A new scheme for reducing pressure drop and thermal resistance simultaneously in microchannel heat sinks with wavy porous fins

2017 ◽  
Vol 111 ◽  
pp. 1071-1078 ◽  
Author(s):  
Gui Lu ◽  
Jun Zhao ◽  
Lin Lin ◽  
Xiao-Dong Wang ◽  
Wei-Mon Yan
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sinks ◽  
Microchannel Heat Sinks ◽  
Porous Fins

scholarly journals Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes

Entropy ◽  
2018 ◽  
Vol 21 (1) ◽  
pp. 16 ◽  
Author(s):  
Daxiang Deng ◽  
Guang Pi ◽  
Weixun Zhang ◽  
Peng Wang ◽  
Ting Fu
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Numerical Study ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Pumping Power ◽  
Cross Sectional ◽  
Prime Concern ◽  
Microchannel Heat Sinks

This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.

A Numerical Parametric Study of Flow and Heat Transfer in Circular and Zig-Zag Square Microchannel Heat Sinks

2016 ◽  
Author(s):  
Wenming Li ◽  
Fanghao Yang ◽  
Tamanna Alam ◽  
Congcong Ren
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Parametric Study ◽  
Orientation Angle ◽  
Hydraulic Diameter ◽  
Heat Sinks ◽  
Microchannel Heat Sinks ◽  
Circular Microchannel ◽  
Square Microchannel ◽  
Numerical Parametric Study

This paper aims to study the overall performance of circular and zig-zag square microchannel heat sinks with single phase liquid flow via a numerical parametric study. Thermal resistance and pressure drop when subjected to key geometric parameters such as hydraulic diameter, orientation, and connector length is numerically investigated with Reynolds number ranging from 50 to 500. Specifically, the hydraulic diameter is varied from 100 μm to 300 μm with an increment of 100 μm; the orientation angle of 10°, 20° and 30° is studied. A figure of merit (FOM) involving both the thermal resistance and pressure drop is introduced to evaluate the performance. Results show that hydraulic diameter is critical to thermal resistance and pressure drop compared to orientation angle. Zig-zag microchannel heat sink shows better performance compared with heat sinks with circular microchannel. FOM varies considerably with the change in hydraulic diameter and flow rate.

Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling

2005 ◽  
Vol 2 (2) ◽  
pp. 122-131
Author(s):  
Pradeep Hegde ◽  
K.N. Seetharamu ◽  
P.A. Aswatha Narayana ◽  
Zulkifly Abdullah
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Two Phase Flow ◽  
Heat Sinks ◽  
Phase Flow ◽  
Pumping Power ◽  
Two Phase ◽  
Microchannel Heat Sinks

Stacked microchannel heat sinks with two-phase flow have been analyzed using the Finite Element Method (FEM). The present method is a simple and practical approach for analyzing the thermal performance of single or multi layered microchannel heat sinks with either single or two-phase flow. A unique 10 noded finite element is used for the channel discretization. Two-phase thermal resistance, pressure drop and pumping power of single, double and triple stack microchannel heat sinks are determined at different base heat fluxes ranging from 150 W/cm2 to 300 W/cm2. The temperature distribution along the length of the microchannel is also plotted. It is found that stacked microchannel heat sinks with two-phase flow are thermally more efficient than two-phase single layer microchannel heat sinks, both in terms of thermal resistance and pumping power requirements. It is observed that the thermal resistance of a double stack microchannel heat sink with two-phase flow is about 40% less than that for a single stack heat sink. A triple stack heat sink yields a further 20% reduction in the thermal resistance and at the same time operates with about 30% less pumping power compared to a single stack heat sink. The effect of channel aspect ratio on the thermal resistance and pressure drop of stacked microchannel heat sinks with two-phase flow are also studied.

Flow Maldistribution Effects on the Temperature Uniformity in Double-Layered Microchannel Heat Sinks

2019 ◽  
Author(s):  
Carlo Nonino ◽  
Stefano Savino
Keyword(s):  
Thermal Resistance ◽  
Flow Rate ◽  
Heat Exchangers ◽  
Total Mass ◽  
Cross Flow ◽  
Heat Sinks ◽  
Temperature Uniformity ◽  
Inlet Velocity ◽  
Microchannel Heat Sinks ◽  
Flow Maldistribution

Abstract A numerical investigation is carried out on the effects of flow maldistribution on the temperature uniformity and overall thermal resistance in double-layered microchannel heat sinks. Different flow maldistribution models accounting for the effects of some typical header designs are considered together with different combinations of the average inlet velocity in the two layers of microchannels for a given total mass flow rate. The numerical simulations are carried out using an in-house FEM procedure previously developed by the authors for the analysis of cross-flow microchannel heat exchangers.

Microchannel Size Effects on Two-Phase Local Heat Transfer and Pressure Drop in Silicon Microchannel Heat Sinks With a Dielectric Fluid

2007 ◽  
Author(s):  
Tannaz Harirchian ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Flow Boiling ◽  
Heat Sinks ◽  
Dielectric Fluid ◽  
Two Phase ◽  
Microchannel Heat Sinks ◽  
The Heat Transfer Coefficient

Two-phase heat transfer in microchannels can support very high heat fluxes for use in high-performance electronics-cooling applications. However, the effects of microchannel cross-sectional dimensions on the heat transfer coefficient and pressure drop have not been investigated extensively. In the present work, experiments are conducted to investigate the local flow boiling heat transfer in microchannel heat sinks. The effect of channel size on the heat transfer coefficient and pressure drop is studied for mass fluxes ranging from 250 to 1600 kg/m2s. The test sections consist of parallel microchannels with nominal widths of 100, 250, 400, 700, and 1000 μm, all with a depth of 400 μm, cut into 12.7 mm × 12.7 mm silicon substrates. Twenty-five microheaters embedded in the substrate allow local control of the imposed heat flux, while twenty-five temperature microsensors integrated into the back of the substrates enable local measurements of temperature. The dielectric fluid Fluorinert FC-77 is used as the working fluid. The results of this study serve to quantify the effectiveness of microchannel heat transport while simultaneously assessing the pressure drop trade-offs.

Designs of Multiple Microchannel Heat Transfer Systems

2011 ◽  
Author(s):  
Jingru Zhang ◽  
Po Ting Lin ◽  
Yogesh Jaluria
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Optimization Problems ◽  
Numerical Models ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Channel Height ◽  
Physical Constraints ◽  
Temperature And Pressure

In this paper, two different configurations of multiple microchannel heat sinks with fluid flow are investigated for electronic cooling: straight and U-shaped channel designs. Numerical models are utilized to study the multiphysics behavior in the microchannels and validated by comparisons with experimental results. Three responses, including thermal resistance, pressure drop, and maximum temperature, are parametrically modeled with respect to various variables such as dimensions of the channels, total number of channels, and flow rate. Multi-objective optimization problems, which minimize the thermal resistance and the pressure drop simultaneously, are formulated and studied. Physical constraints in terms of channel height, maximum temperature, and pressure are further investigated. The Pareto frontiers are studied and the trade-off behavior between the thermal resistance and the pressure drop are discussed.

Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Gongnan Xie ◽  
Jian Liu ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Reynolds Number ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Cross Section ◽  
Thermal Performance ◽  
Heat Load ◽  
Rectangular Cross Section ◽  
Flow Direction ◽  
Heat Sinks ◽  
Liquid Cooling

Liquid cooling incorporating microchannels are used to cool electronic chips in order to remove more heat load. However, such microchannels are often designed to be straight with rectangular cross section. In this paper, on the basis of straight microchannels having rectangular cross section (SRC), longitudinal-wavy microchannel (LWC), and transversal microchannel (TWC) were designed, respectively, and then the corresponding laminar flow and heat transfer were investigated numerically. Among them, the channel wall of LWC undulates along the flow direction according to a sinusoidal function while the TWC undulates along the transversal direction. The numerical results show that for removing an identical heat load, the overall thermal resistance of the LWC is decreased with increasing inlet Reynolds number while the pressure drop is increased greatly, so that the overall thermal performance of LWC is inferior to that of SRC under the considered geometries. On the contrary, TWC has a great potential to reduce the pressure drop compared to SRC, especially for higher wave amplitudes at the same Reynolds number. Thus the overall thermal performance of TWC is superior to that of SRC. It is suggested that the TWC can be used to cool chips effectively with much smaller pressure drop penalty. In addition to the overall thermal resistance, other criteria of evaluation of the overall thermal performance, e.g., (Nu/Nu0)/(f/f0) and (Nu/Nu0)/(f/f0)1/3, are applied and some controversial results are obtained.

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