Tailor Made Conductivities of Polymer Matrix for Thermal Management: Design and Development of Three-Dimensional Carbonaceous Nanostructures

2017 ◽  
Vol 56 (3) ◽  
pp. 672-679 ◽  
Author(s):  
Neeru Tiwari ◽  
Neha Agarwal ◽  
Debmalya Roy ◽  
Kingsuk Mukhopadhyay ◽  
Namburi Eswara Prasad
Keyword(s):  
Thermal Management ◽  
Polymer Matrix ◽  
Three Dimensional ◽  
Design And Development

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim
Keyword(s):  
Integrated Circuits ◽  
Mass Flow Rate ◽  
Thermal Management ◽  
Mass Flow ◽  
Flow Rate ◽  
Single Phase ◽  
Hot Spot ◽  
Three Dimensional ◽  
Two Phase ◽  
Two Phase Cooling

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

Thermal Management of Air-Cooling Lithium-Ion Battery Pack

2021 ◽  
Vol 38 (11) ◽  
pp. 118201
Author(s):  
Jianglong Du ◽  
Haolan Tao ◽  
Yuxin Chen ◽  
Xiaodong Yuan ◽  
Cheng Lian ◽  
...  
Keyword(s):  
Lithium Ion Battery ◽  
Thermal Management ◽  
Thermal Performance ◽  
Three Dimensional ◽  
Lithium Ion ◽  
Battery Pack ◽  
Cooling Effect ◽  
Air Cooling ◽  
Safety Issues ◽  
Battery Packs

Lithium-ion battery packs are made by many batteries, and the difficulty in heat transfer can cause many safety issues. It is important to evaluate thermal performance of a battery pack in designing process. Here, a multiscale method combining a pseudo-two-dimensional model of individual battery and three-dimensional computational fluid dynamics is employed to describe heat generation and transfer in a battery pack. The effect of battery arrangement on the thermal performance of battery packs is investigated. We discuss the air-cooling effect of the pack with four battery arrangements which include one square arrangement, one stagger arrangement and two trapezoid arrangements. In addition, the air-cooling strategy is studied by observing temperature distribution of the battery pack. It is found that the square arrangement is the structure with the best air-cooling effect, and the cooling effect is best when the cold air inlet is at the top of the battery pack. We hope that this work can provide theoretical guidance for thermal management of lithium-ion battery packs.

3D-Printed Conductive Filaments Based on Carbon Nanostructures Embedded in a Polymer Matrix

2021 ◽  
pp. 1725-1742
Author(s):  
Diogo José Horst ◽  
Pedro Paulo Andrade Junior
Keyword(s):  
Polymer Matrix ◽  
Carbon Nanostructures ◽  
Three Dimensional ◽  
Full Potential ◽  
Electrically Conductive ◽  
Three Dimensional Printing ◽  
Current State ◽  
3D Printed ◽  
The Subject ◽  
Dimensional Printing

Conductive and magnetic filaments are revolutionizing three-dimensional printing (3DP) to a new level. This review study presents the current state of the art on the subject, summarizing recent high impact studies about main advances regarding the application of 3DP filaments based on carbon nanostructures such as graphene, carbon fibers, nanotubes, and conductive carbon black embedded in a polymer matrix, by reviewing its main characteristics and showing the main producers and also the products available on the market. The availability of inexpensive, reliable, and electrically conductive material will be indispensable for the fabrication of circuits and sensors before the full potential of 3DP for customized products incorporating electrical elements can be fully explored.

Design and Development of a Three-Dimensional Printing High-Throughput Melt Electrowriting Technology Platform

2019 ◽  
Vol 6 (2) ◽  
pp. 82-90 ◽  
Author(s):  
Felix M. Wunner ◽  
Sebastian Eggert ◽  
Joachim Maartens ◽  
Onur Bas ◽  
Paul D. Dalton ◽  
...  
Keyword(s):  
High Throughput ◽  
Three Dimensional ◽  
Design And Development ◽  
Three Dimensional Printing ◽  
Technology Platform ◽  
Dimensional Printing

DEVELOPMENT OF VIRTUAL TRADITIONAL HOUSE FOR INTERACTIVE REAL-TIME NAVIGATION

2015 ◽  
Vol 75 (3) ◽  
Author(s):  
Juliana A. Abu Bakar ◽  
Chew Shiaujing ◽  
Ooi Wooisim ◽  
Pang Chongmeng ◽  
Hafizatul H. Abdrahman ◽  
...  
Keyword(s):  
3D Reconstruction ◽  
Real Time ◽  
Virtual Environment ◽  
Three Dimensional ◽  
User Evaluation ◽  
Design And Development ◽  
Historical Information ◽  
Visual Aesthetics ◽  
Virtual Heritage ◽  
Future Work

Virtual heritage is able to provide visual aesthetics, real-time navigation and interaction to impress and entertain users. This article describes the design and development of three dimensional (3D) virtual heritage to view and navigate the 3D representation of Malay traditional house which is rare to be found today. The Virtual Traditional House allows flexible exploration with real-time navigation in order for users to walkthrough the 3D reconstruction of the house while viewing relevant historical information at certain parts of the house. The process of design and development of Virtual Traditional House is outlined and points of particular importance are explained. The article discusses the preliminary results of user evaluation for Virtual Traditional House. Future work includes extensive user evaluation and to what extend user may absorb the historical information surfaced around the virtual environment.

Mechanical Characterization of Fiber Fabrics

2010 ◽  
Author(s):  
Iulian-Gabriel Birsan ◽  
Adrian Circiumaru ◽  
Vasile Bria ◽  
Igor Roman ◽  
Victor Ungureanu
Keyword(s):  
Carbon Fiber ◽  
Polymer Matrix ◽  
Complex Structure ◽  
Three Dimensional ◽  
Textile Composites ◽  
Simple Type ◽  
Carbon Filaments ◽  
Elastic Interface ◽  
Fiber Fabric

Fabric reinforced or textile composites are increasingly used in aerospace, automotive, naval and other applications. They are convenient material forms providing adequate stiffness and strength in many structures. In such applications they are subjected to three-dimensional states of stress coupled with hydro-thermal effects. Assuming that a composite material is a complex structure it is obvious that is hard to describe all its properties in terms of its parts properties. The properties of the composite depend not only on the properties of the components but on quality and nature of the interface between the components and its properties. As reinforcement two types of fiber fabric were used; first one is a simple type fabric of untwisted tows of carbon filaments while the second one is also simple type but as yarn and fill are used alternately untwisted tows of carbon and aramide filaments. There were some problems to be solved before molding: fabric stability during handling, cutting, imbuing the carbon and aramide tows are slipping one on each other leading to fabric defects; generally the epoxy systems do not adhere to the carbon fiber; in order to obtain a valuable material the nature of interface must be the same for polymer-carbon fiber and polymer aramide fiber. In order to solve these problems the two fabrics were covered (by spraying) with a thin film of PNB rubber. Into the rubber solution were also dispersed small amounts of clay (to create a better interface) and carbon black (to improve the electrical conductivity). The rubber presence solves the fabric stability problem; ensures the same type of interface between fibers and polymer matrix; ensures a more elastic interface between fibers and polymer matrix. This treatment induces modification on tensile behavior of fabrics. This study is about mechanical evaluation of such fabrics.

Assessment of Some Integrated Cooling Mechanisms for an Active IPEM

2004 ◽  
Author(s):  
Y. Pang ◽  
E. Scott ◽  
J. D. van Wyk ◽  
Z. Liang
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Three Dimensional ◽  
The Other ◽  
Other Hand ◽  
3D Packaging ◽  
3D Package

With the growing demands on the performance, cost, and advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging. On the other hand, thermal management of the 3D package becomes a very important issue. This paper assesses the various possibilities of integrated thermal management for integrated power electronics modules (IPEMs).

Heat Conduction in Three Dimensional Stacked Packages

2005 ◽  
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Heat Conduction ◽  
Thermal Management ◽  
Heat Generation ◽  
Analytical Study ◽  
Three Dimensional ◽  
The Other ◽  
Heat Generation Rate ◽  
Potential Applications ◽  
Steady State Heat ◽  
Spatially Varying

This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of such domains may be considered in the current study. The thermal conductivity and thickness of these domains may be different. The entire geometry composed of these connected domains is considered as adiabatic on the lateral surfaces and can be subjected to uniform convective cooling at one end. The other end of the geometry may be adiabatic and a specified, spatially varying heat generation rate can be applied in each of the domains. The solutions are found to be in agreement with known solutions for simpler geometries. The analytical solution presented here is very general in that it takes into account the interface resistances between the layers. One application of this analytical study relates to the thermal management of a 3-D stack of devices and interconnect layers. Another possible application is to the study of hotspots in a chip stack with non uniform heat generation. Many other potential applications may also be simulated.

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