scholarly journals Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

ACS Omega ◽  
2021 ◽  
Author(s):  
Ying Wang ◽  
Bo Tang ◽  
Yuan Gao ◽  
Xinfeng Wu ◽  
Jin Chen ◽  
...  
Author(s):  
E. A. Nikolaeva ◽  
A. N. Timofeev ◽  
K. V. Mikhaylovskiy

This article describes the results of the development of a high thermal conductivity carbon fiber reinforced polymer based on carbon fiber from pitch and an ENPB matrix modified with a carbon powder of high thermal conductivity. Data of the technological scheme of production and the results of determining the physicomechanical and thermophysical characteristics of carbon fiber reinforced polymer are presented. 


Author(s):  
Zulfiqar Ali ◽  
Xiangdong Kong ◽  
Maohua Li ◽  
Xiao Hou ◽  
Linhong Li ◽  
...  

Carbon ◽  
2021 ◽  
Vol 174 ◽  
pp. 758-759
Author(s):  
Bao-liu Li ◽  
Jian-guang Guo ◽  
Bing Xu ◽  
Hui-tao Xu ◽  
Zhi-jun Dong ◽  
...  

2017 ◽  
Vol 88 (20) ◽  
pp. 2353-2361 ◽  
Author(s):  
Wei Fan ◽  
Dan-dan Li ◽  
Jia-lu Li ◽  
Juan-zi Li ◽  
Lin-jia Yuan ◽  
...  

To investigate the reinforcement architectures effect on the electromagnetic wave properties of carbon fiber reinforced polymer composites, three-dimensional (3D) interlock woven fabric/epoxy composites, 3D interlock woven fabric with stuffer warp/epoxy composites, and 3D orthogonal woven fabric/epoxy composites were studied by the free-space measurement system. The results showed that the three types of 3D woven carbon fiber fabric/epoxy composites had a slight difference in electromagnetic wave properties and the absorption was their dominant radar absorption mechanism. The electromagnetic wave absorption properties of the three types of composites were more than 90% (below −10 dB) over the 11.2–18 GHz bandwidth, and more than 60% (below −4 dB) over the 8–12 GHz bandwidth. Compared with unidirectional carbon fiber reinforced plastics, the three kinds of 3D woven carbon fiber fabric/epoxy composites exhibited better electromagnetic wave absorption properties over a broadband frequency range of 8–18 GHz. Therefore, the three kinds of 3D woven composite are expected to be used as radar absorption structures due to their excellent mechanical properties and outstanding absorption capacity. The total electromagnetic interference shielding effectiveness of the three types of 3D carbon fiber woven composites are all larger than 46 dB over the 8–12 GHz bandwidth, which is evidence that the three types of 3D carbon fiber woven composites can be used as excellent shielding materials for electromagnetic interference.


2018 ◽  
Vol 140 (5) ◽  
Author(s):  
X. Bai ◽  
C. Hasan ◽  
M. Mobedi ◽  
A. Nakayama

A general expression has been obtained to estimate thermal conductivities of both stochastic and periodic structures with high-solid thermal conductivity. An air layer partially occupied by slanted circular rods of high-thermal conductivity was considered to derive the general expression. The thermal conductivity based on this general expression was compared against that obtained from detailed three-dimensional numerical calculations. A good agreement between two sets of results substantiates the validity of the general expression for evaluating the stagnant thermal conductivity of the periodic structures. Subsequently, this expression was averaged over a hemispherical solid angle to estimate the stagnant thermal conductivity for stochastic structures such as a metal foam. The resulting expression was found identical to the one obtained by Hsu et al., Krishnan et al., and Yang and Nakayama. Thus, the general expression can be used for both stochastic and periodic structures.


2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.


2020 ◽  
Vol 186 ◽  
pp. 107915 ◽  
Author(s):  
Yong Sik Yeom ◽  
Kie Yong Cho ◽  
Heun Young Seo ◽  
Jong Suk Lee ◽  
Do Hyun Im ◽  
...  

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.


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