scholarly journals Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

RSC Advances ◽  
2018 ◽  
Vol 8 (45) ◽  
pp. 25835-25845 ◽  
Author(s):  
Cuiping Yu ◽  
Wenbin Gong ◽  
Jun Zhang ◽  
Weibang Lv ◽  
Wei Tian ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Dimensional Stability ◽  
Hot Pressing ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Conductive Composites ◽  
Thermally Conductive

Orientational hBN/SEBS composite films embued with superior thermal conductivity and improved dimensional stability were prepared by hot-pressing treatment.

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000001-00005
Author(s):  
Ya Liu ◽  
Nan Wang ◽  
Lilei Ye ◽  
Abdelhafid Zehri ◽  
Andreas Nylander ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
High Thermal Conductivity ◽  
Thermally Conductive ◽  
Promising Solution ◽  
Mechanical Pressing ◽  
Insulating Properties

Abstract Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m−1 K−1 and 0.485 W m−1 K−1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

Hot-pressing induced alignment of boron nitride in polyurethane for composite films with thermal conductivity over 50 Wm−1 K−1

2018 ◽  
Vol 160 ◽  
pp. 199-207 ◽  
Author(s):  
Cuiping Yu ◽  
Wenbin Gong ◽  
Wei Tian ◽  
Qichong Zhang ◽  
Yancui Xu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Hot Pressing ◽  
Composite Films

Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

2010 ◽  
Vol 20 (14) ◽  
pp. 2749 ◽  
Author(s):  
Kimiyasu Sato ◽  
Hitomi Horibe ◽  
Takashi Shirai ◽  
Yuji Hotta ◽  
Hiromi Nakano ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Conductive Composite ◽  
Thermally Conductive

Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Electronic Devices ◽  
E Coli ◽  
Thermally Conductive ◽  
Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

scholarly journals Surface modification and magnetic alignment of hexagonal boron nitride nanosheets for highly thermally conductive composites

RSC Advances ◽  
2017 ◽  
Vol 7 (69) ◽  
pp. 43380-43389 ◽  
Author(s):  
Feng Yuan ◽  
Weicheng Jiao ◽  
Fan Yang ◽  
Wenbo Liu ◽  
Zhonghai Xu ◽  
...  
Keyword(s):  
Surface Modification ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Thermoplastic Polyurethane ◽  
Magnetic Alignment ◽  
Polyurethane Elastomer ◽  
Conductive Composites ◽  
Boron Nitride Nanosheets ◽  
Thermally Conductive ◽  
Thermoplastic Polyurethane Elastomer

The highly ordered thermoplastic polyurethane elastomer (TPU)/BNNSs composites are successfully prepared by the combination of filler modification and magnetic alignment.

scholarly journals Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 379
Author(s):  
Seonmin Lee ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Film ◽  
Vinyl Alcohol ◽  
Composite Films ◽  
Poly Vinyl Alcohol ◽  
Thermal And Mechanical Properties ◽  
Conduction Path ◽  
Thermally Conductive

Aggregated boron nitride (ABN) is advantageous for increasing the packing and thermal conductivity of the matrix in composite materials, but can deteriorate the mechanical properties by breaking during processing. In addition, there are few studies on the use of Ti3C2 MXene as thermally conductive fillers. Herein, the development of a novel composite film is described. It incorporates MXene and ABN into poly(vinyl alcohol) (PVA) to achieve a high thermal conductivity. Polysilazane (PSZ)-coated ABN formed a heat conduction path in the composite film, and MXene supported it to further improve the thermal conductivity. The prepared polymer composite film is shown to provide through-plane and in-plane thermal conductivities of 1.51 and 4.28 W/mK at total filler contents of 44 wt.%. The composite film is also shown to exhibit a tensile strength of 11.96 MPa, which is much greater than that without MXene. Thus, it demonstrates that incorporating MXene as a thermally conductive filler can enhance the thermal and mechanical properties of composite films.

Insulating and Thermally Conductive Composite Filled with Boron Nitride Particles

2011 ◽  
Vol 391-392 ◽  
pp. 282-286 ◽  
Author(s):  
Jun Peng Li ◽  
Shu Hua Qi ◽  
Fan Xie
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
Filler Content ◽  
Glass Fibers ◽  
High Surface ◽  
Conductive Filler ◽  
Volume Resistivity ◽  
Conductive Composites ◽  
Thermally Conductive

A new kind of thermally conductive composites reinforced by glass fibers with boron nitride (BN) as thermally conductive filler was prepared in heat press molding. Thermal conductivity of the composites was found to increase with increasing in filler content. But impact strength and flexural strength reach the top point, 385.05KJ/m2 and 912.6481MPa, with content of 50wt% and 20wt% respectively. The thermal conductivity of 0.8385 W/mK was obtained at 50wt% filler content. Experimental dates show that mixed matrix of epoxy (EP) and polyimide (PI) displays high thermal stability and can improve thermal stability compared to pure epoxy obviously at 50wt% PI content. Additionally, the obtained composites possess high surface resistivity and volume resistivity, which are suitable for substrate materials.

scholarly journals Polymer composites based on hexagonal boron nitride and their application in thermally conductive composites

RSC Advances ◽  
2018 ◽  
Vol 8 (39) ◽  
pp. 21948-21967 ◽  
Author(s):  
Cuiping Yu ◽  
Jun Zhang ◽  
Wei Tian ◽  
Xiaodong Fan ◽  
Yagang Yao
Keyword(s):  
Boron Nitride ◽  
Polymer Composites ◽  
Hexagonal Boron Nitride ◽  
Conductive Composites ◽  
Thermally Conductive

This review covers the fabrication of h-BN and its application for thermally conductive networks.

Dielectric, thermally conductive, and heat-resistant polyimide composite film filled with silver nanoparticle-modified hexagonal boron nitride

2020 ◽  
Vol 32 (10) ◽  
pp. 1181-1190 ◽  
Author(s):  
Ruiyi Li ◽  
Xiuwei Lv ◽  
Juan Yu ◽  
Xiaodong Wang ◽  
Pei Huang
Keyword(s):  
Boron Nitride ◽  
In Situ Polymerization ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Resistance Index ◽  
Low Dielectric ◽  
Modified Method ◽  
Ag Particles ◽  
Thermal Imidization ◽  
Thermally Conductive

In this study, silver–polydopamine–hexagonal boron nitride (h-BN@Ag) particles were prepared using mussel chemistry and reducibility of catechol. The modified method was simple and eco-friendly. In addition, we prepared h-BN@Ag/polyimide (PI) composite films via in situ polymerization, the scraper method, and thermal imidization. Owing to the good dispersion of the h-BN@Ag filler particles in the PI matrix and the bridging role of the Ag nanoparticles, the thermal conductivities of the h-BN@Ag/PI composite films were higher than that of the pure PI film. The thermal conductivity of the h-BN@Ag/PI film with the filler content of 10 wt% was 0.382 W (m·K)−1, which was 108% higher than that of pure PI films (0.184 W (m·K) −1). Furthermore, the composite films presented extremely low dielectric permittivity and loss tangent. Moreover, the heat resistance index of the composite films (304.6°C) was higher than that of pure PI (294.3°C). Thus, h-BN@Ag/PI composite films could be promising electronic packaging materials.

scholarly journals Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 238
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Po-Wei Chi ◽  
Prem Chandan ◽  
Cheng-Ta Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Material ◽  
Hot Pressing ◽  
Large Scale ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Melt Mixing ◽  
Conductive Composite ◽  
3D Network ◽  
Thermally Conductive

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.

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