scholarly journals Characterisation of Epitaxial Lateral Overgrown GaN by Electron Backscatter Diffraction Correlated with Cross-Sectional Cathodoluminescence Spectroscopy

2006 ◽  
Vol 12 (S02) ◽  
pp. 1516-1517
Author(s):  
F Sweeney ◽  
C Trager-Cowan ◽  
P Edwards ◽  
A Wilkinson ◽  
I Watson

Extended abstract of a paper presented at Microscopy and Microanalysis 2006 in Chicago, Illinois, USA, July 30 – August 3, 2005

2000 ◽  
Vol 6 (S2) ◽  
pp. 954-955
Author(s):  
Steven R. Claves ◽  
Wojciech Z. Misiolek ◽  
William H. Van Geertruyden ◽  
David B. Williams

Electron Backscattering Diffraction (EBSD) is an important tool for analyzing the crystal grain orientation of a microstructure and can be used to formulate conclusions about microtexture, texture determined from individual grains. This technique has been used to study a 6xxx series aluminum alloy's response to the deformation of the extrusion process. Extrusion is the process by which a billet of material is forced, under high pressure, through a die. The material undergoes a significant decrease in cross sectional area, and is formed into a shape equivalent to the geometry of the die orifice. Different bearing lands are shown in shown in Figure 1. These surfaces form the part, and are designed to control the metal flow making it uniform through the die, thus yielding good mechanical properties. This research was focused on the resultant microstructure. The shaded regions of Figure 2 show the two surface regions where EBSD measurements were taken.


Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


Sign in / Sign up

Export Citation Format

Share Document