Robust manufacturing line design with controlled moderate robustness in bottleneck buffer time to manage stochastic inter-task times

2013 ◽  
Vol 32 (2) ◽  
pp. 382-391 ◽  
Author(s):  
Ehsan Nazarian ◽  
Jeonghan Ko
Keyword(s):  
Manufacturing Line ◽  
Buffer Time ◽  
Robust Manufacturing ◽  
Line Design

Manufacturing Line Design Configuration with Optimized Resource Groups

2021 ◽  
Author(s):  
Takahiro Nakano ◽  
Kajita Daiki ◽  
Heming Chen ◽  
Ilya Kovalenko ◽  
Efe Balta ◽  
...  
Keyword(s):  
Manufacturing Line ◽  
Line Design

Evaluating Design Alternatives of an Extruded Food Production Line Using Simulation

SIMULATION ◽  
2002 ◽  
Vol 78 (10) ◽  
pp. 626-632 ◽  
Author(s):  
Stephen F. Owens ◽  
Reuven R. Levary
Keyword(s):  
Production Line ◽  
Food Production ◽  
System Throughput ◽  
Unit Operations ◽  
Manufacturing Line ◽  
Design Alternatives ◽  
Current Design ◽  
Current Production ◽  
The Cost ◽  
Line Design

Several designs of a manufacturing line for the production of extruded foods were developed and compared with the current production line design. The manufacturing line consisted of six unit operations: batching, grinding, extruding, drying, further processing, and packing. The authors performed the comparisons by simulating the current design and the proposed alternatives. The alternatives consisted of modifications to the extruder-dryer and/or packing line designs. The simulation results indicated that all the alternate designs roughly doubled system throughput compared to current designs but did not differ significantly in performance among themselves. The doubled output is worth about $2.5 million per year. This is easily enough to justify the cost of new equipment. One design would cost less to implement than the others and thus was the preferred option.

Innovative Strategic Planning for the Design of a High Volume Production Line using Quality Function Deployment and a Batch

2013 ◽  
Vol 4 (1) ◽  
pp. 53-68
Author(s):  
Roberto Yumbla ◽  
Stuart Lumley ◽  
M. Khurshid Khan
Keyword(s):  
Production Line ◽  
Quality Function Deployment ◽  
High Volume ◽  
Quality Function ◽  
Manufacturing Line ◽  
Proactive Management ◽  
High Volume Production ◽  
Volume Production ◽  
Planning Methodology ◽  
Line Design

This paper proposes an innovative factory planning methodology to achieve the objectives that were defined by Flexitallic for the future expansion of the Thermiculite production line. The concepts under investigation extend to the analysis of flow benefits and restrictions considering product features and demands addressed in a proposed Batch/Flow Comparative Matrix. Furthermore, this paper introduces the Quality Function Deployment (QFD) concept to support the manufacturing line design using a mechanism of incorporating commercial awareness in all stages of the product deployment. The original QFD ensures process planning by bringing parts deployment into parts characteristics through the House of Quality. This study renews the original QFD by developing the Strategic Alignment of Quality Function Deployment (SAQFD) to achieve proactive management of Houses III and House IV. The case study demonstrates the utilization and applicability of the proposed methodologies, and demonstrates their importance during the design of a high volume production line.

scholarly journals A study on the optimal line integrated design analysis system

2018 ◽  
Vol 7 (3.3) ◽  
pp. 155
Author(s):  
Taesung Kim ◽  
Hyunsoo Lee ◽  
Heedong Hong
Keyword(s):  
Production Technology ◽  
Planning System ◽  
Technology Strategy ◽  
Manufacturing Execution System ◽  
Design And Development ◽  
Line Planning ◽  
Virtual Production ◽  
Manufacturing Line ◽  
Wide Range ◽  
Line Design

Background/Objectives: This paper is a study on a system that standardizes processes based on smart virtual production technology strategy for manufacturing line design and development, and integrates new or existing resources and systems into one consistent and structured framework.Methods/Statistical analysis: In this paper, we standardize the process based on the digital virtual production technology strategy for manufacturing line design and development. A system that integrates new or existing resources and systems into a single, unified framework. Through this system, various events participating in the development of the manufacturing line can receive standardized work progress and communication in one consistent system. In addition, we standardized and library the scattered data to minimize the loss of data management.Findings: Users across a wide range of areas can quickly and easily perform line development from line planning to design, setup and optimization based on standardized processes and an intuitive user experience. By providing analysis results in conjunction with heterogeneous analysis engines, you can perform solution-independent business processes. The effectiveness of the proposed system was verified by applying the proposed system to the actual new and expansion manufacturing line and redesign line in the company and performing line development work.Improvements/Applications: Through this study, it is expected that the actual field data of MES (Manufacturing Execution System) and the information of planning system such as ERP (Enterprise Resource Planning) can be linked to the integrated decision support system of engineering solution.  

Rotary Coupler in Microstrip Line Design for Data Transmission in the 2.45GHz ISM Band

2020 ◽  
Author(s):  
Benedict Scheiner ◽  
Christopher Beck ◽  
Fabian Lurz ◽  
Martin Frank ◽  
Fabian Michler ◽  
...  
Keyword(s):  
Data Transmission ◽  
Microstrip Line ◽  
Ism Band ◽  
Line Design

RF MEMS Extended Tuning Range Varactor and Varactor Based True Time Delay Line Design

PIERS Online ◽  
2008 ◽  
Vol 4 (4) ◽  
pp. 433-436 ◽  
Author(s):  
Yaping Liang ◽  
Calvin W. Domier ◽  
Neville C. Luhmann, Jr.
Keyword(s):  
Time Delay ◽  
Delay Line ◽  
Tuning Range ◽  
Rf Mems ◽  
True Time Delay ◽  
True Time ◽  
Line Design

A New Method of Wafer Level Plan View TEM Sample Preparation by DualBeam

2008 ◽  
Author(s):  
Hyoung H. Kang ◽  
Michael A. Gribelyuk ◽  
Oliver D. Patterson ◽  
Steven B. Herschbein ◽  
Corey Senowitz
Keyword(s):  
Sample Preparation ◽  
Ex Situ ◽  
Wafer Level ◽  
Cross Sectional ◽  
Plan View ◽  
Manufacturing Line ◽  
Transmission Electron ◽  
Thin Lamella ◽  
Preparation Techniques

Abstract Cross-sectional style transmission electron microscopy (TEM) sample preparation techniques by DualBeam (SEM/FIB) systems are widely used in both laboratory and manufacturing lines with either in-situ or ex-situ lift out methods. By contrast, however, the plan view TEM sample has only been prepared in the laboratory environment, and only after breaking the wafer. This paper introduces a novel methodology for in-line, plan view TEM sample preparation at the 300mm wafer level that does not require breaking the wafer. It also presents the benefit of the technique on electrically short defects. The methodology of thin lamella TEM sample preparation for plan view work in two different tool configurations is also presented. The detailed procedure of thin lamella sample preparation is also described. In-line, full wafer plan view (S)TEM provides a quick turn around solution for defect analysis in the manufacturing line.

In FAB 300mm Wafer Level Atomic Force Probe Characterization

2012 ◽  
Author(s):  
Terence Kane
Keyword(s):  
Electrical Characterization ◽  
Dark Field ◽  
Wafer Level ◽  
Electrical Measurements ◽  
Manufacturing Line ◽  
Atomic Force ◽  
Monitoring Tools ◽  
Voltage Contrast ◽  
The Cost ◽  
Non Destructive

Abstract A 300mm wafer atomic force prober (AFP) has been installed into IBM’s manufacturing line to enable rapid, nondestructive electrical identification of defects. Prior to this tool many of these defects could not detected until weeks or months later. Moving failure analysis to the FAB provides a means of complementing existing FAB inspection and defect review tools as well as providing independent, non-destructive electrical measurements at an early point in the manufacturing cycle [1] Once the wafer sites are non destructively AFP characterized, the wafer is returned to its front opening unified pod (FOUP) carrier and may be reintroduced into the manufacturing line without disruption for further inspection or processing. Whole wafer atomic force probe electrical characterization has been applied to 32nm, 28nm, 20nm and 14nm node technologies. In this paper we explore the cost benefits of performing non-destructive AFP measurements on whole wafers. We have found the methodology of employing a whole wafer AFP tool complements existing in-line manufacturing monitoring tools such as brightfield/dark field optical inspection, SEM in-line inspection and in-line E-beam voltage contrast inspection (EBI).

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