Density, Excess Volume, Thermal Expansion Coefficient and Intermolecular Hydrogen Bonding of Binary Mixtures of Morpholine+ Isobutanol: A Combined Experimental and Computational Study

2021 ◽  
pp. 118417
Author(s):  
Atefeh. Satei ◽  
Azim. Soltanabadi
1999 ◽  
Vol 77 (12) ◽  
pp. 2046-2052 ◽  
Author(s):  
Carmen Jarne ◽  
Manuela Artal ◽  
José Muñoz Embid ◽  
Inmaculada Velasco ◽  
Santos Otín

Densities of binary mixtures of 1,1,2-trichlorotrifluoroethane + dibromomethane, + bromochloromethane, or + bromotrichloromethane were measured over their entire composition ranges at 288.15 and 308.15 K. Thermal expansion coefficients (α) and excess molar volumes (VEm) were calculated. Moreover, densities at 298.15 K and pressures up to 80 bar (1 bar = 100 kPa) were determined for these same mixtures. Isothermal compressibilities (KT) of the pure liquids and their mixtures were obtained.Key words: density, excess volume, thermal expansion coefficient, isothermal compressibility.


1964 ◽  
Vol 42 (10) ◽  
pp. 1857-1864 ◽  
Author(s):  
Alois Schauer

It is shown that a close relation exists between the temperature coefficient of lattice vibration frequencies and the thermal expansion coefficient. The basic equations[Formula: see text](νi being the frequency of the ith mode of vibration, T the temperature, Ci the Einstein function of frequency νi, γ the Grueneisen parameter, and β the volume thermal expansion coefficient) are derived and discussed for various temperature ranges.


Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.


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