Fiber/matrix interfacial thermal conductance effect on the thermal conductivity of SiC/SiC composites

2013 ◽  
Vol 440 (1-3) ◽  
pp. 11-20 ◽  
Author(s):  
Ba Nghiep Nguyen ◽  
Charles H. Henager
2005 ◽  
Vol 492-493 ◽  
pp. 551-554
Author(s):  
Guang Zhao Bai ◽  
Wan Jiang ◽  
G. Wang ◽  
Li Dong Chen ◽  
X. Shi

Thermal conductivity of as-prepared MoSi2/SiC composites has been determined by Laser Flash method. Interfacial thermal conductance for composites with 100nm SiC and with 0.5µm has been determined by using effective medium theory. The results of interfacial thermal conductance exhibit that both the inclusion size and the clustering of the inclusions play an important role in determining composite thermal conductivity.


Energies ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 5851
Author(s):  
Shuang Wu ◽  
Jifen Wang ◽  
Huaqing Xie ◽  
Zhixiong Guo

The thermal conductivity and interface thermal conductance of graphene stacked MoS2 (graphene/MoS2) van der Waals heterostructure were studied by the first principles and molecular dynamics (MD) simulations. Firstly, two different heterostructures were established and optimized by VASP. Subsequently, we obtained the thermal conductivity (K) and interfacial thermal conductance (G) via MD simulations. The predicted Κ of monolayer graphene and monolayer MoS2 reached 1458.7 W/m K and 55.27 W/m K, respectively. The thermal conductance across the graphene/MoS2 interface was calculated to be 8.95 MW/m2 K at 300 K. The G increases with temperature and the interface coupling strength. Finally, the phonon spectra and phonon density of state were obtained to analyze the changing mechanism of thermal conductivity and thermal conductance.


2022 ◽  
Vol 12 (1) ◽  
Author(s):  
Masayuki Morimoto ◽  
Shoya Kawano ◽  
Shotaro Miyamoto ◽  
Koji Miyazaki ◽  
Shuzi Hayase ◽  
...  

AbstractTo develop high-performance thermoelectric devices that can be created using printing technology, the interface of a composite material composed of MASnI3 and Bi2Te3, which individually show excellent thermoelectric performance, was studied based on first-principles calculations. The structural stability, electronic state, and interfacial thermal conductance of the interface between Bi2Te3 and MASnI3 were evaluated. Among the interface structure models, we found stable interface structures and revealed their specific electronic states. Around the Fermi energy, the interface structures with TeII and Bi terminations exhibited interface levels attributed to the overlapping electron densities for Bi2Te3 and MASnI3 at the interface. Calculation of the interfacial thermal conductance using the diffuse mismatch model suggested that construction of the interface between Bi2Te3 and MASnI3 could reduce the thermal conductivity. The obtained value was similar to the experimental value for the inorganic/organic interface.


2013 ◽  
Vol 873 ◽  
pp. 344-349
Author(s):  
Wu Lin Yang ◽  
Kun Peng ◽  
Jia Jun Zhu ◽  
De Yi Li ◽  
Ling Ping Zhou

In the present work, the finite element method is employed to predict the effective thermal conductivity of diamond particle reinforced aluminum composite. The common finite element commercial software ANSYS is used to for this numerical analysis. A body-centered cubic particle arrangement model are constructed to simulate the microstructure of the composite with 60 vol.% diamond. The effect of particle size and inhomogeneous interfacial conductance on the thermal conductivity of diamond particles reinforced aluminum composite is investigated. Cubo-octahedral particles are assumed and interfacial thermal conductance between different diamond faces and aluminum matrix is implemented by real constants of contact element. The results show that the numerical results using present model agree reasonably well with the experimentation. Taking into consideration the interfacial thermal conductance, the influence of particle size on total thermal conductivity of composite is obvious, the larger size particles tend to meet requirement of the high thermal conductivity of composite. Fitting the experimental result with the inhomogeneous interfacial thermal conductance model, the evolution of the composite thermal property is profound studied.


2021 ◽  
Vol 2133 (1) ◽  
pp. 012002
Author(s):  
Wei Yang ◽  
Yun Chen ◽  
Yipeng Zhang ◽  
Yongsheng Fu ◽  
Kun Zheng ◽  
...  

Abstract The interfacial thermal conductance (ITC) between filler and polymer matrix is considered as one of the important factors that limits the thermal conductivity of thermally conductive polymer composites. The effect of two different surface treatments (piranha solution and plasma) on ITC of epoxy/alumina was investigated using Time-domain thermoreflectance method (TDTR). The TDTR results show that compared with non-treated samples, the ITC of samples treated by piranha solution and plasma increased 2.9 times and 3.4 times, respectively. This study provides guidance for improving the thermal conductivity of thermally conductive polymer composites.


Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1369
Author(s):  
Mayssaa Jbeili ◽  
Junfeng Zhang

Porous materials are widely used in many heat transfer applications. Modeling porous materials at the microscopic level can accurately incorporate the detailed structure and substance parameters and thus provides valuable information for the complex heat transfer processes in such media. In this study, we use the generalized periodic boundary condition for pore-scale simulations of thermal flows in porous materials. A two-dimensional porous model consisting of circular solid domains is considered, and comprehensive simulations are performed to study the influences on macroscopic thermal conductivity from several microscopic system parameters, including the porosity, Reynolds number, and periodic unit aspect ratio and the thermal conductance at the solid–fluid interface. Our results show that, even at the same porosity and Reynolds number, the aspect ratio of the periodic unit and the interfacial thermal conductance can significantly affect the macroscopic thermal behaviors of porous materials. Qualitative analysis is also provided to relate the apparent thermal conductivity to the complex flow and temperature distributions in the microscopic porous structure. The method, findings and discussions presented in this paper could be useful for fundamental studies, material development, and engineering applications of porous thermal flow systems.


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