Effect of grain boundaries on carrier lifetime in chemical-vapor-deposited diamond film

2000 ◽  
Vol 77 (10) ◽  
pp. 1425-1427 ◽  
Author(s):  
Hitoki Yoneda ◽  
Kazutatsu Tokuyama ◽  
Riichi Yamazaki ◽  
Ken-ichi Ueda ◽  
Hironori Yamamoto ◽  
...  
Author(s):  
L. M. Gignac ◽  
K. P. Rodbell

As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.


2019 ◽  
Vol 3 (1) ◽  
Author(s):  
Xibiao Ren ◽  
Jichen Dong ◽  
Peng Yang ◽  
Jidong Li ◽  
Guangyuan Lu ◽  
...  

1995 ◽  
Vol 67 (23) ◽  
pp. 3376-3378 ◽  
Author(s):  
C. Manfredotti ◽  
F. Wang ◽  
P. Polesello ◽  
E. Vittone ◽  
F. Fizzotti ◽  
...  

1990 ◽  
Vol 5 (8) ◽  
pp. 1591-1594 ◽  
Author(s):  
A. V. Hetherington ◽  
C. J. H. Wort ◽  
P. Southworth

The crystalline perfection of microwave plasma assisted chemical vapor deposited (MPACVD) diamond films grown under various conditions has been examined by TEM. Most CVD diamond films thus far reported contain a high density of defects, predominantly twins and stacking faults on {111} planes. We show that under appropriate growth conditions, these planar defects are eliminated from the center of the crystallites, and occur only at grain boundaries where the growing crystallites meet.


Carbon ◽  
2013 ◽  
Vol 65 ◽  
pp. 365-370 ◽  
Author(s):  
Sheng Liu ◽  
Jin-long Liu ◽  
Cheng-ming Li ◽  
Jian-chao Guo ◽  
Liang-xian Chen ◽  
...  

Author(s):  
Baratunde A. Cola ◽  
Xianfan Xu ◽  
Timothy S. Fisher

Carbon nanotube (CNT) arrays have been directly synthesized on plasma-enhanced chemical vapor deposited diamond films in the same growth chamber. The diamond films were grown using a bias-enhanced nucleation technique that produces relatively smooth and flat films. The thermal resistances of the CNT array/diamond film interface were measured using a photoacoustic technique to be approximately 12 mm2·K/W at moderate pressures.


Nano Letters ◽  
2016 ◽  
Vol 16 (9) ◽  
pp. 5888-5894 ◽  
Author(s):  
Kedi Wu ◽  
Bin Chen ◽  
Sijie Yang ◽  
Gang Wang ◽  
Wilson Kong ◽  
...  

2012 ◽  
Vol 1426 ◽  
pp. 51-56 ◽  
Author(s):  
L. Ding ◽  
M. Benkhaira ◽  
S. Nicolay ◽  
C. Ballif

ABSTRACTIn this contribution, we study the increase in metalorganic-low pressure chemical vapor deposited (MO-LPCVD) ZnO thin films conductivity by hydrogen plasma post-treatment. We show that this improvement is linked to defect passivation at grain boundaries, decreasing the electron traps density and resulting in the almost complete suppression of the electron scattering at grain boundaries. For a 2 μm thick non-intentionally doped ZnO layer, electron mobility reaches after treatment values close to 60 cm2V-1s-1 (corresponding to an increase of 100%), with a carrier density still as low as 3 x1019 cm-3 (+1.5 x1019 cm-3). Such layers have an absorbance below 2-3% in the range of 400 to 1100 nm making them among the most transparent and conductive materials reported so far. In addition, we demonstrate that hydrogen plasma post-treated ZnO layers can be used as front electrode for producing highly transparent and conductive electrodes. Eventually, it is shown that hydrogen plasma treatment can also be used on the complete thin film solar cell stack (back contact and silicon device) to improve the cell performances.


Sign in / Sign up

Export Citation Format

Share Document