A biocompatible artificial tendril with a spontaneous 3D Janus multi-helix-perversion configuration

2020 ◽  
Vol 4 (7) ◽  
pp. 2149-2156 ◽  
Author(s):  
Yingchun Su ◽  
Mehmet Berat Taskin ◽  
Mingdong Dong ◽  
Xiaojun Han ◽  
Flemming Besenbacher ◽  
...  
Keyword(s):  
Mismatch Strain ◽  
Cellular Patterning

Through side-by-side electrospinning, Janus microfibers were transformed into 3D multi-helix-perversion microstructures due to the mismatch strain achieving Janus cellular patterning.

Mechanical behavior of mismatch strain-driven microcantilever

2007 ◽  
Vol 38 (3) ◽  
pp. 371-380 ◽  
Author(s):  
Sang-Hyun Kim ◽  
James G. Boyd ◽  
Sathyanarayanan Mani
Keyword(s):  
Mechanical Behavior ◽  
Mismatch Strain

Thermal mismatch strain induced disorder of Y2Mo3O12 and its effect on thermal expansion of Y2Mo3O12/Al composites

2017 ◽  
Vol 19 (19) ◽  
pp. 11778-11785 ◽  
Author(s):  
Chang Zhou ◽  
Qiang Zhang ◽  
Saiyue Liu ◽  
Bingcheng Luo ◽  
Eongyu Yi ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Squeeze Casting ◽  
Thermal Mismatch ◽  
Mismatch Strain

Fully dense Y2Mo3O12/Al composites were prepared by squeeze casting.

Microstructural study of GaAs epitaxial layers on Ge(100) substrates

1995 ◽  
Vol 10 (4) ◽  
pp. 843-852 ◽  
Author(s):  
N. Guelton ◽  
R.G. Saint-Jacques ◽  
G. Lalande ◽  
J-P. Dodelet
Keyword(s):  
Electron Microscopy ◽  
Surface Preparation ◽  
Growth Conditions ◽  
Vapor Transport ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Antiphase Boundaries ◽  
Microstructural Study ◽  
Mismatch Strain ◽  
Transmission Electron

GaAs layers grown by close-spaced vapor transport on (100) Ge substrates have been investigated as a function of the experimental growth conditions. The effects on the microstructure of the surface preparation, substrate misorientation, and annealing were studied using optical microscopy and transmission electron microscopy. Microtwins and threading dislocations are suppressed by oxide desorption before deposition. Single domain GaAs layers have been obtained using a 50 nm thick double domain buffer layer on an annealed Ge substrate misoriented 3°toward [011]. The mismatch strain is mainly accommodated by dissociated 60°dislocations. These misfit dislocations extend along the interface by the glide of the threading dislocations inherited from the substrate, but strong interaction with antiphase boundaries (APB's) prevents them from reaching the interface. These results are discussed and compared with previous reports of GaAs growth on Ge(100).

scholarly journals Transcriptome analysis of the genes regulating phytohormone and cellular patterning in Lagerstroemia plant architecture

2018 ◽  
Vol 8 (1) ◽  
Author(s):  
Yiqian Ju ◽  
Lu Feng ◽  
Jiyang Wu ◽  
Yuanjun Ye ◽  
Tangchun Zheng ◽  
...  
Keyword(s):  
Transcriptome Analysis ◽  
Plant Architecture ◽  
Cellular Patterning

scholarly journals Multimodal Surface Instabilities in Curved Film–Substrate Structures

2017 ◽  
Vol 84 (8) ◽  
Author(s):  
Ruike Zhao ◽  
Xuanhe Zhao
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Numerical Simulation ◽  
Period Doubling ◽  
Tubular Structures ◽  
Modulus Ratio ◽  
Future Design ◽  
Mismatch Strain ◽  
Curved Structures ◽  
Film Substrate

Structures of thin films bonded on thick substrates are abundant in biological systems and engineering applications. Mismatch strains due to expansion of the films or shrinkage of the substrates can induce various modes of surface instabilities such as wrinkling, creasing, period doubling, folding, ridging, and delamination. In many cases, the film–substrate structures are not flat but curved. While it is known that the surface instabilities can be controlled by film–substrate mechanical properties, adhesion and mismatch strain, effects of the structures’ curvature on multiple modes of instabilities have not been well understood. In this paper, we provide a systematic study on the formation of multimodal surface instabilities on film–substrate tubular structures with different curvatures through combined theoretical analysis and numerical simulation. We first introduce a method to quantitatively categorize various instability patterns by analyzing their wave frequencies using fast Fourier transform (FFT). We show that the curved film–substrate structures delay the critical mismatch strain for wrinkling when the system modulus ratio between the film and substrate is relatively large, compared with flat ones with otherwise the same properties. In addition, concave structures promote creasing and folding, and suppress ridging. On the contrary, convex structures promote ridging and suppress creasing and folding. A set of phase diagrams are calculated to guide future design and analysis of multimodal surface instabilities in curved structures.

Understanding the mismatch strain and orientation of nanoscale second phase on the superelasticity of zirconia

2020 ◽  
Vol 22 ◽  
pp. 100521
Author(s):  
Zhijun Gao ◽  
Shuize Wang ◽  
Hong-Hui Wu ◽  
Jingyuan Li ◽  
Xinping Mao
Keyword(s):  
Second Phase ◽  
Mismatch Strain

Thermodynamic modeling of elastic mismatch strain energy on epitaxial growth of GaInN thin films

2019 ◽  
Vol 798 ◽  
pp. 112-118
Author(s):  
Xinyuan Hu ◽  
Lei L. Kerr ◽  
Xushan Zhao ◽  
Chen Ling ◽  
Zhengjing Zhao ◽  
...  
Keyword(s):  
Thin Films ◽  
Epitaxial Growth ◽  
Thermodynamic Modeling ◽  
Strain Energy ◽  
Mismatch Strain ◽  
Elastic Mismatch

The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Omar Ahmed ◽  
Chukwudi Okoro ◽  
Scott Pollard ◽  
Tengfei Jiang
Keyword(s):  
Integrated Circuits ◽  
Buffer Layer ◽  
Coupling Effect ◽  
Numerical Study ◽  
Numerical Models ◽  
Thermal Strain ◽  
Content Type ◽  
Mismatch Strain ◽  
Pitch Distance ◽  
Stress Buffer

PurposeThis study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.Design/methodology/approachNumerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.FindingsERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.Originality/valueThis study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.

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