Analytical electron microscopy of ferroelectric ceramic materials

1997 ◽  
Vol 201 (1) ◽  
pp. 23-32 ◽  
Author(s):  
Goran Dražič ◽  
Marija Kosec
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Ceramic Materials ◽  
Ferroelectric Ceramic ◽  
Analytical Electron

Analytical Electron Microscopy of Surface-Modified Ceramics

1985 ◽  
Vol 43 ◽  
pp. 276-279
Author(s):  
P. S. Sklad
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Theoretical Models ◽  
Ceramic Materials ◽  
Solute Concentration ◽  
Second Phase ◽  
Analytical Electron ◽  
Implantation Techniques ◽  
Lattice Damage ◽  
Surface Modified

Over the past several years, it has become increasingly evident that materials for proposed advanced energy systems will be required to operate at high temperatures and in aggressive environments. These constraints make structural ceramics attractive materials for these systems. However it is well known that the condition of the specimen surface of ceramic materials is often critical in controlling properties such as fracture toughness, oxidation resistance, and wear resistance. Ion implantation techniques offer the potential of overcoming some of the surface related limitations.While the effects of implantation on surface sensitive properties may be measured indpendently, it is important to understand the microstructural evolution leading to these changes. Analytical electron microscopy provides a useful tool for characterizing the microstructures produced in terms of solute concentration profiles, second phase formation, lattice damage, crystallinity of the implanted layer, and annealing behavior. Such analyses allow correlations to be made with theoretical models, property measurements, and results of complimentary techniques.

scholarly journals Analytical Electron Microscopy Characterization of a Temperature-Stable Relaxor Ferroelectric Ceramic

2019 ◽  
Vol 25 (S2) ◽  
pp. 2118-2119
Author(s):  
Teresa Roncal-Herrero ◽  
John Harrington ◽  
Aurang Zeb ◽  
Steven J Milne ◽  
Andy P. Brown
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Ferroelectric Ceramic ◽  
Relaxor Ferroelectric ◽  
Analytical Electron ◽  
Microscopy Characterization

Analytical ELectron Microscopy Characterization of Basalt Glass Ceramics

1982 ◽  
Vol 40 ◽  
pp. 616-617
Author(s):  
L. E. Thomas ◽  
L. A. Chick ◽  
R. O. Lokken
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Glass Ceramics ◽  
Ceramic Materials ◽  
Basalt Glass ◽  
Glass Ceramic Materials ◽  
Analytical Electron ◽  
Microscopy Characterization

Radioactive waste produced by nuclear reactors poses long term environmental hazards if not adequately immobilized and stored. As part of a program for developing basalt-based waste forms with high leach durability, analytical electron microscopy has been used to identify and chemically analyze the phases in several basalt glass/ceramic materials.

Application of Analytical Electron Microscopy to glass-bonded aluminas

1986 ◽  
Vol 44 ◽  
pp. 436-439
Author(s):  
B.J. Hockey
Keyword(s):  
Electron Microscopy ◽  
Volume Fraction ◽  
Sintered Material ◽  
Analytical Electron Microscopy ◽  
Microstructural Characterization ◽  
Ceramic Materials ◽  
Liquid Phase Sintering ◽  
Binder Phase ◽  
Analytical Electron ◽  
Polycrystalline Body

Liquid phase sintering represents one of the most common methods of producing aluminas and other ceramic materials. Regardless of the specific processing details, this sintering procedure invariably results in a polycrystalline body containing a certain volume fraction of an intergranular binder phase. This phase is typically a glass, which can control many important properties of the sintered material. Clearly, microstructural characterization - describing not only the physical distribution of the binder phase but also its chemical composition - represents its an important part in the study of these materials.

Electron Beam Damage of Biomolecules Assessed by Energy Loss Spectroscopy

1978 ◽  
Vol 36 (3) ◽  
pp. 61-69
Author(s):  
M. Isaacson ◽  
M.L. Collins ◽  
M. Listvan
Keyword(s):  
Electron Microscopy ◽  
Radiation Damage ◽  
Structural Integrity ◽  
Analytical Electron Microscopy ◽  
High Dose ◽  
Dose Rates ◽  
Special Cases ◽  
Analytical Electron ◽  
Atom Migration ◽  
Beam Damage

Over the past five years it has become evident that radiation damage provides the fundamental limit to the study of blomolecular structure by electron microscopy. In some special cases structural determinations at very low doses can be achieved through superposition techniques to study periodic (Unwin & Henderson, 1975) and nonperiodic (Saxton & Frank, 1977) specimens. In addition, protection methods such as glucose embedding (Unwin & Henderson, 1975) and maintenance of specimen hydration at low temperatures (Taylor & Glaeser, 1976) have also shown promise. Despite these successes, the basic nature of radiation damage in the electron microscope is far from clear. In general we cannot predict exactly how different structures will behave during electron Irradiation at high dose rates. Moreover, with the rapid rise of analytical electron microscopy over the last few years, nvicroscopists are becoming concerned with questions of compositional as well as structural integrity. It is important to measure changes in elemental composition arising from atom migration in or loss from the specimen as a result of electron bombardment.

Analytical Electron Microscopy (AEM) of Meningeal Cells Exposed to Particulate Cobalt During Studies of Experimental Epilepsy

1982 ◽  
Vol 40 ◽  
pp. 186-187
Author(s):  
R.G. Frederickson ◽  
R.G. Ulrich ◽  
J.L. Culberson
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Experimental Epilepsy ◽  
Metallic Cobalt ◽  
Experimental Animals ◽  
X Ray ◽  
Brain Surface ◽  
Meningeal Cells ◽  
Analytical Electron ◽  
The Brain

Metallic cobalt acts as an epileptogenic agent when placed on the brain surface of some experimental animals. The mechanism by which this substance produces abnormal neuronal discharge is unknown. One potentially useful approach to this problem is to study the cellular and extracellular distribution of elemental cobalt in the meninges and adjacent cerebral cortex. Since it is possible to demonstrate the morphological localization and distribution of heavy metals, such as cobalt, by correlative x-ray analysis and electron microscopy (i.e., by AEM), we are using AEM to locate and identify elemental cobalt in phagocytic meningeal cells of young 80-day postnatal opossums following a subdural injection of cobalt particles.

Analytical Electron Microscopy Characterization of Electric Arc Furnace Dust

1981 ◽  
Vol 39 ◽  
pp. 134-135
Author(s):  
J. R. Porter ◽  
J. I. Goldstein ◽  
D. B. Williams
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Electric Arc Furnace ◽  
Electric Arc ◽  
Dust Particles ◽  
Particle Analysis ◽  
Arc Furnace ◽  
Analytical Electron ◽  
Residual Elements ◽  
Industry Practice

Alloy scrap metal is increasingly being used in electric arc furnace (EAF) steelmaking and the alloying elements are also found in the resulting dust. A comprehensive characterization program of EAF dust has been undertaken in collaboration with the steel industry and AISI. Samples have been collected from the furnaces of 28 steel companies representing the broad spectrum of industry practice. The program aims to develop an understanding of the mechanisms of formation so that procedures to recover residual elements or recycle the dust can be established. The multi-phase, multi-component dust particles are amenable to individual particle analysis using modern analytical electron microscopy (AEM) methods.Particles are ultrasonically dispersed and subsequently supported on carbon coated formvar films on berylium grids for microscopy. The specimens require careful treatment to prevent agglomeration during preparation which occurs as a result of the combined effects of the fine particle size and particle magnetism. A number of approaches to inhibit agglomeration are currently being evaluated including dispersal in easily sublimable organic solids and size fractioning by centrifugation.

Application of analytical electron microscopy to the study of partitioning of silicon in a 2 wt% Si eutectoid steel

1978 ◽  
Vol 36 (1) ◽  
pp. 616-617
Author(s):  
N. Ridley ◽  
S.A. Al-Salman ◽  
G.W. Lorimer
Keyword(s):  
Electron Microscopy ◽  
Electron Microscope ◽  
Analytical Electron Microscopy ◽  
Eutectoid Steel ◽  
Minimum Diameter ◽  
Thin Foils ◽  
Analytical Electron ◽  
Analytical Electron Microscope ◽  
Transformation Front

The application of the technique of analytical electron microscopy to the study of partitioning of Mn (1) and Cr (2) during the austenite-pearlite transformation in eutectoid steels has been described in previous papers. In both of these investigations, ‘in-situ’ analyses of individual cementite and ferrite plates in thin foils showed that the alloying elements partitioned preferentially to cementite at the transformation front at higher reaction temperatures. At lower temperatures partitioning did not occur and it was possible to identify a ‘no-partition’ temperature for each of the steels examined.In the present work partitioning during the pearlite transformation has been studied in a eutectoid steel containing 1.95 wt% Si. Measurements of pearlite interlamellar spacings showed, however, that except at the highest reaction temperatures the spacing would be too small to make the in-situ analysis of individual cementite plates possible, without interference from adjacent ferrite lamellae. The minimum diameter of the analysis probe on the instrument used, an EMMA-4 analytical electron microscope, was approximately 100 nm.

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

Sign in / Sign up

Export Citation Format

Share Document