Non-destructive diagnosis of wiring networks using time domain reflectometry and an improved black hole algorithm

2016 ◽  
Vol 32 (3) ◽  
pp. 286-300 ◽  
Author(s):  
M. K. Smail ◽  
H. R. E. H. Bouchekara ◽  
L. Pichon ◽  
H. Boudjefdjouf ◽  
A. Amloune ◽  
...  
Keyword(s):  
Black Hole ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Non Destructive ◽  
Black Hole Algorithm

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

Time Domain Reflectometry Technique for Failure Analysis

2004 ◽  
Author(s):  
Teoh King Long ◽  
Ko Yin Fern
Keyword(s):  
Failure Analysis ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Reference Plane ◽  
First Case ◽  
Main Emphasis ◽  
Plastic Ball ◽  
Solder Balls ◽  
Non Destructive

Abstract In time domain reflectometry (TDR), the main emphasis lies on the reflected waveform. Poor probing contact is one of the common problems in getting an accurate waveform. TDR probe normalization is essential before measuring any TDR waveforms. The advantages of normalization include removal of test setup errors in the original test pulse and the establishment of a measurement reference plane. This article presents two case histories. The first case is about a Plastic Ball Grid Array package consisting of 352 solder balls where the open failure mode was encountered at various terminals after reliability assessment. In the second, a three-digit display LED suspected of an electrical short failure was analyzed using TDR as a fault isolation tool. TDR has been successfully used to perform non-destructive fault isolation in assisting the routine failure analysis of open and short failure. It is shown to be accurate and reduces the time needed to identify fault locations.

Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package

2012 ◽  
Author(s):  
Lihong Cao ◽  
Manasa Venkata ◽  
Meng Yeow Tay ◽  
Wen Qiu ◽  
J. Alton ◽  
...  
Keyword(s):  
Time Domain ◽  
Flip Chip ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Experimental Results ◽  
Terahertz Pulse ◽  
Isolation And Identification ◽  
Isolation Technique ◽  
Non Destructive

Abstract Electro-optical terahertz pulse reflectometry (EOTPR) was introduced last year to isolate faults in advanced IC packages. The EOTPR system provides 10μm accuracy that can be used to non-destructively localize a package-level failure. In this paper, an EOTPR system is used for non-destructive fault isolation and identification for both 2D and 2.5D with TSV structure of flip-chip packages. The experimental results demonstrate higher accuracy of the EOTPR system in determining the distance to defect compared to the traditional time-domain reflectometry (TDR) systems.

Quantitative, zerstörungsfreie Feuchtemessung in Baustoffen vor Ort mit der Time Domain Reflectometry / Quantitative, non-destructive moisture measurement in building materials on site by time-domain re ectometry

1999 ◽  
Vol 5 (6) ◽  
pp. 609-618
Author(s):  
M. Stacheder ◽  
G. Grassegger ◽  
F. Grüner
Keyword(s):  
Time Domain ◽  
Building Materials ◽  
Salt Content ◽  
Time Domain Reflectometry ◽  
New Method ◽  
Measuring Methods ◽  
Surface Moisture ◽  
Non Destructive ◽  
Floor Cover

Abstract A new commercially available dielectric technique for the non-destructive determination of moisture in building materials based on the principle of 'time-domain reflectometry' (TDR) is presented. TDR measurements on samples of sandstone, brick, concrete and floor cover matched very well with results of conventional moisture measuring methods such as oven-drying or calciumcarbide-technique. The new method showed only a low influence of salt content or surface moisture of the material on the results.

Non-Destructive Failure Analysis of Power Devices via Time- Domain Reflectometry

2021 ◽  
Author(s):  
Kanuj Sharma ◽  
Simon Kamm ◽  
Valentyna Afanasenko ◽  
Kevin Munoz Baron ◽  
Ingmar Kallfass
Keyword(s):  
Failure Analysis ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Power Devices ◽  
Non Destructive

Monitoring of CaSO4 deposition behaviors on biofilm during nanofiltration via ultrasonic time-domain reflectometry (UTDR)

2010 ◽  
Vol 61 (11) ◽  
pp. 2853-2861 ◽  
Author(s):  
Y. L. Hou ◽  
J. X. Li ◽  
Y. N. Gao ◽  
X. C. Xu ◽  
Y. Cai ◽  
...  
Keyword(s):  
Time Domain ◽  
Pressure Effect ◽  
Membrane Surface ◽  
Time Domain Reflectometry ◽  
Sem Images ◽  
Differential Signal ◽  
Flux Decline ◽  
Ultrasonic Time ◽  
Ultrasonic Measurements ◽  
Non Destructive

The ultrasonic time-domain reflectometry (UTDR) as a non-destructive real-time method was employed to monitor the CaSO4 deposition behaviors on biofilm during nanofiltration (NF). Two parallel experiments were performed to compare the different behaviors of CaSO4 deposition with and without biofilm on the membrane. Results showed that the flux decline during combined fouling was slower than that in case of CaSO4 fouling alone. The Ca2 +  rejection obtained with biofilm was higher than that without. A larger acoustic differential signal obtained by UTDR in the combined fouling revealed a denser and thicker layer formed on the membrane surface. Furthermore, the amount of CaSO4 deposition on the biofouled membrane was more than that on non-biofouled membrane as a result of microorganisms as crystal nucleus to induce CaSO4 crystallization and deposition. SEM images indicate that the CaSO4 crystals deposited in order on the non-biofouled membrane, whereas on the biofouled membrane they were embedded in the biofilm. The denser and thicker fouling layer formed with biofilm was impermeable, resulting in a high Ca2 +  rejection. The complexation of Ca with polysaccharide in biofilm would eliminate the cake-enhanced osmotic pressure effect leading to a slow flux decline. To sum up, the independent measurements corroborate the ultrasonic measurements.

Microvia Non-Destructive Inspection Method

2009 ◽  
Author(s):  
Cholmin Choi ◽  
Abhijit Dasgupta
Keyword(s):  
Time Domain ◽  
Metal Layer ◽  
Experimental Methods ◽  
Time Domain Reflectometry ◽  
Reflow Process ◽  
Inspection Method ◽  
Infra Red ◽  
Inspection Techniques ◽  
Non Destructive ◽  
Poor Adhesion

In this paper, the effectiveness of two non-destructive inspection techniques were investigated for quality assessment of microvias in high-density PWBs. Manufactured PWBs can fail during the reflow process due to microvia quality issues such as thin metallization in the barrel or shoulder of microvia or poor adhesion between the microvias and the metal layer underneath. The two investigated non-destructive inspection techniques are Transient Infra-red Thermography (IRT) and Time Domain Reflectometry (TDR). This study develops experimental methods to obtain thermal signatures of microvias using IRT technique and RF impedance signatures of microvias using TDR technique. Numerical analysis methods are also developed in this study to quantify and interpret the obtained microvia signatures to validate the functionality of selected non-destructive microvia inspection techniques.

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