Evaluation of wear behaviour of various occlusal splint materials and manufacturing processes

Author(s):  
Anastasiia Grymak ◽  
John Neil Waddell ◽  
John M. Aarts ◽  
Sunyoung Ma ◽  
Joanne Jung Eun Choi
2021 ◽  
Author(s):  
Anastasiia Grymak ◽  
John M. Aarts ◽  
Sunyoung Ma ◽  
J. Neil Waddell ◽  
Joanne Jung Eun Choi

TAPPI Journal ◽  
2018 ◽  
Vol 17 (08) ◽  
pp. 437-443
Author(s):  
Lebo Xu ◽  
Jeremy Meyers ◽  
Peter Hart

Coffee edge-wicking testing was conducted on two groups of highly-sized paperboard manufactured at two mills with similar manufacturing processes, but with vastly different local fiber sources. Although the Hercules size test (HST) indicated similar internal size levels between the two types of board, the edge-wicking behavior was noticeably different. Analysis of fiber structure revealed that the board with more edge-wicking had fibers with thicker fiber walls, which kept the fiber lumen more open after pressing and drying on a paper machine. It was demonstrated that liquid penetration through voids between fibers in highly-sized paperboard was limited, because the fiber surface was well protected by the presence of sufficient sizing agent. Nevertheless, freshly exposed fiber walls and lumens at the cut edge of the sheet were not protected by sizing material, which facilitated edge-wicking. The correlation between fiber structure and edge-wicking behavior was highlighted in this work to inspire development of novel sizing strategies that protect the freshly cut edge of the sheet from edge-wicking.


MRS Advances ◽  
2020 ◽  
Vol 5 (59-60) ◽  
pp. 3077-3089
Author(s):  
Alexeis Sánchez ◽  
Arnoldo Bedolla-Jacuinde ◽  
Francisco V. Guerra ◽  
I. Mejía

AbstractFrom the present study, vanadium additions up to 6.4% were added to a 14%Cr-3%C white iron, and the effect on the microstructure, hardness and abrasive wear were analysed. The experimental irons were melted in an open induction furnace and cast into sand moulds to obtain bars of 18, 25, and 37 mm thickness. The alloys were characterized by optical and electronic microscopy, and X-ray diffraction. Bulk hardness was measured in the as-cast conditions and after a destabilization heat treatment at 900°C for 45 min. Abrasive wear resistance tests were undertaken for the different irons according to the ASTM G65 standard in both as-cast and heat-treated conditions under a load of 60 N for 1500 m. The results show that, vanadium additions caused a decrease in the carbon content in the alloy and that some carbon is also consumed by forming primary vanadium carbides; thus, decreasing the eutectic M7C3 carbide volume fraction (CVF) from 30% for the base iron to 20% for the iron with 6.4%V;but overall CVF content (M7C3 + VC) is constant at 30%. Wear behaviour was better for the heat-treated alloys and mainly for the 6.4%V iron. Such a behaviour is discussed in terms of the CVF, the amount of vanadium carbides, the amount of martensite/austenite in matrix and the amount of secondary carbides precipitated during the destabilization heat treatment.


2013 ◽  
Vol 55 (6) ◽  
pp. 468-471 ◽  
Author(s):  
Dursun Özyürek ◽  
Ibrahim Ciftci ◽  
Tansel Tuncay

Author(s):  
Pei Y. Tsai ◽  
Junedong Lee ◽  
Paul Ronsheim ◽  
Lindsay Burns ◽  
Richard Murphy ◽  
...  

Abstract A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.


Author(s):  
Camelia Hora ◽  
Stefan Eichenberger

Abstract Due to the development of smaller and denser manufacturing processes most of the hardware localization techniques cannot keep up satisfactorily with the technology trend. There is an increased need in precise and accurate software based diagnosis tools to help identify the fault location. This paper describes the software based fault diagnosis method used within Philips, focusing on the features developed to increase its accuracy.


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