Experimental Investigation of the Thermal Conductivity of Dibutyl- and Diisobutyl Sebacates at High Temperatures and Pressures

2003 ◽  
Vol 76 (6) ◽  
pp. 1409-1411
Author(s):  
É. M. Godzhaev ◽  
É. A. Mamedov ◽  
É. G. Kerimov ◽  
M. A. Guseinov
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
High Temperatures

scholarly journals Lightweight cementitious composites containing cenospheres and polypropylene fibres after exposure to high temperatures

2020 ◽  
Vol 322 ◽  
pp. 01028
Author(s):  
Wojciech Szymkuć ◽  
Piotr Tokłowicz
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
Compressive Strength ◽  
High Temperatures ◽  
Room Temperature ◽  
Cementitious Composites ◽  
Low Density ◽  
Polypropylene Fibres ◽  
Residual Compressive Strength ◽  
Positive Effect

The paper presents the results of experimental investigation of lightweight cementitious composites with cenospheres (LCCC) exposed to high temperatures. We showed the positive effect of cenospheres on post- fire residual compressive strength in previous papers. This paper focuses on the LCCC with the addition of polypropylene (PP) fibres. Specimens are heated up to 400, 600, 800, 1000 and 1200 °C. Then they are cooled to ambient temperature and their residual flexural and compressive strength is tested. The results are compared with non-heated specimens with compressive strength above 50 MPa. For plain LCCC composites, the results show significant improvement of residual compressive strength in comparison with typical concretes. No significant changes of compressive strength are found after exposure to temperatures up to 600°C – more than 85 % of the residual compressive strength is retained after exposure to this temperature for both mixes. Polypropylene fibres are found to be a successful mean to mitigate spalling without significantly lowering neither ambient nor residual compressive strength. Moreover, designed composite has low density and low thermal conductivity at room temperature.

Experimental investigation of extinction properties and thermal conductivity of metal-coated dielectric fibers in vacuum

1987 ◽  
Vol 8 (2) ◽  
pp. 263-280 ◽  
Author(s):  
H. Reiss ◽  
F. Schmaderer ◽  
G. Wahl ◽  
B. Ziegenbein ◽  
R. Caps
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation

Effects of Nb doping on thermoelectric properties of Zn4Sb3 at high temperatures

2009 ◽  
Vol 24 (2) ◽  
pp. 430-435 ◽  
Author(s):  
D. Li ◽  
H.H. Hng ◽  
J. Ma ◽  
X.Y. Qin
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
High Temperatures ◽  
Thermoelectric Properties ◽  
Figure Of Merit ◽  
Thermoelectric Performance ◽  
Temperature Range ◽  
A Value ◽  
Nb Doping ◽  
Thermal Conductivities

The thermoelectric properties of Nb-doped Zn4Sb3 compounds, (Zn1–xNbx)4Sb3 (x = 0, 0.005, and 0.01), were investigated at temperatures ranging from 300 to 685 K. The results showed that by substituting Zn with Nb, the thermal conductivities of all the Nb-doped compounds were lower than that of the pristine β-Zn4Sb3. Among the compounds studied, the lightly substituted (Zn0.995Nb0.005)4Sb3 compound exhibited the best thermoelectric performance due to the improvement in both its electrical resistivity and thermal conductivity. Its figure of merit, ZT, was greater than the undoped Zn4Sb3 compound for the temperature range investigated. In particular, the ZT of (Zn0.995Nb0.005)4Sb3 reached a value of 1.1 at 680 K, which was 69% greater than that of the undoped Zn4Sb3 obtained in this study.

Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process

1991 ◽  
Vol 226 ◽  
Author(s):  
Wang Chunqing ◽  
Qian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Thermal Conductivity ◽  
Numerical Simulation ◽  
Experimental Investigation ◽  
Thermal Process ◽  
Light Wave ◽  
Light Reflection ◽  
Lead Wire ◽  
Wire Surface ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

AbstractIn this paper,a numerical simulation of thermal process in the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials all have been considered. In order to carry this numerical calculation practice and prove it's results,the reflexive characteristic of light wave to the SMT materials has been gauged,and the dynamic temperature process of laser microjoint has been measured by a new experimental method which was invented by the authors.The results of numerical simulation have been borne out by the tests, and the influences of heating parameters on thermal process has been analysed in this paper.The conclusions will be advantageous to the further study of the microjoint quality control in the SMT laser microsoldering.

ON MEASUREMENT OF THERMAL CONDUCTIVITY AT HIGH TEMPERATURES

1961 ◽  
Vol 39 (7) ◽  
pp. 1029-1039 ◽  
Author(s):  
M. J. Laubitz
Keyword(s):  
Thermal Conductivity ◽  
Heat Flow ◽  
High Temperatures ◽  
Mathematical Analysis ◽  
Temperature Range ◽  
Linear Heat ◽  
Flow Systems

A method is given for exact mathematical analysis of linear heat flow systems used in measuring thermal conductivity at high temperatures. It is shown that a popular version of such a system is very sensitive to the alignment of its components, which seriously limits the temperature range of its satisfactory use.

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