Effect of micro-texture on substrate surface on adhesion performance of electroless Ni P coating

2022 ◽  
Vol 74 ◽  
pp. 296-307
Author(s):  
Jiatian Wang ◽  
Xiaolan Bai ◽  
Xuehui Shen ◽  
Xianfu Liu ◽  
Baolin Wang
Keyword(s):  
Substrate Surface ◽  
Adhesion Performance ◽  
Electroless Ni

Electroless Ni-P-Cg(Graphite)-SiC Composite Coating on Cast AlSi Alloy

2013 ◽  
Vol 795 ◽  
pp. 540-544
Author(s):  
M.M. Mohtar ◽  
Z.M. Ripin ◽  
Z.A. Ahmad
Keyword(s):  
Film Thickness ◽  
Composite Coating ◽  
Substrate Surface ◽  
Bath Temperature ◽  
Coating Film ◽  
Chemical Concentration ◽  
Plating Bath ◽  
Alsi Alloy ◽  
Ph Level ◽  
Electroless Ni

The study presents the electroless N-P-Cg-SiC composite coating on cast AlSi (ADC12) alloy where the bath temperature is maintained at 90°C, pH level is controlled between 4.5 to 5.0 and stirred at 450 rpm with mechanical stirrer to avoid particles sedimentation. The increase of the coating film thickness is very insignificant after one hour of coating duration. This outcome is supposed to be due to inconsistent chemical concentration in the plating bath after this period. The nominal coating thickness of 39 μm is achieved after the substrate is immersed for 1 hour in four consecutive plating baths, respectively. The coating film is also successfully adhered to the substrate surface with the SiC and Cgparticles are homogenously distributed.

scholarly journals A New Route for Direct Electroless Ni-P Plating on Magnesium Alloys

2017 ◽  
Vol 33 (2) ◽  
Author(s):  
Bùi Xuân Vương
Keyword(s):  
Corrosion Resistance ◽  
Magnesium Alloys ◽  
Substrate Surface ◽  
Nickel Sulfate ◽  
Plating Bath ◽  
High Adhesion ◽  
Pickling Solution ◽  
Salt Component ◽  
Coarse Surface ◽  
Electroless Ni

This report describes a new route for direct electroless Ni-P plating on magnesium alloys using nickel sulfate as the main salt component. The surface morphology, chemical composition and corrosion resistance of coatings were determined using SEM, EDX and electrochemical polarization techniques. Ni-P coatings with good corrosion resistance and high adhesion were obtained using this route and improved pretreatments. A mixture of H3PO4 and HNO3 was used as a pickling solution for Mg substrate pretreatment. A coarse surface was produced via the developed pickling procedure. A mechanical occlusive force is believed to exist between the coatings and the substrates. Twice activations, K4P2O7 and NH4HF2 as activation components, respectively, were applied for the pretreatment of magnesium alloy plating. An optimal F/O ratio on the Mg substrate surface was obtained by this pretreatment method. The activation film has insoluble partial fluorides which can depress the active points on substrate surface against the reaction of Mg with Ni2+ and H+ in the plating bath. A highly stable bath with pH 5 buffer was identified. The advantages of the developed process include chromium-free, low fluoride, and high bath stability. It is applicable for the production of motorcycle part plating.  

Electron microscopy studies of plasma-sprayed materials

1983 ◽  
Vol 41 ◽  
pp. 70-71
Author(s):  
K.R. Subramanian ◽  
A.H. King ◽  
H. Herman
Keyword(s):  
Plasma Spraying ◽  
Substrate Surface ◽  
Flame Temperature ◽  
Ceramic Coatings ◽  
Metallic Substrates ◽  
Hot Plasma ◽  
Almost All ◽  
Plasma Sprayed ◽  
Hostile Environments ◽  
Plasma Spraying Process

Plasma spraying is a technique which is used to apply coatings to metallic substrates for a variety of purposes, including hardfacing, corrosion resistance and thermal barrier applications. Almost all of the applications of this somewhat esoteric fabrication technique involve materials in hostile environments and the integrity of the coatings is of paramount importance: the effects of process variables on such properties as adhesive strength, cohesive strength and hardness of the substrate/coating system, however, are poorly understood.Briefly, the plasma spraying process involves forming a hot plasma jet with a maximum flame temperature of approximately 20,000K and a gas velocity of about 40m/s. Into this jet the coating material is injected, in powder form, so it is heated and projected at the substrate surface. Relatively thick metallic or ceramic coatings may be speedily built up using this technique.

Feasibility of Molecular Structure Determination With a High Resolution Electron Microscope

1968 ◽  
Vol 26 ◽  
pp. 338-339
Author(s):  
T. A. Welton
Keyword(s):  
Electron Microscope ◽  
Substrate Surface ◽  
Helical Axis ◽  
Base Plane ◽  
Resolution Electron ◽  
High Resolution Electron Microscope ◽  
High Degree ◽  
Degree Of Order ◽  
Purine Pyrimidine

An ultimate design goal for an improved electron microscope, aimed at biological applications, is the determination of the structure of complex bio-molecules. As a prototype of this class of problems, we propose to examine the possibility of reading DNA sequence by an imaginable instrument design. This problem ideally combines absolute importance and relative simplicity, in as much as the problem of enzyme structure seems to be a much more difficult one.The proposed technique involves the deposition on a thin graphite lamina of intact double helical DNA rods. If the structure can be maintained under vacuum conditions, we can then make use of the high degree of order to greatly reduce the work involved in discriminating between the four possible purine-pyrimidine arrangements in each base plane. The phosphorus atoms of the back bone form in projection (the helical axis being necessarily parallel to the substrate surface) two intertwined sinusoids. If these phosphorus atoms have been located up to a certain point on the molecule, we have available excellent information on the orientation of the base plane at that point, and can then locate in projection the key atoms for discrimination of the four alternatives.

Morphologies of Nonadherent Al2O3 and Matching Substrate Surfaces

1972 ◽  
Vol 30 ◽  
pp. 524-525
Author(s):  
C. S. Giggins ◽  
J. K. Tien ◽  
B. H. Kear ◽  
F. S. Pettit
Keyword(s):  
Electron Microscopy ◽  
Oxide Scale ◽  
Oxidation Resistance ◽  
Substrate Surface ◽  
Morphological Features ◽  
Thermally Induced ◽  
Oxide Spallation ◽  
Oxidation Resistant ◽  
Induced Stresses ◽  
Substrate Surfaces

The performance of most oxidation resistant alloys and coatings is markedly improved if the oxide scale strongly adheres to the substrate surface. Consequently, in order to develop alloys and coatings with improved oxidation resistance, it has become necessary to determine the conditions that lead to spallation of oxides from the surfaces of alloys. In what follows, the morphological features of nonadherent Al2O3, and the substrate surfaces from which the Al2O3 has spalled, are presented and related to oxide spallation.The Al2O3, scales were developed by oxidizing Fe-25Cr-4Al (w/o) and Ni-rich Ni3 (Al,Ta) alloys in air at 1200°C. These scales spalled from their substrates upon cooling as a result of thermally induced stresses. The scales and the alloy substrate surfaces were then examined by scanning and replication electron microscopy.The Al2O3, scales from the Fe-Cr-Al contained filamentary protrusions at the oxide-gas interface, Fig. 1(a). In addition, nodules of oxide have been developed such that cavities were formed between the oxide and the substrate, Fig. 1(a).

Observations on the growth of YBa2Cu3O7-δ thin films on MgO by pulsed-laser ablation

1991 ◽  
Vol 49 ◽  
pp. 1068-1069
Author(s):  
M. Grant Norton ◽  
C. Barry Carter
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Laser Ablation ◽  
Substrate Surface ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Laser Ablation Process ◽  
Deposition Parameters

Pulsed-laser ablation has been widely used to produce high-quality thin films of YBa2Cu3O7-δ on a range of substrate materials. The nonequilibrium nature of the process allows congruent deposition of oxides with complex stoichiometrics. In the high power density regime produced by the UV excimer lasers the ablated species includes a mixture of neutral atoms, molecules and ions. All these species play an important role in thin-film deposition. However, changes in the deposition parameters have been shown to affect the microstructure of thin YBa2Cu3O7-δ films. The formation of metastable configurations is possible because at the low substrate temperatures used, only shortrange rearrangement on the substrate surface can occur. The parameters associated directly with the laser ablation process, those determining the nature of the process, e g. thermal or nonthermal volatilization, have been classified as ‘primary parameters'. Other parameters may also affect the microstructure of the thin film. In this paper, the effects of these ‘secondary parameters' on the microstructure of YBa2Cu3O7-δ films will be discussed. Examples of 'secondary parameters' include the substrate temperature and the oxygen partial pressure during deposition.

TEM characterization of silicon epitaxial layer grown on Si-TaS2, eutectic composites

1991 ◽  
Vol 49 ◽  
pp. 802-803
Author(s):  
C.M. Sung ◽  
M. Levinson ◽  
M. Tabasky ◽  
K. Ostreicher ◽  
B.M. Ditchek
Keyword(s):  
Substrate Surface ◽  
Bulk Sample ◽  
Surface Cleaning ◽  
Native Oxide ◽  
Czochralski Growth ◽  
Ion Milling ◽  
Cross Sectional ◽  
Cleaning Methods ◽  
Field Emission Cathodes

Directionally solidified Si/TaSi2 eutectic composites for the development of electronic devices (e.g. photodiodes and field-emission cathodes) were made using a Czochralski growth technique. High quality epitaxial growth of silicon on the eutectic composite substrates requires a clean silicon substrate surface prior to the growth process. Hence a preepitaxial surface cleaning step is highly desirable. The purpose of this paper is to investigate the effect of surface cleaning methods on the epilayer/substrate interface and the characterization of silicon epilayers grown on Si/TaSi2 substrates by TEM.Wafers were cut normal to the <111> growth axis of the silicon matrix from an approximately 1 cm diameter Si/TaSi2 composite boule. Four pre-treatments were employed to remove native oxide and other contaminants: 1) No treatment, 2) HF only; 3) HC1 only; and 4) both HF and HCl. The cross-sectional specimens for TEM study were prepared by cutting the bulk sample into sheets perpendicular to the TaSi2 fiber axes. The material was then prepared in the usual manner to produce samples having a thickness of 10μm. The final step was ion milling in Ar+ until breakthrough occurred. The TEM samples were then analyzed at 120 keV using the Philips EM400T.

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