A new MFL imaging and quantitative nondestructive evaluation method in wire rope defect detection

In this article, the experimental measurement method of M-integral is investigated. Through the detailed analysis to the nondestructive evaluation method of J- and M-integrals suggested by King and Herrmann, it is found that the specimen geometry which they selected and the corresponding clamping mode in their test exists a conflict with the stress distribution assumption on the integral contour. The formulas they proposed cannot represent the selected specimen geometry and the related integral contours. To avoid this conflict, a new experimental measurement method and a simper specimen style is proposed in this study. According to the method, the M-integral is nondestructive evaluated experimentally through the new specimen and the new clamping mode.

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A Magnetic Nondestructive Evaluation Method to Simultaneously Determine Chemical Composition and Heat Treatment Characteristics of Plain Carbon Steels: A Statistical Modeling Approach

Journal of Materials Engineering and Performance ◽

10.1007/s11665-020-04728-7 ◽

2020 ◽

Vol 29 (4) ◽

pp. 2560-2573

Author(s):

Saeed Kahrobaee ◽

Taha-Hossein Hejazi ◽

Iman Ahadi Akhlaghi ◽

Mina Koohestani ◽

Faeze Salmani

Keyword(s):

Heat Treatment ◽

Chemical Composition ◽

Nondestructive Evaluation ◽

Statistical Modeling ◽

Evaluation Method ◽

Carbon Steels ◽

Modeling Approach ◽

Treatment Characteristics

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Application of Internal Friction Damping as a Nondestructive Evaluation Technique for Wire Rope

10.4043/4634-ms ◽

1983 ◽

Author(s):

A.A. Hochrein ◽

A.P. Thiruvengadam ◽

J.R. Sherrard

Keyword(s):

Internal Friction ◽

Nondestructive Evaluation ◽

Wire Rope ◽

Evaluation Technique ◽

Friction Damping

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Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

Advances in Electronic Packaging, Parts A, B, and C ◽

10.1115/ipack2005-73109 ◽

2005 ◽

Cited By ~ 10

Author(s):

Yuhki Sato ◽

Hideo Miura

Keyword(s):

Nondestructive Evaluation ◽

Flip Chip ◽

Evaluation Method ◽

Local Deformation ◽

Blue Laser ◽

Inspection Method ◽

Bonding Structure ◽

Small Change ◽

Non Destructive ◽

Adhesion Condition

A new nondestructive evaluation method of adhesion condition between a Si chip and small metallic bumps in a flip chip bonding structure is proposed. The local deformation of a surface of a Si chip mounted on a substrate increases drastically between two bumps with decrease of the thickness of the chip thinner than 200 μm. The magnitude of the local deformation exceeds 100 nm easily. Once the lack or delamination of the metallic bumps occurs at the interface, the local deformation at a surface of a Si chip around the bump changes remarkably. The change of the magnitude of the local deformation reaches about 50 nm to 600 nm depending on the thickness of the chip. Such a small change of deformation can be measured using a scanning blue laser microscope. Therefore, the adhesion condition of the area-arrayed bumps can be examined by measuring the local deformation of a surface of an LSI chip mounted on a substrate.

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