Microstructural study of GaAs epitaxial layers on Ge(100) substrates

1995 ◽  
Vol 10 (4) ◽  
pp. 843-852 ◽  
Author(s):  
N. Guelton ◽  
R.G. Saint-Jacques ◽  
G. Lalande ◽  
J-P. Dodelet
Keyword(s):  
Electron Microscopy ◽  
Surface Preparation ◽  
Growth Conditions ◽  
Vapor Transport ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Antiphase Boundaries ◽  
Microstructural Study ◽  
Mismatch Strain ◽  
Transmission Electron

GaAs layers grown by close-spaced vapor transport on (100) Ge substrates have been investigated as a function of the experimental growth conditions. The effects on the microstructure of the surface preparation, substrate misorientation, and annealing were studied using optical microscopy and transmission electron microscopy. Microtwins and threading dislocations are suppressed by oxide desorption before deposition. Single domain GaAs layers have been obtained using a 50 nm thick double domain buffer layer on an annealed Ge substrate misoriented 3°toward [011]. The mismatch strain is mainly accommodated by dissociated 60°dislocations. These misfit dislocations extend along the interface by the glide of the threading dislocations inherited from the substrate, but strong interaction with antiphase boundaries (APB's) prevents them from reaching the interface. These results are discussed and compared with previous reports of GaAs growth on Ge(100).

Optimum growth conditions for the epitaxy of GaAs on Ge by close-spaced vapor transport

1994 ◽  
Vol 72 (5-6) ◽  
pp. 225-232 ◽  
Author(s):  
G. Lalande ◽  
N. Guelton ◽  
D. Cossement ◽  
R. G. Saint-Jacques ◽  
J. P. Dodelet
Keyword(s):  
Growth Rate ◽  
Solar Cells ◽  
Water Vapor ◽  
Substrate Temperature ◽  
Growth Conditions ◽  
Vapor Transport ◽  
Temperature Evolution ◽  
Threading Dislocations ◽  
Optimum Growth ◽  
Antiphase Boundaries

GaAs epitaxial layers are grown by close-spaced vapor transport (CSVT) on (100)Ge substrates and (100)Ge substrates misoriented 1.5° and 3° toward (011). Water vapor is used as the transport agent. When the temperatures of the GaAs source (T1) and of the Ge substrate (T2) are 800 and 750 °C, respectively, the growth rate is about 3 μm h−1. When an optimum source–substrate temperature evolution is followed, it is possible to grow specular layers of GaAs/Ge that contain only a small number (< 105 cm−2) of threading dislocations. All antiphase boundaries (APBs) annihilate close to the interface (from about 230 nm for (100)Ge substrates to about 65 nm for vicinal (3° off) (100)Ge substrates). The GaAs growth occurs via the coalescence of 3D nuclei that are formed on an arsenic prelayer n-type GaAs layers are always obtained. By encapsulating the Ge substrate, it is possible to drastically decrease the autodoping resulting from the transport of Ge by water vapor in the same growth conditions as those prevailing for GaAs. After encapsulation, uncompensated doping densities ND – NA in the order of 5 × 1016 cm−3 are easily obtained for GaAs/Ge films grown from undoped semi-insulating GaAs sources. These GaAs/Ge layers can be used as bases for solar cells.

Dislocations in SrTiO3 thin films grown on LaAlO3 substrates

2002 ◽  
Vol 17 (12) ◽  
pp. 3117-3126 ◽  
Author(s):  
Y. L. Qin ◽  
C. L. Jia ◽  
K. Urban ◽  
J. H. Hao ◽  
X. X. Xi
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Lattice Mismatch ◽  
Orthogonal Arrays ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Burgers Vector ◽  
Transmission Electron

The dislocation configurations in SrTiO3 thin films grown epitaxially on LaAlO3 (100) substrates were studied by conventional and high-resolution transmission electron microscopy. Misfit dislocations had, in most cases, a Burgers vector a〈100〉 and line directions of 〈100〉 These dislocations constitute orthogonal arrays of parallel dislocations at the interface, relieving the lattice mismatch between SrTiO3 and LaAlO3. Threading dislocations were found to be the major defects in the films. Two types of threading dislocations with the Burgers vectors a〈100〉?and a〈100〉?were identified. The relations of these threading dislocations with the misfit dislocations were investigated and are discussed in this paper.

A Transmission Electron Microscopy Study of Dislocation Substructures in PLD-grown Epitaxial Films of (Ba,Sr)TiO3 on (001) LaAlO3

2003 ◽  
Vol 784 ◽  
Author(s):  
I. B. Misirlioglu ◽  
A. L. Vasiliev ◽  
M. Aindow ◽  
R. Ramesh ◽  
S. P. Alpay
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Transmission Electron Microscopy Study ◽  
Transmission Electron ◽  
Half Loop ◽  
Island Coalescence

ABSTRACTEpitaxial Ba0.6Sr0.4TiO3 films were grown onto (001) LaAlO3 by pulsed-laser deposition, and the dislocation structures of the films were investigated using transmission electron microscopy. Misfit dislocations with a periodicity of about 7 nm and Burgers vectors b = a<100> were observed at the interface. High densities of threading dislocations was present in the films with Burgers vector b = a<100>. The observations reveal that threading dislocations are not generated as the result of half-loop climb from the deposit surface as proposed previously, but are instead formed when misfit dislocations are forced away from the interface during island coalescence.

Defect morphology in thick relaxed layers of InGaAs on GaAs

1990 ◽  
Vol 48 (4) ◽  
pp. 668-669
Author(s):  
R H Dixon ◽  
P Kidd ◽  
P J Goodhew
Keyword(s):  
Electron Microscopy ◽  
Surface Morphology ◽  
Growth Conditions ◽  
X Ray Diffraction ◽  
Double Crystal ◽  
Strained Layers ◽  
Good Surface ◽  
Transmission Electron ◽  
Device Structures ◽  
Surface Morphologies

Thick relaxed InGaAs layers grown epitaxially on GaAs are potentially useful substrates for growing high indium percentage strained layers. It is important that these relaxed layers are defect free and have a good surface morphology for the subsequent growth of device structures.3μm relaxed layers of InxGa1-xAs were grown on semi - insulating GaAs substrates by Molecular Beam Epitaxy (MBE), where the indium composition ranged from x=0.1 to 1.0. The interface, bulk and surface of the layers have been examined in planar view and cross-section by Transmission Electron Microscopy (TEM). The surface morphologies have been characterised by Scanning Electron Microscopy (SEM), and the bulk lattice perfection of the layers assessed using Double Crystal X-ray Diffraction (DCXRD).The surface morphology has been found to correlate with the growth conditions, with the type of defects grown-in to the layer (e.g. stacking faults, microtwins), and with the nature and density of dislocations in the interface.

TEM investigation of defect reduction and etch pit formation in GaN

2003 ◽  
Vol 798 ◽  
Author(s):  
Angelika Vennemann ◽  
Jens Dennemarck ◽  
Roland Kröger ◽  
Tim Böttcher ◽  
Detlef Hommel ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Dislocation Density ◽  
Line Tension ◽  
Threading Dislocations ◽  
Dislocation Loops ◽  
Etch Pits ◽  
Defect Reduction ◽  
Transmission Electron ◽  
Order Of Magnitude ◽  
Edge Dislocations

ABSTRACTGaN samples of this study were chemically wet etched to gain easier access to the dislocation sturcture. The scanning electron microscopy and transmission electron microscopy investigations revealed four different types of etch pits. After brief etching, several dislocations with screw component showed large etch pits, which may be correlated with the core of the screw dislocation. By means of SiNx micromasking the dislocation density could be reduced by more than one order of magnitude. The reduction of threading dislocations in the SiNx region in GaN grown on 〈0001〉 sapphire is due to bending of the threading dislocations into the {0001} plane, such that they form dislocation loops if they meet dislocations with opposite Burgers vectors. Accordingly, the achievable reduction of the dislocation density is limited by the probability that these dislocations interact. Edge dislocations bend more easily on account of their low line tension. This results in a preferential bending and reduction of dislocations with edge character.

Carbon Nanotubes Grown on Metallic Wires by Cold Plasma Technique

2002 ◽  
Vol 737 ◽  
Author(s):  
D. Sarangi ◽  
A. Karimi
Keyword(s):  
Electron Microscopy ◽  
Carbon Nanotubes ◽  
Growth Conditions ◽  
Effect Of Temperature ◽  
Rutherford Back Scattering ◽  
Novel Approach ◽  
Transmission Electron ◽  
Back Scattering ◽  
Metallic Wires ◽  
Metal Wires

ABSTRACTCarbon nanotubes on metallic wires may be act as electrode for the field emission (FE) luminescent devices. Growing nanotubes on metallic wires with controlled density, length and alignment are challenging issues for this kind of devices. We, in the present investigation grow carbon nanotubes directly on the metal wires by a powerful but simple technique. A novel approach has been proposed to align nanotubes during growth. Methane, acetylene and dimethylamine have been used as source gases. With the same growth conditions (viz. pressure, growth temperature and plasma) methane does not produce any nanotube but nanotubes grown with dimethylamine show shorter length and radius than acetylene. The effect of temperature to control the radius, time to control the density, plasma conditions to align the nanotubes has been focused. Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM) and Rutherford Back Scattering (RBS) are used to characterize the nanotubes.

A Technique for the Preparation of Thin-Film Cross-Sections for Transmission Electron Microscopy

1990 ◽  
Vol 199 ◽  
Author(s):  
M. Libera ◽  
T. A. Nguyen ◽  
C. Hwang
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Data Storage ◽  
Cross Sections ◽  
Film Plane ◽  
Microstructural Study ◽  
Transmission Electron ◽  
Sophisticated Equipment ◽  
Tem Grid

ABSTRACTA number of techniques for producing TEM cross-sections of thin films have been described in recent years as the need for improved and more-thorough microstructural study of thin-film materials has grown. We have developed a method for producing such cross-sections which involves little sophisticated equipment other than an ion mill for thinning. Following the method of Bravman and Sinclair (J. Elec. Micrs. Tech 1,53–61 (1984)), the film of interest is either deposited on or epoxied to a silicon wafer and a composite of six silicon beams (=3mm × 25mm × 0.5mm) is fabricated. Slices are cut from this composite perpendicular to the film plane, and each slice is mechanically thinned by a series of simple grinding and polishing steps to ∼ 50–100μm. Dimpling is not necessary. The specimen is mounted onto a slotted TEM grid which provides a vehicle for safe handling, and the specimen is ion milled to perforation. We have found the technique to be relatively fast, reliable, and simple. Its success hinges on minimizing the amount of direct handling required when the specimen is thin and fragile. We present a detailed recipe describing its various steps and show typical results from studies of thin films for data-storage applications.

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