Thermoelectric module design to improve lifetime and output power density

2021 ◽  
Vol 18 ◽  
pp. 100391
Author(s):  
W. Sun ◽  
R. Sui ◽  
G. Yuan ◽  
H. Zheng ◽  
Z. Zeng ◽  
...  
2020 ◽  
Vol 13 (10) ◽  
pp. 3480-3488 ◽  
Author(s):  
Shengduo Xu ◽  
Min Hong ◽  
Xiaolei Shi ◽  
Meng Li ◽  
Qiang Sun ◽  
...  

A computation-guided design of a flexible thermoelectric module achieves a high output power density of 3 μW cm−2 by sunlight-to-electricity conversion.


Micromachines ◽  
2021 ◽  
Vol 12 (7) ◽  
pp. 803
Author(s):  
Zhongjie Li ◽  
Chuanfu Xin ◽  
Yan Peng ◽  
Min Wang ◽  
Jun Luo ◽  
...  

A novel hybridization scheme is proposed with electromagnetic transduction to improve the power density of piezoelectric energy harvester (PEH) in this paper. Based on the basic cantilever piezoelectric energy harvester (BC-PEH) composed of a mass block, a piezoelectric patch, and a cantilever beam, we replaced the mass block by a magnet array and added a coil array to form the hybrid energy harvester. To enhance the output power of the electromagnetic energy harvester (EMEH), we utilized an alternating magnet array. Then, to compare the power density of the hybrid harvester and BC-PEH, the experiments of output power were conducted. According to the experimental results, the power densities of the hybrid harvester and BC-PEH are, respectively, 3.53 mW/cm3 and 5.14 μW/cm3 under the conditions of 18.6 Hz and 0.3 g. Therefore, the power density of the hybrid harvester is 686 times as high as that of the BC-PEH, which verified the power density improvement of PEH via a hybridization scheme with EMEH. Additionally, the hybrid harvester exhibits better performance for charging capacitors, such as charging a 2.2 mF capacitor to 8 V within 17 s. It is of great significance to further develop self-powered devices.


2011 ◽  
Vol 32 (12) ◽  
pp. 124003 ◽  
Author(s):  
Bo Liu ◽  
Zhihong Feng ◽  
Sen Zhang ◽  
Shaobo Dun ◽  
Jiayun Yin ◽  
...  

2013 ◽  
Vol 33 (7) ◽  
pp. 1343-1347 ◽  
Author(s):  
Chang-Hoi Choi ◽  
In-Tae Seo ◽  
Daniel Song ◽  
Min-Soo Jang ◽  
Bo-Yun Kim ◽  
...  

2021 ◽  
Vol 11 (19) ◽  
pp. 9017
Author(s):  
Jinho Jeong ◽  
Yeongmin Jang ◽  
Jongyoun Kim ◽  
Sosu Kim ◽  
Wansik Kim

In this paper, a high-power amplifier integrated circuit (IC) in gallium-nitride (GaN) on silicon (Si) technology is presented at a W-band (75–110 GHz). In order to mitigate the losses caused by relatively high loss tangent of Si substrate compared to silicon carbide (SiC), low-impedance microstrip lines (20–30 Ω) are adopted in the impedance matching networks. They allow for the impedance transformation between 50 Ω and very low impedances of the wide-gate transistors used for high power generation. Each stage is matched to produce enough power to drive the next stage. A Lange coupler is employed to combine two three-stage common source amplifiers, providing high output power and good input/output return loss. The designed power amplifier IC was fabricated in the commercially available 60 nm GaN-on-Si high electron mobility transistor (HEMT) foundry. From on-wafer probe measurements, it exhibits the output power higher than 26.5 dBm and power added efficiency (PAE) higher than 8.5% from 88 to 93 GHz with a large-signal gain > 10.5 dB. Peak output power is measured to be 28.9 dBm with a PAE of 13.3% and a gain of 9.9 dB at 90 GHz, which corresponds to the power density of 1.94 W/mm. To the best of the authors’ knowledge, this result belongs to the highest output power and power density among the reported power amplifier ICs in GaN-on-Si HEMT technologies operating at the W-band.


2005 ◽  
Vol 41 (22) ◽  
pp. 1249 ◽  
Author(s):  
M. Kasu ◽  
K. Ueda ◽  
H. Ye ◽  
Y. Yamauchi ◽  
S. Sasaki ◽  
...  
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