scholarly journals Morphological and nanomechanical changes in tungsten in high heat flux conditions

2020 ◽  
Vol 4 (1) ◽  
Author(s):  
Minsuk Seo ◽  
John R. Echols ◽  
A. Leigh Winfrey
Keyword(s):  
Heat Flux ◽  
High Temperature ◽  
Extreme Environments ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Temperature Plasma ◽  
Electrothermal Plasma ◽  
Thermally Driven ◽  
Edge Localized Modes

Abstract Morphological and nanomechanical alteration of tungsten in extreme environments, like those in edge localized modes in nuclear fusion environments, up to 46.3 GWm−2 heat fluxes were experimentally simulated using electrothermal plasma. Surface and subsurface damage to the tungsten is seen mainly in the form of pore formation, cracks, and resolidified melt instabilities. Mirco voids, rosette-type microfeatures, core-shell structure, particle enrichment, and submicron channels all manifest in the damaged subsurface. The formation of voids in the subsurface was determined to originate from the ductile fracture of hot tungsten by plastic flow but not developed to cracking. The voids were preferentially settled in grain boundaries, interfaces. The directionality of elongated voids and grains is biased to the heat flow vector or plasma pathway, which is the likely consequence of the thermally driven grain growth and sliding in the high-temperature conditions. The presence of a border between the transient layer and heat-affected zone is observed and attributed to plasma shock and thermal spallation of fractural tungsten at high temperature. Plasma peening-like hardening effects in tungsten were observed in the range of 22.7–46.3 GWm−2 but least in the case of the lowest heat flux, 12.5 GWm−2.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

Design and Calibration of a Novel High Temperature Heat Flux Gage

2005 ◽  
Author(s):  
Sujay Raphael-Mabel ◽  
Scott Huxtable ◽  
Andrew Gifford ◽  
Thomas E. Diller
Keyword(s):  
Heat Flux ◽  
High Temperature ◽  
High Heat ◽  
Heat Flux Sensor ◽  
High Heat Flux ◽  
Average Value ◽  
Metal Plates ◽  
New Type ◽  
Flux Sensor ◽  
Calibration Apparatus

A new type of heat flux sensor (HTHFS) has been designed and constructed for applications at high temperature and high heat flux. It is constructed by connecting solid metal plates to form brass/steel thermocouple junctions in a series circuit. The thermal resistance layer of the HTHFS consists of the thermocouple materials themselves, thus improving temperature limits and lowering the temperature disruption of the sensor. The sensor can even withstand considerable erosion of the surface with little effect on the operation. A new type of convection calibration apparatus was designed and built specifically to supply a large convection heat flux. The heat flux was supplied simultaneously to both a test and standard gage by using two heated jets of air that impinged perpendicularly on the surface of each gage. The sensitivity for the HTHFS was measured to have an average value of 20 μV/(W/cm2). The uncertainty in this result was determined to be ±10% over the entire range tested. The sensitivity agrees with the theoretically calculated sensitivity for the materials and geometry used. Recommendations for future improvements in the construction and use of the sensors are discussed.

Optimization of Refrigeration Systems for High-Heat-Flux Microelectronics

2008 ◽  
Author(s):  
P. E. Phelan ◽  
Y. Gupta ◽  
H. Tyagi ◽  
R. Prasher ◽  
J. Cattano ◽  
...  
Keyword(s):  
Heat Flux ◽  
Energy Consumption ◽  
System Design ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Compressor Inlet

Increasingly, military and civilian applications of electronics require extremely high heat fluxes, on the order of 1000 W/cm2. Thermal management solutions for these severe operating conditions are subject to a number of constraints, including energy consumption, controllability, and the volume or size of the package. Calculations indicate that the only possible approach to meeting this heat flux condition, while maintaining the chip temperature below 50 °C, is to utilize refrigeration. Here we report an initial optimization of the refrigeration system design. Because the outlet quality of the fluid leaving the evaporator must be held to approximately less than 20%, in order to avoid reaching critical heat flux, the refrigeration system design is dramatically different from typical configurations for household applications. In short, a simple vapor-compression cycle will require excessive energy consumption, largely because of the superheat required to return the refrigerant to its vapor state before the compressor inlet. A better design is determined to be a “two-loop” cycle, in which the vapor-compression loop is coupled thermally to a primary loop that directly cools the high-heat-flux chip.

Integrated Vapor Chamber Heat Spreader for Power Module Applications

2017 ◽  
Author(s):  
Clayton L. Hose ◽  
Dimeji Ibitayo ◽  
Lauren M. Boteler ◽  
Jens Weyant ◽  
Bradley Richard
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Coefficient Of Thermal Expansion ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Power Module ◽  
Heat Spreader

This work presents a demonstration of a coefficient of thermal expansion (CTE) matched, high heat flux vapor chamber directly integrated onto the backside of a direct bond copper (DBC) substrate to improve heat spreading and reduce thermal resistance of power electronics modules. Typical vapor chambers are designed to operate at heat fluxes > 25 W/cm2 with overall thermal resistances < 0.20 °C/W. Due to the rising demands for increased thermal performance in high power electronics modules, this vapor chamber has been designed as a passive, drop-in replacement for a standard heat spreader. In order to operate with device heat fluxes >500 W/cm2 while maintaining low thermal resistance, a planar vapor chamber is positioned onto the backside of the power substrate, which incorporates a specially designed wick directly beneath the active heat dissipating components to balance liquid return and vapor mass flow. In addition to the high heat flux capability, the vapor chamber is designed to be CTE matched to reduce thermally induced stresses. Modeling results showed effective thermal conductivities of up to 950 W/m-K, which is 5 times better than standard copper-molybdenum (CuMo) heat spreaders. Experimental results show a 43°C reduction in device temperature compared to a standard solid CuMo heat spreader at a heat flux of 520 W/cm2.

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Craig Green ◽  
Peter Kottke ◽  
Xuefei Han ◽  
Casey Woodrum ◽  
Thomas Sarvey ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Cooling ◽  
Fluidic Routing

Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

scholarly journals Experimental characterization of the hypersonic flow around a cuboid

2020 ◽  
Vol 61 (7) ◽  
Author(s):  
Thomas W. Rees ◽  
Tom B. Fisher ◽  
Paul J. K. Bruce ◽  
Jim A. Merrifield ◽  
Mark K. Quinn
Keyword(s):  
Heat Flux ◽  
Hypersonic Flow ◽  
Stagnation Point ◽  
Separation Bubble ◽  
Reynolds Numbers ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Simple Method ◽  
High Reynolds

Abstract Understanding the hypersonic flow around faceted shapes is important in the context of the fragmentation and demise of satellites undergoing uncontrolled atmospheric entry. To better understand the physics of such flows, as well as the satellite demise process, we perform an experimental study of the Mach 5 flow around a cuboid geometry in the University of Manchester High SuperSonic Tunnel. Heat fluxes are measured using infrared thermography and a 3D inverse heat conduction solution, and flow features are imaged using schlieren photography. Measurements are taken at a range of Reynolds numbers from $${40.0 \times 10^3}$$ 40.0 × 10 3 to $${549 \times 10^3}$$ 549 × 10 3 . The schlieren results suggest the presence of a separation bubble at the windward edge of the cube at high Reynolds numbers. High heat fluxes are observed near corners and edges, which are caused by boundary-layer thinning. Additionally, on the side (off-stagnation) faces of the cube, we observe wedge-shaped regions of high heat flux emanating from the windward corners of the cube. We attribute these to vortical structures being generated by the strong expansion around the cube’s corners. We also observe that the stagnation point of the cube is off-centre of the windward face, which we propose is due to sting flex under aerodynamic loading. Finally, we propose a simple method of calculating the stagnation point heat flux to a cube, as well as relations which can be used to predict hypersonic heat fluxes to cuboid geometries such as satellites during atmospheric re-entry. Graphic abstract

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Fabio Battaglia ◽  
Farah Singer ◽  
David C. Deisenroth ◽  
Michael M. Ohadi
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Forced Convection ◽  
Heat Removal ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Two Phase ◽  
Total Thermal Resistance

Abstract In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. The force-fed manifold microchannel cooling concept was utilized to substantially improve the cooling performance. In our design, the heat sink was integrated with the simulated heat source, through a single solder layer and substrate, thus reducing the total thermal resistance. The system was characterized and tested experimentally in two different configurations: the passive (buoyancy-driven) loop and the forced convection loop. Parametric studies were conducted to examine the role of different controlling parameters. It was demonstrated that the thermosiphon loop can handle heat fluxes in excess of 200 W/cm2 with a cooling thermal resistance of 0.225 (K cm2)/W for the novel cooling concept and moderate fluctuations in temperature. In the forced convection mode, a more uniform temperature distribution was achieved, while the heat removal performance was also substantially enhanced, with a corresponding heat flux capacity of up to 500 W/cm2 and a thermal resistance of 0.125 (K cm2)/W. A detailed characterization leading to these significant results, a comparison between the performance between the two configurations, and a flow visualization in both configurations are discussed in this paper.

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