Heat dissipation has become a major hurdle for the electronics industry, especially as higher performance integrated circuits are being developed for the power industry. Two of the primary hurdles in dissipating this heat are:The thermal contact resistance between the IC and the cooling device.The ability to effectively spread the heat, such that traditional cooling technologies can be effective.By selecting ceramic materials that are thermo-mechanically matched (CTE) to IC materials, the proposed heat plate can be directly bonded by typical solder or braze techniques to the back-side of the IC. This eliminates thermal resistances due to contact and thermal interface materials. Within these heat plates, a three dimensional network of gas channels and fluid wicks spread the high-flux heat loads from localized hot spots to the surrounding regions via phase change fluids and mass transport. Like traditional heat pipes, these heat plates operate at nearly uniform temperature due to the phase change. The internal networks provide for multidimensional heat and mass flow, increasing their dissipating capability.
By using matched ceramic materials, and the inclusion of a heat plate, these primary hurdles for heat dissipation can be mitigated. The performance of prototypical planar heat plates will be presented.
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