scholarly journals Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 238
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Po-Wei Chi ◽  
Prem Chandan ◽  
Cheng-Ta Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Material ◽  
Hot Pressing ◽  
Large Scale ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Melt Mixing ◽  
Conductive Composite ◽  
3D Network ◽  
Thermally Conductive

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.

scholarly journals Aerogel Perfusion-Prepared h-BN/CNF Composite Film with Multiple Thermally Conductive Pathways and High Thermal Conductivity

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 1051 ◽  
Author(s):  
Xiu Wang ◽  
Zhihuai Yu ◽  
Liang Jiao ◽  
Huiyang Bian ◽  
Weisheng Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Traditional Approach ◽  
Synthetic Polymer ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Polymer Materials ◽  
Thermally Conductive ◽  
Electrical Insulation Properties

Hexagonal boron nitride (h-BN)-based heat-spreading materials have drawn considerable attention in electronic diaphragm and packaging fields because of their high thermal conductivity and desired electrical insulation properties. However, the traditional approach to fabricate thermally conductive composites usually suffers from low thermal conductivity, and cannot meet the requirement of thermal management. In this work, novel h-BN/cellulose-nano fiber (CNF) composite films with excellent thermal conductivity in through plane and electrical insulation properties are fabricated via an innovative process, i.e., the perfusion of h-BN into porous three dimensional (3D) CNF aerogel skeleton to form the h-BN thermally conductive pathways by filling the CNF aerogel voids. When at an h-BN loading of 9.51 vol %, the thermal conductivity of h-BN/CNF aerogel perfusion composite film is 1.488 W·m−1·K−1 at through plane, an increase by 260.3%. The volume resistivity is 3.83 × 1014 Ω·cm, superior to that of synthetic polymer materials (about 109~1013 Ω·cm). Therefore, the resulting h-BN/CNF film is very promising to replace the traditional synthetic polymer materials for a broad spectrum of applications, including the field of electronics.

Cellulose/boron nitride core–shell microbeads providing high thermal conductivity for thermally conductive composite sheets

RSC Advances ◽  
2016 ◽  
Vol 6 (39) ◽  
pp. 33036-33042 ◽  
Author(s):  
Shoji Nagaoka ◽  
Takuma Jodai ◽  
Yoshihiro Kameyama ◽  
Maki Horikawa ◽  
Tomohiro Shirosaki ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Core Shell ◽  
Conductive Network ◽  
Conductive Composite ◽  
Thermally Conductive

Formation of a thermal conductive network in resin sheet hybridized cellulose/BN core–shell microbeads.

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000001-00005
Author(s):  
Ya Liu ◽  
Nan Wang ◽  
Lilei Ye ◽  
Abdelhafid Zehri ◽  
Andreas Nylander ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
High Thermal Conductivity ◽  
Thermally Conductive ◽  
Promising Solution ◽  
Mechanical Pressing ◽  
Insulating Properties

Abstract Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m−1 K−1 and 0.485 W m−1 K−1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

In situ preparation and properties of phthalonitrile resin/hexagonal boron nitride composites

2020 ◽  
Vol 32 (9) ◽  
pp. 1010-1018
Author(s):  
Xinggang Chen ◽  
Yafeng Wang ◽  
Zhen Chen ◽  
Lifang Zhang ◽  
Xiaoming Sang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Polymer Matrix Composites ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Matrix Composites ◽  
In Situ Preparation ◽  
Thermosetting Polymers ◽  
Novel Approach ◽  
Thermally Conductive

Phthalonitrile resin/exfoliated hexagonal boron nitride ( h-BN) composites with high thermal conductivity were fabricated using a novel approach. The route included two steps, micro- h-BN was coated and dispersed by phthalonitrile monomers via the function of heterogeneous nucleation, and then micro- h-BN was exfoliated by heat release during the phthalonitrile curing process. The composites achieved a high thermal conductivity of 0.736W (m·K)−1 containing 20 wt% micro- h-BN, which is 3.17 times higher than that of pure phthalonitrile resin at 0.232W (m·K)−1. Compared to traditional routes, the novel preparation approach requires less BN fillers when improving the same thermal conductivity. Importantly, other thermosetting polymers can also encapsulate BN through this strategy, which paves a new way for preparing thermally conductive thermosetting polymer–matrix composites.

scholarly journals Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

RSC Advances ◽  
2018 ◽  
Vol 8 (45) ◽  
pp. 25835-25845 ◽  
Author(s):  
Cuiping Yu ◽  
Wenbin Gong ◽  
Jun Zhang ◽  
Weibang Lv ◽  
Wei Tian ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Dimensional Stability ◽  
Hot Pressing ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Conductive Composites ◽  
Thermally Conductive

Orientational hBN/SEBS composite films embued with superior thermal conductivity and improved dimensional stability were prepared by hot-pressing treatment.

scholarly journals Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Heat Diffusion ◽  
Composite Powders ◽  
Polyurethane Composite ◽  
Uniform Dispersion ◽  
Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

scholarly journals Surface modification of a BN/ETDS composite with aniline trimer for high thermal conductivity and excellent mechanical properties

RSC Advances ◽  
2018 ◽  
Vol 8 (40) ◽  
pp. 22846-22852 ◽  
Author(s):  
Seokgyu Ryu ◽  
Taeseob Oh ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Surface Modification ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Conductive Polymer ◽  
High Thermal Conductivity ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).

scholarly journals Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

2020 ◽  
Vol 4 (3) ◽  
pp. 116
Author(s):  
Maryam Khalaj ◽  
Sanaz Zarabi Golkhatmi ◽  
Sayed Ali Ahmad Alem ◽  
Kahila Baghchesaraee ◽  
Mahdi Hasanzadeh Azar ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Recent Progress ◽  
Phonon Scattering ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Promising Candidate ◽  
Reinforced Composite ◽  
Low Thermal Expansion ◽  
Wide Range

Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

Sign in / Sign up

Export Citation Format

Share Document