scholarly journals Re-deposition of ITER-grade Be on plasma gun facility QSPA-Be: characterization & plasma cleaning

2022 ◽  
pp. 101111
Author(s):  
A.M. Dmitriev ◽  
A.G. Razdobarin ◽  
L.A. Snigirev ◽  
D.I. Elets ◽  
I.M. Bukreev ◽  
...  
Keyword(s):  
Plasma Cleaning ◽  
Plasma Gun

TRANSIENT EVOLUTION AND SHIFTS OF SIGNALS EMITTED BY A D.C. PLASMA GUN (TYPE PTF4)

2003 ◽  
Vol 7 (2) ◽  
pp. 11 ◽  
Author(s):  
D. Rigot ◽  
Guy Delluc ◽  
Bernard Pateyron ◽  
J. F. Coudert ◽  
Pierre Fauchais ◽  
...  
Keyword(s):  
Plasma Gun ◽  
And Shifts

scholarly journals Reactive plasma cleaning and restoration of transition metal dichalcogenide monolayers

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Daniil Marinov ◽  
Jean-François de Marneffe ◽  
Quentin Smets ◽  
Goutham Arutchelvan ◽  
Kristof M. Bal ◽  
...  
Keyword(s):  
High Temperature ◽  
Transition Metal ◽  
Field Effect Transistors ◽  
Removal Rate ◽  
2D Materials ◽  
Scale Up ◽  
Transition Metal Dichalcogenides ◽  
Chemical Properties ◽  
Plasma Cleaning ◽  
Transition Metal Dichalcogenide

AbstractThe cleaning of two-dimensional (2D) materials is an essential step in the fabrication of future devices, leveraging their unique physical, optical, and chemical properties. Part of these emerging 2D materials are transition metal dichalcogenides (TMDs). So far there is limited understanding of the cleaning of “monolayer” TMD materials. In this study, we report on the use of downstream H2 plasma to clean the surface of monolayer WS2 grown by MOCVD. We demonstrate that high-temperature processing is essential, allowing to maximize the removal rate of polymers and to mitigate damage caused to the WS2 in the form of sulfur vacancies. We show that low temperature in situ carbonyl sulfide (OCS) soak is an efficient way to resulfurize the material, besides high-temperature H2S annealing. The cleaning processes and mechanisms elucidated in this work are tested on back-gated field-effect transistors, confirming that transport properties of WS2 devices can be maintained by the combination of H2 plasma cleaning and OCS restoration. The low-damage plasma cleaning based on H2 and OCS is very reproducible, fast (completed in a few minutes) and uses a 300 mm industrial plasma etch system qualified for standard semiconductor pilot production. This process is, therefore, expected to enable the industrial scale-up of 2D-based devices, co-integrated with silicon technology.

RF circuit analysis for ITER visible spectroscopy reference system first mirror plasma cleaning

2021 ◽  
Vol 168 ◽  
pp. 112654
Author(s):  
Ulf Stephan ◽  
Olaff Steinke ◽  
Andrey Ushakov ◽  
Ad Verlaan ◽  
Maarten de Bock ◽  
...  
Keyword(s):  
Reference System ◽  
Circuit Analysis ◽  
Plasma Cleaning ◽  
Visible Spectroscopy ◽  
Rf Circuit

Long-pulse plasma source for SMOLA helical mirror

2021 ◽  
Vol 87 (2) ◽  
Author(s):  
Ivan A. Ivanov ◽  
V. O. Ustyuzhanin ◽  
A. V. Sudnikov ◽  
A. Inzhevatkina
Keyword(s):  
Magnetic Field ◽  
Gas Flow ◽  
Supply Voltage ◽  
Hydrogen Plasma ◽  
Plasma Source ◽  
Lanthanum Hexaboride ◽  
Plasma Stream ◽  
Plasma Parameters ◽  
Plasma Properties ◽  
Plasma Gun

A plasma gun for forming a plasma stream in the open magnetic mirror trap with additional helicoidal field SMOLA is described. The plasma gun is an axisymmetric system with a planar circular hot cathode based on lanthanum hexaboride and a hollow copper anode. The two planar coils are located around the plasma source and create a magnetic field of up to 200 mT. The magnetic field forms the magnetron configuration of the discharge and provides a radial electric insulation. The source typically operates with a discharge current of up to 350 A in hydrogen. Plasma parameters in the SMOLA device are Ti ~ 5 eV, Te ~ 5–40 eV and ni ~ (0.1–1)  × 1019 m−3. Helium plasma can also be created. The plasma properties depend on the whole group of initial technical parameters: the cathode temperature, the feeding gas flow, the anode-cathode supply voltage and the magnitude of the cathode magnetic insulation.

scholarly journals Plasma Cleaning Improves the Image Quality of Serial Block-face Scanning Electron Microscopy (SBFSEM) Volumetric Data Sets

2017 ◽  
Vol 23 (S1) ◽  
pp. 1266-1267 ◽  
Author(s):  
Barbara Armbruster ◽  
Christopher Booth ◽  
Stuart Searle ◽  
Michael Cable ◽  
Ronald Vane
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Image Quality ◽  
Data Sets ◽  
Plasma Cleaning ◽  
Volumetric Data ◽  
Face Scanning ◽  
Block Face ◽  
Scanning Electron

Plasma cleaning of nanoparticles from EUV mask materials by electrostatics

2008 ◽  
Author(s):  
W. M. Lytle ◽  
R. Raju ◽  
H. Shin ◽  
C. Das ◽  
M. J. Neumann ◽  
...  
Keyword(s):  
Plasma Cleaning

Basic Measurements in a Rail Type Plasma Gun

1964 ◽  
Vol 11 (1) ◽  
pp. 47-57
Author(s):  
Emile Le Grives ◽  
Thiebaut Moulin ◽  
Emilien Robert
Keyword(s):  
Plasma Gun

Characterization of pulsed atmospheric-pressure plasma streams (PAPS) generated by a plasma gun

2012 ◽  
Vol 21 (3) ◽  
pp. 034017 ◽  
Author(s):  
E Robert ◽  
V Sarron ◽  
D Riès ◽  
S Dozias ◽  
M Vandamme ◽  
...  
Keyword(s):  
Atmospheric Pressure ◽  
Atmospheric Pressure Plasma ◽  
Plasma Gun ◽  
Pressure Plasma

The Using Permalloy Core for the switching of the Plasma Gun Electrical Circuit with a Capacitive Storage

2007 ◽  
Author(s):  
Victor Ivanovich Fedun ◽  
Oleg Nikolaevich Bulanchuk ◽  
Yuriy Evgen'evich Kolyada
Keyword(s):  
Electrical Circuit ◽  
Capacitive Storage ◽  
Plasma Gun
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