scholarly journals Probabilistic methodology for reliability assessment of electronic packages

2019 ◽  
Vol 286 ◽  
pp. 02002
Author(s):  
H. Hamdani ◽  
B. Radi ◽  
A. El Hami
Keyword(s):  
Solder Joint ◽  
Reliability Assessment ◽  
Temperature Cycling ◽  
Time Dependent ◽  
Electronic Packages ◽  
Finite Element Analyses ◽  
Material Parameters ◽  
Joint Reliability ◽  
Design Variables ◽  
Solder Joint Fatigue

In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and randomness which will affect the lifetime prediction quality. This paper focuses on solder joint reliability in tape-based chip-scale packages(CSP) with the consideration of uncertainties in material parameters.

scholarly journals Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models

Materials ◽  
2021 ◽  
Vol 14 (17) ◽  
pp. 4835
Author(s):  
Cadmus Yuan ◽  
Xuejun Fan ◽  
Gouqi Zhang
Keyword(s):  
Neural Network ◽  
Genetic Algorithm ◽  
Solder Joint ◽  
Risk Estimation ◽  
Time Dependent ◽  
Simulation Framework ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Solder Joint Fatigue ◽  
The Impact

Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation capability against the design and process parameters. Due to the time-dependent and nonlinear characteristics of the solder joint fatigue failure, this research follows the AI-assisted simulation framework and builds the non-sequential artificial neural network (ANN) and sequential recurrent neural network (RNN) architectures. Both are investigated to understand their capability of abstracting the time-dependent solder joint fatigue knowledge from the dataset. Moreover, this research applies the genetic algorithm (GA) optimization to decrease the influence of the initial guessings, including the weightings and bias of the neural network architectures. In this research, two GA optimizers are developed, including the “back-to-original” and “progressing” ones. Moreover, we apply the principal component analysis (PCA) to the GA optimization results to obtain the PCA gene. The prediction error of all neural network models is within 0.15% under GA optimized PCA gene. There is no clear statistical evidence that RNN is better than ANN in the wafer level chip-scaled packaging (WLCSP) solder joint reliability risk estimation when the GA optimizer is applied to minimize the impact of the initial AI model. Hence, a stable optimization with a broad design domain can be realized by an ANN model with a faster training speed than RNN, even though solder fatigue is a time-dependent mechanical behavior.

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

2011 ◽  
pp. 74-74-15 ◽  
Author(s):  
Weiqiang Wang ◽  
Michael Osterman ◽  
Diganta Das ◽  
Michael Pecht
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

2005 ◽  
Vol 127 (4) ◽  
pp. 466-473 ◽  
Author(s):  
B. L. Chen ◽  
X. Q. Shi ◽  
G. Y. Li ◽  
K. H. Ang ◽  
Jason P. Pickering
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Rapid Temperature ◽  
Reliability Of Solder Joints ◽  
Solder Joint Fatigue ◽  
Time Required ◽  
Failure Location

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

2010 ◽  
Vol 7 (8) ◽  
pp. 102939
Author(s):  
Weiqiang Wang ◽  
Michael Osterman ◽  
Diganta Das ◽  
Michael Pecht ◽  
S. W. Dean
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

1991 ◽  
Vol 113 (2) ◽  
pp. 121-128 ◽  
Author(s):  
R. G. Ross
Keyword(s):  
Solder Joint ◽  
Electronic Packaging ◽  
Thermal Cycle ◽  
Systems Approach ◽  
High Reliability ◽  
Temperature Cycling ◽  
Failure Behavior ◽  
Acceptance Test ◽  
Solder Fatigue ◽  
Solder Joint Fatigue

Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.

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