, while the elongation slightly decreased.

scholarly journals Thermoelectric water-cooling device applied to electronic equipment

2010 ◽  
Vol 37 (2) ◽  
pp. 140-146 ◽  
Author(s):  
Hsiang-Sheng Huang ◽  
Ying-Che Weng ◽  
Yu-Wei Chang ◽  
Sih-Li Chen ◽  
Ming-Tsun Ke
Keyword(s):  
Electronic Equipment ◽  
Water Cooling ◽  
Cooling Device

Diode-Pumped Yb:YAG Thin Disk Laser with a Novel Multi-Pass Pump and Cooling Arrangement

2013 ◽  
Vol 423-426 ◽  
pp. 2074-2077
Author(s):  
Qiong Ge Song ◽  
Guang Hua Cheng ◽  
Jiang Feng Zhu
Keyword(s):  
Resonant Cavity ◽  
Thin Disk ◽  
Water Cooling ◽  
Recycle Water ◽  
Cooling Device ◽  
Spherical Lens ◽  
Pump System ◽  
Disk Laser ◽  
Thin Disk Laser ◽  
Diode Pumped

We demonstrate a Yb:YAG thin disk laser with multi-pass diode-pumped structure and direct water cooling device. In the pump system, four passes of the pump radiation are focused on the thin disk using a center-punched spherical lens. The thin disk serves as the window of a copper tank and is directly cooled with recycle water-contacted method. The thin disk laser has a low pump at the threshold of operation. We obtained 450 mW output power around 1030 nm in a simple F-P resonant cavity.

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Yueguang Deng ◽  
Jing Liu
Keyword(s):  
Heat Flux ◽  
Liquid Metal ◽  
Thermal Resistance ◽  
High Performance ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Water Cooling ◽  
Cooling Device ◽  
Liquid Metal Cooling

Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.

Development of Heat Sinks for Air Cooling and Water Cooling Using Lotus-Type Porous Metals

2011 ◽  
Author(s):  
H. Chiba ◽  
T. Ogushi ◽  
H. Nakajima
Keyword(s):  
Heat Transfer ◽  
Porous Materials ◽  
Heat Sink ◽  
High Heat ◽  
Heat Sinks ◽  
Air Cooling ◽  
Water Cooling ◽  
Cooling Performance ◽  
High Heat Transfer ◽  
Micro Channels

In recent years, since heat dissipation rates and high frequency electronic devices have been increasing, a heat sink with high heat transfer performance is required to cool these devices. Heat sink utilizing micro-channels with several ten microns are expected to provide an excellent cooling performance because of their high heat transfer capacities due to small channel. Therefore, various porous materials such as cellular metals have been investigated for heat sink applications. However, heat sink using conventional porous materials has a high pressure drop because the cooling fluid flow through the pores is complex. Among the described porous materials, a lotus-type porous metal with straight pores is preferable for heat sinks due to the small pressured drop. In present work, cooling performance of the lotus copper heat sink for air cooling and water cooling is introduced. The experimental data for air cooling show 13.2 times higher than that for the conventional groove fins. And, the data for the water cooling show 1.7 times higher than that for the micro-channels. It is concluded that lotus copper heat sink is the most prospective candidate for high power electronics devices.

Study on Model Parameters of Focal Cooling Device Using a Peltier Element for a Living Body

2016 ◽  
Author(s):  
Kenyu Uehara ◽  
Kentaro Miyago ◽  
Koji Mori ◽  
Takashi Saito
Keyword(s):  
Control Function ◽  
Internal Resistance ◽  
Model Parameters ◽  
Cooling Device ◽  
Peltier Element ◽  
Cooling Performance ◽  
Living Body ◽  
Dependent Relation ◽  
Focal Cooling ◽  
Parameter Values

Cooling treatment is known as one of the effective treatment for injury. It has an optimum cooling temperature level depending on a symptom or an injury. Hence a highly precise temperature control function is required for a cooling device for this kind of treatment. A mathematical model of cooling device using a Peltier element is necessary to realize its functions. In this paper, we examined the characteristics of model parameters by identification experimentally and comparison of its values. Three cooling devices (A, B and C) were used. A Peltier element of device A and device B were the same size with different cooling performance respectively. Whereas a Peltier element of device C was bigger than the two devices. Effects of devices size and cooling performance on the model parameters were investigated. It is shown that most of the parameter values were increased in the device C. The Seebeck coefficient and the internal resistance had little dependent relation with the device size while the other heat conductances were strongly dependence upon the size. From these results, the characteristics of each parameters became mostly evident by comparison of three devices of different sizes and cooling performances. However, it is required to analyze more and utilize different devices to carry out the development of cooling device by using this model.

Application of Micro-Tube Water-Cooling Device for the Improvement of Heat Management in Mixed White Light Emitting Diode Modules

2011 ◽  
Vol 308-310 ◽  
pp. 2422-2427 ◽  
Author(s):  
Maw Tyan Sheen ◽  
Ming Der Jean ◽  
Yu Tsun Lai
Keyword(s):  
Thermal Management ◽  
White Light ◽  
Heat Dissipation ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Thermal Dissipation ◽  
Water Cooling ◽  
Cooling Device ◽  
Heat Management ◽  
Light Emitting

This paper introduces a module using the RGB-based LED design to improve the thermal management of a mixied white light LED and describes a system for heat dissipation in illuminated, high-power LED arrays. Mixed light LEDs can be produced by combining appropriate amounts of light from the red, green and blue LEDs in an array. A LED cooling system, using a micro- tube water-cooling device, was fabricated. Recycling water in the system, gave more efficient convection and the heat created by the LEDs was easily removed, in the experiments. It was shown that micro-tube water-cooling systems rendered an improvement in thermal management that effectively decreases the thermal resistance and provides very good thermal dissipation. Furthermore, the results of experiment and simulation demonstrated that a micro-tube water-cooling system is very effective in heat dissipation in LEDs and the fabrication of practical micro-water tube cooling devices for mixing light LEDs was feasible and useful

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