Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration

2010 ◽  
Author(s):  
Mike Roellig ◽  
Karsten Meier ◽  
Rene Metasch ◽  
Ehrenfried Zschech ◽  
Shinichi Ogawa ◽  
...  
Keyword(s):  
Solder Joints ◽  
Temperature Dependent ◽  
Micromechanical Properties ◽  
3D Package

A First Individual Solder Joint Encapsulant Adhesive

2010 ◽  
Vol 2010 (1) ◽  
pp. 000766-000770 ◽  
Author(s):  
Mary Liu ◽  
Wusheng Yin
Keyword(s):  
Thermal Stress ◽  
Solder Joint ◽  
Solder Joints ◽  
Empty Space ◽  
Pull Strength ◽  
Fine Pitch ◽  
3D Package

In order to meet the demand of fine pitch and 3D package, and eliminate complex underfilling process, a first solder joint encapsulant has been invented. Solder joint encapsulant adhesive is to encapsulate each individual solder joint using polymer to enhance solder joint, and leave empty space in-between solder joints to avoid thermal stress applied onto solder joints. Now two kinds of solder joint encapsulants are SMT256 and SMT266, which have been used in the customer field. Using solder joint encapsulants – SMT256 and SMT266, the pull strength of solder joint has been increased by about five times, resulting in significant increase in the reliability. In this paper more details have been investigated.

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

2002 ◽  
Vol 124 (3) ◽  
pp. 212-220 ◽  
Author(s):  
John H. Lau ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Time Dependent ◽  
Circuit Board ◽  
Wafer Level ◽  
Temperature Dependent ◽  
Thermal Fatigue Life ◽  
Chip Scale Package

A new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic-plastic and a time-dependent creep material.

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

2000 ◽  
Author(s):  
John H. Lau ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Time Dependent ◽  
Circuit Board ◽  
Wafer Level ◽  
Temperature Dependent ◽  
Thermal Fatigue Life ◽  
Chip Scale Package

Abstract A new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic-plastic and a time-dependent creep material.

(111) Monocrystalline Nickel Films

1972 ◽  
Vol 30 ◽  
pp. 512-513
Author(s):  
T.E. Pratt ◽  
R.W. Vook
Keyword(s):  
Film Thickness ◽  
Deposition Rate ◽  
Room Temperature ◽  
Narrow Range ◽  
High Vacuum ◽  
Residual Pressure ◽  
Temperature Dependent ◽  
Deposition Parameters ◽  
Transmission Electron ◽  
Substrate Temperatures

(111) oriented thin monocrystalline Ni films have been prepared by vacuum evaporation and examined by transmission electron microscopy and electron diffraction. In high vacuum, at room temperature, a layer of NaCl was first evaporated onto a freshly air-cleaved muscovite substrate clamped to a copper block with attached heater and thermocouple. Then, at various substrate temperatures, with other parameters held within a narrow range, Ni was evaporated from a tungsten filament. It had been shown previously that similar procedures would yield monocrystalline films of CU, Ag, and Au.For the films examined with respect to temperature dependent effects, typical deposition parameters were: Ni film thickness, 500-800 A; Ni deposition rate, 10 A/sec.; residual pressure, 10-6 torr; NaCl film thickness, 250 A; and NaCl deposition rate, 10 A/sec. Some additional evaporations involved higher deposition rates and lower film thicknesses.Monocrystalline films were obtained with substrate temperatures above 500° C. Below 450° C, the films were polycrystalline with a strong (111) preferred orientation.

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