Irradiation of PMMA with high energy light ions: The depth distribution for volatile reaction-product emission

1994 ◽  
Vol 128 (4) ◽  
pp. 277-285 ◽  
Author(s):  
A. Schmoldt ◽  
L. T. Chadderton ◽  
D. Fink
1998 ◽  
Vol 510 ◽  
Author(s):  
P. Leveque ◽  
S. Godey ◽  
P.O. Renault ◽  
E. Ntsoenzok ◽  
J.F. Barbot

AbstractCommercial n-type 4H-SiC wafers were implanted with doses of MeV alpha particles, high enough to cause majority carrier modification. Analysis of infrared reflectivity spectra shows that the implanted crystals can be divided into three layers: a surface layer of about 30 nm followed by a compensation layer where the energy transfer of the incident particles is low and an overdoping layer in the region of maximum defect production, i.e. near the theoretical mean range of ions Rp


2006 ◽  
Vol 957 ◽  
Author(s):  
Julio Mass ◽  
Manuel Avella ◽  
Juan Jiménez ◽  
Michael Callahan ◽  
E. Grant ◽  
...  

ABSTRACTHydrothermal ZnMgO crystals were studied by cathodoluminescence. The high energy shift of the excitonic luminescence demonstrates the Mg incorporation in the ZnO lattice in at a few percent. The spectral parameters of the luminescence emission show a marked dependence of the incorporation of defects and Mg on the growth facet. This growth sector selectivity shows similar trends to those observed in hydrothermal ZnO crystals. The in depth distribution of Mg was studied varying the acceleration voltage of the excitation e-beam, showing a slight accumulation of Mg close to the surface.


2013 ◽  
Vol 115 (1) ◽  
pp. 143-147 ◽  
Author(s):  
Sagi Frishman ◽  
Alexander Gumennik ◽  
Har’el Ilan ◽  
Aharon J. Agranat

1989 ◽  
Vol 115 (2) ◽  
pp. 427-435 ◽  
Author(s):  
A. F. Burenkov ◽  
V. S. Varychenko ◽  
A. M. Zaitsev ◽  
F. F. Komarov ◽  
G. G. Konoplyanik ◽  
...  

2010 ◽  
Vol 25 (supp01) ◽  
pp. 86-97
Author(s):  
A.G. AFONIN ◽  
V.T. BARANOV ◽  
G.I. BRITVICH ◽  
V.N. CHEPEGIN ◽  
YU.A. CHESNOKOV ◽  
...  

This report overviews studies accomplished in the U70 proton synchrotron of IHEP-Protvino during the recent two decades. Major attention is paid to a routine application of bent crystals for beam extraction from the machine. It has been confirmed experimentally that efficiency of beam extraction with a crystal deflector of around 85% is well feasible for a proton beam with intensity up to 1012 protons per cycle. Another trend is to use bent crystals for halo collimation in a high energy collider. New promising options emerge for, say, LHC and ILC based on the "volume reflection" effect, which has been discovered recently in machine study runs at U70 of IHEP (50 GeV) and SPS of CERN (400 GeV). Perspectives to use bent crystals for extraction of light ions from the U70 accelerator are also disclosed.


1990 ◽  
Vol 201 ◽  
Author(s):  
F. Priolo ◽  
A. Battaglia ◽  
C. Spinella ◽  
E. Rimini

AbstractThe evolution of pre-existing damage structures in Si under high energy ion irradiation is discussed. Different initial morphologies are investigated: a sample partially pre-damaged with heavy ions and a sample partially pre-damaged with light ions are compared within them and with an undamaged single crystal. It is shown that ion irradiation can produce either damage accumulation, in the form of amorphous regions, or damage annealing depending on the pre-existing damage morphology, on the substrate temperature, and on the doping content in the irradiated layer. These data are discussed and interpreted on the basis of the existing models on ion induced amorphization and crystallization.


1990 ◽  
Vol 243 (4) ◽  
pp. 341-345 ◽  
Author(s):  
V.A. Budilov ◽  
A. Filipkowski ◽  
A. Golembiewski ◽  
V.I. Ilyuschenko ◽  
A. Korejwo ◽  
...  

2017 ◽  
Vol 73 ◽  
pp. 550-554 ◽  
Author(s):  
Madhu Lata Bharti ◽  
Fouran Singh ◽  
R.C. Ramola ◽  
Veena Joshi

1992 ◽  
Vol 02 (02) ◽  
pp. 107-128 ◽  
Author(s):  
MIKIO TAKAI

Scanning nuclear microprobes using Rutherford backscattering (RBS) and particle-induced X-ray emission (PIXE) with light ions have been formed using variable objective slits and a magnetic quadrupole doublet. Beam optics, focusing techniques, factors limiting the minimum beam-spot size, and data acquisition systems are discussed. Two- and three-dimensional RBS mapping and channeling contrast mapping of processed semiconductor layers such as multilayered wiring and focused ion-implanted layers are demonstrated. Problems with microbeam analysis such as radiation damages due to the probe beams are discussed.


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