Approaches to Quantitative Electron Detection in the Scanning Electron Microscope for Topographic Studies

Author(s):  
Jan Hejna

An electron signal in the scanning electron microscope (SEM) usually consists of contributions caused by different contrast mechanisms. The most common in practice are material and topographic contrasts. Quantification of material contrast is rather a simple matter. A backscattered electron detector placed over a specimen gives mainly material contrast which can be quantified by the use of a multichannel analyser like in the energy-dispersive x-ray spectrometry.In case of topographic contrast two problems arise. One of them is dimensional metrology, especially linewidth measurements in microelectronics, the second is reconstruction of a surface relief. The first problem needs detection conditions at which the results of SEM measurements correspond exactly with real dimensions, the second needs a signal which is related with a known formula to a local surface inclination and a procedure for converting the signal into the surface relief.Experiments in the SEM and Monte-Carlo calculations have shown that results of dimensional measurements depend on an energy of a primary beam, on a type of detected electrons (secondary electrons (SE) or backscattered electrons (BSE)) and on a type of a detector.The use of low primary beam voltages and BSE is advisable, The problem of a poor efficiency of BSE detectors at low primary beam voltages can be overcome by accelerating BSE, after they have passed through a grid rejecting SE, by high voltage applied to a scintillator in a BSE detector.

1994 ◽  
Vol 38 ◽  
pp. 539-545 ◽  
Author(s):  
R.R. Goehner ◽  
J.R. Michael

Abstract The development of a new charge coupled device (CCD)-based detector for the scanning electron microscope (SEM) has allowed high quality backscattered electron Kikuchi patterns (BEKP) suitable for crystallographic analysis to be collected. These BEKPs can be used for crystallographic texture, phase and microstress analysis. This CCD detector system, can also be equipped with a special filter for removing backscattered electrons, which allows us to image low intensity, highly divergent x-ray diffraction (Kossel) patterns. The Kossel patterns are utilized for the accurate measurement of d-spacings suitable foe residual stress and lattice parameter measurements.


2008 ◽  
Vol 16 (4) ◽  
pp. 62-63
Author(s):  
V.M. Dusevich ◽  
J.H. Purk ◽  
J.D. Eick

Coloring pictures is an educational exercise, which is fun, and helps develop important skills. Coloring SEM micrographs is especially suitable for electron microscopists. Color micrographs are not just great looking on a lab wall; they inspire both microscopists and students to exercise digital picture manipulation. Many microscopists enjoyed looking at the beautiful color micrographs by D. Scharf, but were frustrated to learn they needed a very particular scanning electron microscope equipped with multiple secondary electron detectors in order to color their own pictures. Fortunately, there are other ways to color SEM micrographs. Most SEMs are equipped with at least two detectors, for secondary and backscattered electrons.


2021 ◽  
Vol 143 (4) ◽  
Author(s):  
Zheng Min ◽  
Yingjie Wu ◽  
Kailai Yang ◽  
Jin Xu ◽  
Sarwesh Narayan Parbat ◽  
...  

Abstract Microchannel manufacturing is one of the fastest growing areas in advanced manufacturing with numerous applications, including turbine blade cooling structures, compact microchannel heat exchangers, and electronic cooling devices. Recent development of metallic additive manufacturing (AM) based on direct metal laser sintering technology is capable of fabricating microscale structures with high complexity and design flexibility. However, powder bed laser sintering process produces rough surface characteristics caused by hatch overlaps and particle attachments, leading to channel size reductions and rough surfaces. In this paper, dimensional metrology of cross-sectional views of multirow microchannels made by AM was conducted by a scanning electron microscope (SEM) at different locations along the printing direction. Channel size reduction, surface roughness, and circularity tolerance of the as-printed channels were analyzed based on micrographs captured by SEM. Results showed that both channel sizes and hole pitches affected the printing qualities of microchannels. The as-printed channel sizes reduced by more than 15% compared to the designed values. Two approaches were made in this paper to improve printing qualities. The first one was to redesign channel size in computer-aided design (CAD) model to make the as-printed channel sizes closer to the objective values. Electrochemical polishing (ECP) was then applied as a second way using sulfuric acid solutions. Surface roughness value was reduced by more than 40% after the ECP process.


2014 ◽  
Vol 668-669 ◽  
pp. 936-939
Author(s):  
Quan Wen ◽  
Zhao Yang Ding ◽  
Fu Sheng Kou ◽  
Peng Zhou

Mechanism and functions of S-4800 Scanning Electron Microscope are introduced in this paper. The image-forming mechanism and structure of SEM are studied, and the signal transformation of secondary electron and backscattered electron is presented. The main application fields of SEM are researched.


2004 ◽  
Vol 19 (2) ◽  
pp. 100-103 ◽  
Author(s):  
R. P. Goehner ◽  
J. R. Michael

The identification of crystallographic phases in the scanning electron microscope (SEM) has been limited by the lack of a simple way to obtain electron diffraction data of an unknown while observing the microstructure of the specimen. With the development of charge coupled device (CCD)-based detectors, backscattered electron Kikuchi patterns, alternately referred to as electron backscattered diffraction (EBSD) patterns, can be easily collected. Previously, EBSD has been limited to crystallographic orientation studies due to the poor pattern quality collected with video rate detector systems. With CCD detectors, a typical EBSD can now be acquired from a micron or submicron sized crystal using an exposure time of 1–10 s with an accelerating voltage of 10–40 kV and a beam current as low as 0.1 nA. Crystallographic phase analysis using EBSD is unique in that the properly equipped SEM permits high magnification images, EBSDs, and elemental information to be collected from bulk specimens. EBSD in the SEM has numerous advantages over other electron beam-based crystallographic techniques. The large angular view (∼70°) provided by EBSD and the ease of specimen preparation are distinct advantages of the technique. No sample preparation beyond what is commonly used for SEM specimens is required for EBSD.


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