Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

2014 ◽  
Vol 936 ◽  
pp. 63-66 ◽  
Author(s):  
Chun Hua Han ◽  
Lin Wang ◽  
Dong Yu Zhao

In this paper low molecular polyamide 651(PA651) is used as the curing agent of epoxy resin. The optimum curing conditions and dosage of the curing agent are obtained by DMA and FT-IR analysis. Based on the dynamic mechanical temperature spectra of samples test, the best curing conditions are room temperature 2 hours, 70°C 2 hours, 125°C 2.5 hours and 150°C 1 hours (RT / 2 h + 70 °C / 2 h +125°C / 2.5 h + 150 °C / 1 h). The best dosage of curing agent PA651 is 50 wt %. Since the analysis of Fourier Infrared spectral verified that epoxy groups react completely, the curing conditions are the best curing process.

RSC Advances ◽  
2020 ◽  
Vol 10 (55) ◽  
pp. 33576-33584
Author(s):  
Xuefeng Yan ◽  
Leilei Wu ◽  
Shanshan Jin ◽  
Wei Zhao ◽  
Haijian Cao ◽  
...  

Inorganic powders, SiO2 and Al2O3, were used as reinforcements and thermosetting epoxy resin was utilized as a matrix to manufacture IP/epoxy preform, which was coated on the surfaces of 2/1 twill woven polyethylene terephthalate fabrics before the final curing process.


2015 ◽  
Vol 749 ◽  
pp. 126-128 ◽  
Author(s):  
Ho Kyoung Choi ◽  
Bong Goo Choi ◽  
Yong Yoon Lee ◽  
Jae Sik Na

1-Benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was newly synthesized and characterized with FT-IR, 1H-NMR. We synthesized catalysts fulfill requirements for a rapid cure at a moderately elevated temperature in curing the epoxy resin for neat diglycidyl ether bisphenol A (DGBEA). The cure behavior of this resin was investigated at elevated temperature and cure temperature in the presence of 0.5, 1.0, 2.0 wt% of 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) by mean of differential scanning calorimeter (DSC). Chemical conversion as function of temperature and amount of BMH (0.5, 1.0, 2.0 wt%) were determined from DSC. It was found that BMH were superior latent thermal catalyst for catinonic curing which have a good thermal stability.


2014 ◽  
Vol 1021 ◽  
pp. 3-6
Author(s):  
Hao Ran Zhou ◽  
Hong Xia Li ◽  
Wei Miao Yu

In order to solve the poor toughness, fatigue durability and shock resistance defects of the cured epoxy resin, in this paper, the epoxy resin was modified via dichlorodiphenyl silane as a modifier. Then the electronic packaging materials were prepared using the modified EP as matrix, a nitrile rubber (CTBN) as a toughening agent, methyl nadic anhydride (MNA) as a curing agent, and 2, 4, 6 - tris (dimethyl amino methyl) phenol as a curing accelerator. The effects of raw materials ratio on the cured products’ properties was investigated. FT-IR, TG-DTG and DMA were used to test and characterize the product. And we determined the best raw materials ratio and reaction conditions. Finally epoxy encapsulating materials which have excellent mechanical properties, electrical properties were prepared.


2020 ◽  
Vol 869 ◽  
pp. 240-245
Author(s):  
Alexey Voytik ◽  
Georgiy V. Malkov ◽  
Artur T. Kapasharov ◽  
Alexey Yu. Kostin

The aim of this work was to develop methods for the synthesis of organic aerogels based on epoxy resins and to investigate their properties. Aerogels based on DGEBA-epoxy resin were obtained by CO2-supercritical drying of gel samples prepared from acetone solutions of epoxy resin with different amount of catalyst and solvents. As a result, aerogels of different density were obtained; the dependence of density on the solvent content in the samples was revealed. The aerogels were characterized by infrared spectroscopy to define the degree of conversion of the epoxy groups, by SEM to confirm nanoscale morphology of aerogels, as well as by the BET method to determine the specific surface area of the samples and its dependence on the catalyst content and curing conditions.


2017 ◽  
Vol 77 (2) ◽  
pp. 398-408 ◽  
Author(s):  
A. C. Maganha de Almeida ◽  
J. Backhaus ◽  
C. R. Corso

Abstract A residual liquid inoculum (RLI) was used to decolourise solutions of Acid Yellow 25 (AY25) and Direct Violet 51 (DV51) azo dyes. The RLI was obtained through anaerobic digestion of food waste from a university restaurant. The concentration of bacteria in the RLI was 8.45 × 107 CFU mL−1. Dye solutions (50 μg mL−1) were inoculated with the RLI (20% v/v) and incubated at room temperature. The decolourisation studies took place at microaerophilic and in-batch conditions and at pH = 2.50. Initially, the dyes were taken up from solution by biosorption; maximum colour removal was achieved after 3 hours of incubation, with 88.66% for AY25 and 77.65% of DV51. At prolonged incubation times (3–96 hours) decolourisation was mainly attributed to biodegradation of the azo solutions, with breakage of the azo bond, as detected by UV-VIS spectroscopy and Fourier transform infrared (FT-IR) analysis. Analysis of UV-VIS absorption rates of dyes showed, however, that AY25 was more readily biodegradable whereas DV51 was more recalcitrant to the action of the RLI.


2010 ◽  
Vol 150-151 ◽  
pp. 139-143
Author(s):  
Chi Hui Tsou ◽  
Ya Ming Li ◽  
Wei Hua Yao ◽  
Jen Taut Yeh

Both tensile and tear strength values of PLAxEGMCy blown-film specimens in machine and transverse directions improve significantly and reach the maximum values as their EGMC contents approach an optimum value of 6 wt%. The melt shear viscosity values of PLAxEGMCy resins measured at varying shear rates are significantly higher than those of the PLA resin and increase consistently with their EGMC contents. FT-IR analysis suggest that the carboxylic acid groups of PLA molecules react with the epoxy groups of EGMC molecules during the reactive-extrusion processes of PLAxEGMCy specimens. Further DMA and morphological analysis of PLAxEGMCy specimens reveal that EGMC molecules are phase-separated with PLA molecules at EGMC contents equal to or more than 2 wt%, since distinguished phase-separated EGMC droplets and tanδ transitions were found on fracture surfaces and tanδ curves of PLAxEGMCy specimens, respectively. Possible reasons accounting for the above interesting properties of the PLA/EGMC specimens are proposed in this study.


2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Tanvir Manzur ◽  
Shohana Iffat ◽  
Munaz Ahmed Noor

The conventional external curing process requires supply of large amount of water in addition to mixing water as well as strict quality control protocol. However, in a developing country like Bangladesh, many local contractors do not have awareness and required knowledge on importance of curing which often results in weaker concrete with durability issues. Moreover, at times it is difficult to maintain proper external curing process due to nonavailability of water and skilled laborer. Internal curing can be adopted under such scenario since this method is simple and less quality intensive. Usually, naturally occurring porous light weight aggregates (LWA) are used as internal curing agent. However, naturally occurring LWA are not available in many countries like Bangladesh. Under these circumstances, Super Absorbent Polymer (SAP) can be utilized as an alternative internal curing agent. In this study, sodium polyacrylate (SP) as SAP has been used to produce internally cured concrete. Desorption isotherm of SP has been developed to investigate its effectiveness as internal curing agent. Test results showed that internally cured concrete with SP performed better in terms of both strength and durability as compared to control samples when subjected to adverse curing conditions where supply of additional water for external curing was absent.


1985 ◽  
Vol 63 (7) ◽  
pp. 1510-1517 ◽  
Author(s):  
Pierre D. Harvey ◽  
Ian S. Butler

The Raman spectrum of microcrystalline dodecacarbonyldirhenium(0), Re2(CO)10, has been reinvestigated at 67 K using one of the latest fully-computerized spectrometers available. Previously unobserved peaks have been detected mainly in the 13CO-satellite (2150–1900 cm−1), and overtone and combination regions (1300–700 and 4300–3800 cm−1). This is the first time that Raman-active first CO overtones and combinations of a metal carbonyl complex have been reported. They were earlier thought to be too weak to be detected. Assignments are proposed for the majority of these new peaks together with those from a similar low-temperature (~70 K) FT-ir study. In general, the D4d selection rules are obeyed, but the activity of some forbidden bands reveals that the molecule is slightly distorted in the solid state in agreement with its X-ray structure. The similarity of the low-temperature spectra to those obtained at room temperature indicates that no phase change occurs throughout the temperature range investigated.


2013 ◽  
Vol 668 ◽  
pp. 226-230
Author(s):  
Hao Ran Zhou ◽  
An Sun ◽  
Hao Cheng Yang ◽  
Shuang Zhao

This article the epoxy resin electronic packaging materials was prepared via epoxy resin E-51 as matrix resin, MNA for curing agent, the CTBN as toughening agents, BPO, DMP-30, Al(MM)3, 2E4MZ as curing promoting agents by mechanical blending. The cured condition was 80°C curing 2 h, 90°C curing 2 h, 100°C curing 5 h. The structure of the epoxy resin electronic packaging materials was characterized via FT-IR, the result showed that epoxy resin cured completely. Dynamic mechanical analysis (DMA) is evaluated material thermal stability. The results show that anhydride dosage 7.7 g. The dielectric loss and volume resistivity of epoxy electronic potting were measured via the electrical performance analysis. The results show that epoxy electronic potting having BPO (0.2 g) and DMP-30 (0.1 g) had electrical optimal performance. In the curing process conditions, its performance is meet potting requirements, curing process is feasible.


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