Defect reduction in SiC epilayers by different substrate cleaning methods

2022 ◽  
Vol 140 ◽  
pp. 106414
Author(s):  
D. Baierhofer ◽  
B. Thomas ◽  
F. Staiger ◽  
B. Marchetti ◽  
C. Förster ◽  
...  
Keyword(s):  
Defect Reduction ◽  
Cleaning Methods ◽  
Substrate Cleaning

TEM characterization of silicon epitaxial layer grown on Si-TaS2, eutectic composites

1991 ◽  
Vol 49 ◽  
pp. 802-803
Author(s):  
C.M. Sung ◽  
M. Levinson ◽  
M. Tabasky ◽  
K. Ostreicher ◽  
B.M. Ditchek
Keyword(s):  
Substrate Surface ◽  
Bulk Sample ◽  
Surface Cleaning ◽  
Native Oxide ◽  
Czochralski Growth ◽  
Ion Milling ◽  
Cross Sectional ◽  
Cleaning Methods ◽  
Field Emission Cathodes

Directionally solidified Si/TaSi2 eutectic composites for the development of electronic devices (e.g. photodiodes and field-emission cathodes) were made using a Czochralski growth technique. High quality epitaxial growth of silicon on the eutectic composite substrates requires a clean silicon substrate surface prior to the growth process. Hence a preepitaxial surface cleaning step is highly desirable. The purpose of this paper is to investigate the effect of surface cleaning methods on the epilayer/substrate interface and the characterization of silicon epilayers grown on Si/TaSi2 substrates by TEM.Wafers were cut normal to the <111> growth axis of the silicon matrix from an approximately 1 cm diameter Si/TaSi2 composite boule. Four pre-treatments were employed to remove native oxide and other contaminants: 1) No treatment, 2) HF only; 3) HC1 only; and 4) both HF and HCl. The cross-sectional specimens for TEM study were prepared by cutting the bulk sample into sheets perpendicular to the TaSi2 fiber axes. The material was then prepared in the usual manner to produce samples having a thickness of 10μm. The final step was ion milling in Ar+ until breakthrough occurred. The TEM samples were then analyzed at 120 keV using the Philips EM400T.

Defect reduction in oxygen implanted silicon-on-insulator material during high-temperature annealing

1989 ◽  
Vol 47 ◽  
pp. 604-605
Author(s):  
P. Roitman ◽  
B. Cordts ◽  
S. Visitserngtrakul ◽  
S.J. Krause
Keyword(s):  
High Temperature ◽  
Annealing Temperature ◽  
Silicon On Insulator ◽  
High Dose ◽  
High Temperature Annealing ◽  
High Current ◽  
Defect Reduction ◽  
Annealing Step ◽  
Multiple Cycle ◽  
Defect Densities

Synthesis of a thin, buried dielectric layer to form a silicon-on-insulator (SOI) material by high dose oxygen implantation (SIMOX – Separation by IMplanted Oxygen) is becoming an important technology due to the advent of high current (200 mA) oxygen implanters. Recently, reductions in defect densities from 109 cm−2 down to 107 cm−2 or less have been reported. They were achieved with a final high temperature annealing step (1300°C – 1400°C) in conjunction with: a) high temperature implantation or; b) channeling implantation or; c) multiple cycle implantation. However, the processes and conditions for reduction and elimination of precipitates and defects during high temperature annealing are not well understood. In this work we have studied the effect of annealing temperature on defect and precipitate reduction for SIMOX samples which were processed first with high temperature, high current implantation followed by high temperature annealing.

Defect Reduction in Ring Blank Casting Through Design of Experiments

2015 ◽  
Vol 9 (6) ◽  
pp. 536 ◽  
Author(s):  
P. Kannan ◽  
K. Balasubramanian ◽  
R. Vinayagamoorthy
Keyword(s):  
Design Of Experiments ◽  
Defect Reduction ◽  
Ring Blank

Construction of Defect Reduction System by Improving Wet-end Chemical Retention

2020 ◽  
Vol 74 (4) ◽  
pp. 309-315
Author(s):  
Hiroyuki Oishi ◽  
Koichi Tadaki ◽  
Kazutaka Kasuga
Keyword(s):  
Defect Reduction ◽  
Reduction System ◽  
Chemical Retention

Methodology to Correlate Defect Reduction Systems to Electrical Test Data via Artificially Manufactured Defects

2002 ◽  
Author(s):  
Mike Santana ◽  
Alfredo V. Herrera
Keyword(s):  
Test Data ◽  
Learning Opportunities ◽  
Inspection System ◽  
Navigation Systems ◽  
Defect Inspection ◽  
Defect Reduction ◽  
Electrical Test ◽  
Important System

Abstract This paper describes a methodology for correlating physical defect inspection/navigation systems with electrical bitmap data through the fabrication of artificial defects via reticle alterations or circuit modifications using an inline FIB. The methodology chosen consisted of altering decommissioned reticles to create defects resulting in both open and shorted circuits within areas of an AMD microprocessor cache. The reticles were subsequently scanned using a KLA SL300HR StarLight inspection system to confirm their location, while wafers processed on these reticles were scanned at several layers using standard inline metrology. Finally, the wafers were electrically tested, bitmapped, and physically deprocessed. All defect data was then analyzed and cross-correlated between each system, uncovering some important system deficiencies and learning opportunities. Data and images are included to support the significance and effectiveness of such a methodology.

Intel® Component Diagnostic Technology: Tools and Education for Intel Component Defect Reduction

2004 ◽  
Author(s):  
Julie S. Doll
Keyword(s):  
User Interface ◽  
Data Management ◽  
Contract Manufacturing ◽  
Defect Reduction ◽  
Web Based ◽  
Technology Tools ◽  
Diagnostic Capability ◽  
Diagnostic Technology

Abstract To enable efficient, accurate debug of Intel architecture components to take place within contract manufacturing sites, and to provide alternatives for the removal of Intel components from, Intel is deploying a diagnostic capability and attendant educational collateral known as to achieve these objectives Intel® Component Diagnostic Technology. This paper will describe details of Intel® Component Diagnostic Technology, including the diagnostic fixture and user interface, diagnostic scripts and analytical coverage, data management and reporting, and on-site and Web-based educational offerings.

Effect of Different Cleaning and Sterilization Methods on the Surface Morphology of Mini-implants

2017 ◽  
Vol 68 (9) ◽  
pp. 1974-1977
Author(s):  
Silvia Izabella Pop ◽  
Dana Cristina Bratu ◽  
Violeta Valentina Merie ◽  
Mariana Pacurar ◽  
Catalin Petru Simon ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Surface Topography ◽  
Distilled Water ◽  
Mini Implants ◽  
Cleaning Methods ◽  
Sem Analyses

The objective of this study was to analyse morphological and surface topography variations of two types of mini-implants after using different chemical and physical cleaning methods and autoclaved sterilization. One hundred mini-implants from two different manufacturers were used in this study. The mini-implants from each manufacturer were divided in five groups, each consisting of ten samples: G0 new, unused, G1 ultrasonically cleaned, G2 chemically cleaned, G3 sandblasted, G4 cleaned with distilled water. SEM analyses of the mini-implants were performed. Only procedures used in samples from group G2 and G3 removed the tissue remains from the mini-implants surface.

The Hard Sell

2017 ◽  
Author(s):  
Peter Scott
Keyword(s):  
Price Competition ◽  
New Economy ◽  
The United States ◽  
Vacuum Cleaner ◽  
Firm Level ◽  
Direct Sales ◽  
Cost Distribution ◽  
Household Cleaning ◽  
Time Savings ◽  
Cleaning Methods

The vacuum cleaner was an archetypal new economy product of the early twentieth century. It offered both major time savings and qualitative advantages over previous household cleaning methods—the brush, broom, and manual carpet sweeper—and was sold in a novel way (by household demonstration). The direct sales techniques pioneered by vacuum manufacturers in the United States were to have a profound impact on the way vacuums were sold in Britain, and globally. Yet by 1939 their household diffusion was relatively slow compared to refrigerators or washing machines. This chapter explores why the industry evolved a structure based on high prices, high cost distribution methods (door-to-door sales), and a strong emphasis on non-price competition, based on differentiation through features. It also shows how door-to-door selling eventually came to constitute both a key firm-level competitive advantage and a substantial industry-level constraint on product diffusion.

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