scholarly journals Novel Polyethylene Fibers of Very High Thermal Conductivity Enabled by Amorphous Restructuring

ACS Omega ◽  
2017 ◽  
Vol 2 (7) ◽  
pp. 3931-3944 ◽  
Author(s):  
Bowen Zhu ◽  
Jing Liu ◽  
Tianyu Wang ◽  
Meng Han ◽  
Shah Valloppilly ◽  
...  
1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.


Metals ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1902
Author(s):  
Iva Novakova ◽  
Jaromir Moravec ◽  
Jan Novak ◽  
Pavel Solfronk

Fusion welding of heat-treatable aluminum alloys is generally accompanied by a significant decrease in mechanical properties in the HAZ caused by the dissolution of the hardening phase. The intensity of this decrease in mechanical properties can be reduced by limiting the heat input value. However, this approach is in direct conflict with the principles for welding aluminum and its alloys. Due to the very high thermal conductivity of aluminum alloys, it is necessary to use preheating for thicknesses larger than 5 mm to eliminate non-penetration and cold joints. This paper aims to show the influence of multiple temperature cycles, performed at different preheating temperatures, on changes in the microstructure and mechanical properties. At the same time, the extent to which the original properties of the material can be restored by natural and artificial aging at 160, 175 and 190 °C is also investigated.


1995 ◽  
Vol 416 ◽  
Author(s):  
Akikazu Maesono ◽  
Ronald. P. Tye

ABSTRACTMany applications of thin films, especially for electronics devices, require that these materials, which are often anisotropic, have a very high thermal conductivity as well as uniform areal properties to ensure that reproducible performance be attained. These factors necessitate that measurements of thermal transport properties are required both to provide absolute application values for different heat flow directions as well as to evaluate uniformity and homogeneity of a wafer. For diamond, the combination of a very high thermal conductivity with limited size and form of available specimen presents unique challenges to the experimentalist. As a result, a modification of the ac calorimeter method has been developed to evaluate the thermal diffusivity of thin films.Details of the technique will be provided together with examples of its use to evaluate thermal diffusivity and thermal conductivity of different CVD diamond film composites having thicknesses from 10µm to 600µm and free-standing films. In addition, results using this method will be compared. with those obtained by other techniques involved in a recent international round-robin measurements program designed to evaluate a potential standard method(s).


Alloy Digest ◽  
2005 ◽  
Vol 54 (12) ◽  

Abstract Wieland K-88 is a copper alloy with very high electrical and thermal conductivity, good strength, and excellent stress relaxation resistance at elevated temperatures. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: CU-738. Producer or source: Wieland Metals Inc.


2013 ◽  
Vol 28 (12) ◽  
pp. 1338-1344 ◽  
Author(s):  
Jian-Feng LIN ◽  
Guan-Ming YUAN ◽  
Xuan-Ke LI ◽  
Zhi-Jun DONG ◽  
Jiang ZHANG ◽  
...  

Author(s):  
E. A. Nikolaeva ◽  
A. N. Timofeev ◽  
K. V. Mikhaylovskiy

This article describes the results of the development of a high thermal conductivity carbon fiber reinforced polymer based on carbon fiber from pitch and an ENPB matrix modified with a carbon powder of high thermal conductivity. Data of the technological scheme of production and the results of determining the physicomechanical and thermophysical characteristics of carbon fiber reinforced polymer are presented. 


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