Sono-Assisted Surface Energy Driven Assembly of 2D Materials on Flexible Polymer Substrates: A Green Assembly Method Using Water

2019 ◽  
Vol 11 (36) ◽  
pp. 33458-33464 ◽  
Author(s):  
Dong Zhou ◽  
Ji Hao ◽  
Andy Clark ◽  
Kyunghoon Kim ◽  
Long Zhu ◽  
...  
2008 ◽  
Vol 85 (5-6) ◽  
pp. 1108-1111 ◽  
Author(s):  
K. Sidler ◽  
O. Vazquez-Mena ◽  
V. Savu ◽  
G. Villanueva ◽  
M.A.F. van den Boogaart ◽  
...  

MRS Advances ◽  
2016 ◽  
Vol 1 (30) ◽  
pp. 2199-2206 ◽  
Author(s):  
Monica Michel ◽  
Jay A. Desai ◽  
Alberto Delgado ◽  
Chandan Biswas ◽  
Anupama B. Kaul

ABSTRACT2D materials have shown to be the next step in semiconductor use and device manufacturing that can allow us to reduce the size of most electronics. One of the novel ways to obtain 2D materials is through liquid exfoliation, in which these materials can be obtained by dispersing the smallest possible particles in different solvents. Once obtained, the solutions can be used to manufacture devices via different processes, one of which is inkjet printing. This process relies in selecting “jettable” fluids, which need to have the necessary combination of viscosity and surface energy or “wettability”. In this work we have modified the viscosities and surface energies of five solvents: IPA (Isopropanol), NMP (N-methyl – 2 pyrrolidone), DMA (Dimethylacetamide), DMF (Dimethylformamide) and a mixture of Cyclohexanone / Terpineol 7:3. We have found an avenue to tailor the viscosity of these solvents though the addition of Ethyl Cellulose (EC), where the viscosity has been increased by up to 15 times at an EC concentration of 6%. For inkjet printing, ideally a viscosity of 4 – 10 cP is recommended, which we have been able to achieve with all of the solvents studied. It has been found that the different solvents present different susceptibilities to the EC addition, with DMA and DMF being the least sensitive to the EC addition. We have also studied the change in the drop dynamics and interactions of the 2D solutions with the substrate. Through this analysis we have found solvents that appear to be attractive for inkjet printing of MoS2 and graphite.


2009 ◽  
Vol 20 (29) ◽  
pp. 295302 ◽  
Author(s):  
Xugang Xiong ◽  
Chia-Ling Chen ◽  
Peter Ryan ◽  
Ahmed A Busnaina ◽  
Yung Joon Jung ◽  
...  

2003 ◽  
Vol 782 ◽  
Author(s):  
Jin-Hyung Lee ◽  
Hyun-Woo Lim ◽  
Jin-Goo Park ◽  
Eun-Kyu Lee ◽  
Yangsun Kim

ABSTRACTHot embossing has been widely accepted as an alternative to photolithography in generating patterns on polymer substrates. The optimization of embossing process should be accomplished based on polymer surface properties. Therefore, in this paper, polymers with different surface characteristic were selected and the surface properties of each polymers such as surface energy and adhesion force were investigated by contact angle and AFM. Based on these results, the imprinted nano patterns were compared. Silicon molds with nano size patterns were fabricated by e-beam direct writing. Molds were coated with self-assembled monolayer (SAM) of (1, 1, 2, 2H –perfluorooctyl)-trichlorosilane to reduce the stiction between molds and polymer substrates. For embossing, pressure of 500 psi, embossing time of 5 min and temperature of above transition temperature were applied. Mr-I 8010 polymer (Micro Resist Technology), Polymethylmethacrylate (PMMA 495k) and LOR (polyaliphatic imide copolymer) were used as substrate for hot embossing process development in nano size. These polymers were spun coated on the Si wafer with the thickness of 150 nm. The nano size patterns obtained by hot embossing were identified by atomic force microscopy without breaking the pattern and compared based on the polymer surface properties. The mr-I 8010 which has the lowest surface energy and adhesion force shows the best demolding property.


2020 ◽  
Vol 846 ◽  
pp. 156368
Author(s):  
Mohammad Shahnawaze Ansari ◽  
Mohd Hafiz Dzarfan Othman ◽  
Mohammad Omaish Ansari ◽  
Sana Ansari ◽  
Huda Abdullah ◽  
...  

2006 ◽  
Vol 153 (10) ◽  
pp. F244 ◽  
Author(s):  
T. N. Chen ◽  
D. S. Wuu ◽  
C. C. Wu ◽  
C. C. Chiang ◽  
Y. P. Chen ◽  
...  

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