scholarly journals Heterogeneous dynamics in the curing process of epoxy resins

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Taiki Hoshino ◽  
Yasushi Okamoto ◽  
Atsushi Yamamoto ◽  
Hiroyasu Masunaga
Keyword(s):  
Physical Properties ◽  
Epoxy Resin ◽  
Correlation Spectroscopy ◽  
Resonance Spectroscopy ◽  
Curing Process ◽  
Microscopic Mechanism ◽  
Curing Conditions ◽  
Temperature Conditions ◽  
Heterogeneous Dynamics ◽  
Microscopic Dynamics

AbstractEpoxy resin is indispensable for modern industry because of its excellent mechanical properties, chemical resistance, and excellent moldability. To date, various methods have been used to investigate the physical properties of the cured product and the kinetics of the curing process, but its microscopic dynamics have been insufficiently studied. In this study, the microscopic dynamics in the curing process of a catalytic epoxy resin were investigated under different temperature conditions utilizing X-ray photon correlation spectroscopy. Our results revealed that the temperature conditions greatly affected the dynamical heterogeneity and cross-linking density of the cured materials. An overview of the microscopic mechanism of the curing process was clearly presented through comparison with the measurement results of other methods, such as 1H-pulse nuclear magnetic resonance spectroscopy. The quantification of such heterogeneous dynamics is particularly useful for optimizing the curing conditions of various materials to improve their physical properties.

scholarly journals Effect of curing conditions on the cutting resistance of fabrics coated with inorganic-powder-reinforced epoxy composite

RSC Advances ◽  
2020 ◽  
Vol 10 (55) ◽  
pp. 33576-33584
Author(s):  
Xuefeng Yan ◽  
Leilei Wu ◽  
Shanshan Jin ◽  
Wei Zhao ◽  
Haijian Cao ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Polyethylene Terephthalate ◽  
Epoxy Composite ◽  
Curing Process ◽  
Curing Conditions ◽  
Cutting Resistance ◽  
Thermosetting Epoxy

Inorganic powders, SiO2 and Al2O3, were used as reinforcements and thermosetting epoxy resin was utilized as a matrix to manufacture IP/epoxy preform, which was coated on the surfaces of 2/1 twill woven polyethylene terephthalate fabrics before the final curing process.

Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

2014 ◽  
Vol 936 ◽  
pp. 63-66 ◽  
Author(s):  
Chun Hua Han ◽  
Lin Wang ◽  
Dong Yu Zhao
Keyword(s):  
Epoxy Resin ◽  
Room Temperature ◽  
Curing Agent ◽  
Curing Process ◽  
Curing Conditions ◽  
Temperature Spectra ◽  
Infrared Spectral ◽  
Ft Ir ◽  
Ir Analysis ◽  
Epoxy Groups

In this paper low molecular polyamide 651(PA651) is used as the curing agent of epoxy resin. The optimum curing conditions and dosage of the curing agent are obtained by DMA and FT-IR analysis. Based on the dynamic mechanical temperature spectra of samples test, the best curing conditions are room temperature 2 hours, 70°C 2 hours, 125°C 2.5 hours and 150°C 1 hours (RT / 2 h + 70 °C / 2 h +125°C / 2.5 h + 150 °C / 1 h). The best dosage of curing agent PA651 is 50 wt %. Since the analysis of Fourier Infrared spectral verified that epoxy groups react completely, the curing conditions are the best curing process.

A dynamic DSC study of the curing process of epoxy resin

1997 ◽  
Vol 49 (1) ◽  
pp. 123-129 ◽  
Author(s):  
Susumu Tatsumiya ◽  
Katsumasa Yokokawa ◽  
Kyosuke Miki
Keyword(s):  
Epoxy Resin ◽  
Curing Process

scholarly journals Hydrophobic Modification of Graphene Oxide and Its Effect on the Corrosion Resistance of Silicone-Modified Epoxy Resin

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 89
Author(s):  
Wei Yuan ◽  
Qian Hu ◽  
Jiao Zhang ◽  
Feng Huang ◽  
Jing Liu
Keyword(s):  
Contact Angle ◽  
Corrosion Resistance ◽  
Graphene Oxide ◽  
Physical Properties ◽  
Epoxy Resin ◽  
Electrochemical Impedance ◽  
Salt Spray ◽  
X Ray ◽  
Modified Graphene Oxide ◽  
Modified Epoxy

This study modified graphene oxide (GO) with hydrophilic octadecylamine (ODA) via covalent bonding to improve its dispersion in silicone-modified epoxy resin (SMER) coatings. The structural and physical properties of ODA-GO were characterized by field-emission scanning electron microscopy (FE-SEM), X-ray diffraction analysis (XRD), Fourier transform infrared spectroscopy (FT-IR), Raman spectroscopy, X-ray photoelectron spectroscopy (XPS), and contact angle tests. The ODA-GO composite materials were added to SMER coatings by physical mixing. FE-SEM, water absorption, and contact angle tests were used to evaluate the physical properties of the ODA-GO/SMER coatings, while salt spray, electrochemical impedance spectroscopy (EIS), and scanning Kelvin probe (SKP) methods were used to test the anticorrosive performance of ODA-GO/SMER composite coatings on Q235 steel substrates. It was found that ODA was successfully grafted onto the surfaces of GO. The resulting ODA-GO material exhibited good hydrophobicity and dispersion in SMER coatings. The anticorrosive properties of the ODA-GO/SMER coatings were significantly improved due to the increased interfacial adhesion between the nanosheets and SMER, lengthening of the corrosive solution diffusion path, and increased cathodic peeling resistance. The 1 wt.% ODA-GO/SMER coating provided the best corrosion resistance than SMER coatings with other amounts of ODA-GO (including no addition). After immersion in 3.5 wt.% NaCl solution for 28 days, the low-frequency end impedance value of the 1 wt.% ODA-GO/SMER coating remained high, at 6.2 × 108 Ω·cm2.

scholarly journals The effect of curing conditions on the expansion efficiency of MgO expansion agent

2021 ◽  
Vol 233 ◽  
pp. 03047
Author(s):  
Yu Fang ◽  
Li Yongchao
Keyword(s):  
Curing Temperature ◽  
Obvious Effect ◽  
Curing Conditions ◽  
Factors Affecting ◽  
Temperature Conditions ◽  
Low Humidity ◽  
Humidity Environment

In order to further promote the research and application of MgO expansion agent in concrete field, this paper carried out the effect of different humidity and temperature conditions on the expansion properties of mortar and mortar specimens mixed with MgO expansion agent. In addition, the mechanism of the factors affecting the sensitivity of the MgO expansion agent is revealed by combining microscopic technology. The results show that the higher the curing temperature and the greater the curing humidity, the greater the expansion efficiency of the MgO expansion agent. The temperature of 20~40°C has no obvious effect on the efficiency of the MgO expansion agent, but the expansion value of the specimen doubles as the temperature rises to 40~80°C. Besides, the higher the curing humidity, the better the expansion efficiency of the MgO expansion agent, but the MgO expansion agent is more sensitive to the low humidity environment, and the specimen shrinks in the lower humidity environment (RH=60%).

Investigation into the dynamics of physical properties of an epoxy resin during solidification

2009 ◽  
Vol 52 (5) ◽  
pp. 532-540
Author(s):  
V. I. Rimlyand ◽  
V. N. Starikova ◽  
A. V. Bakhantsov
Keyword(s):  
Physical Properties ◽  
Epoxy Resin
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