Preparation and properties of polyimide multilayer films via roll coating technique

The aim of this article was the fabrication of Al2O3/Pd(NO3)2/zeolite adsorbent through roll-coating technique for CO gas adsorption. Transmission electron microscopy (TEM), field-emission scanning electron microscopy (FESEM), X-ray diffraction (XRD), and energy-dispersive x-ray spectroscopy (EDX) were performed to investigate the morphological, structural, and elemental properties of Al2O3/Pd(NO3)2/zeolite adsorbent. A continuous gas analyzer KIMO KIGAZ 210 was applied for testing CO gas adsorption on as-present adsorbent in an experimental set-up. The calculated amounts of adsorption capacity at equilibrium time was 111.16 mg g-1 according to the previous published article. The Elovich, Avrami, and Fractional power kinetic models were studied for this adsorbent. The equal value of experimental and theoretical adsorption capacity at equilibrium time as well as the unit value of regression coefficient indicate that Avrami kinetic model was a suitable model to describe Co removal through Al2O3/Pd(NO3)2/zeolite adsorbent.

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Synthesis of ZnO sol–gel thin-films CMOS-Compatible

RSC Advances ◽

10.1039/d1ra02241e ◽

2021 ◽

Vol 11 (37) ◽

pp. 22723-22733

Author(s):

Nizar Ben Moussa ◽

Mohamed Lajnef ◽

Nessrine Jebari ◽

Cedric Villebasse ◽

Fabien Bayle ◽

...

Keyword(s):

Thin Films ◽

Spin Coating ◽

Low Cost ◽

Sol Gel ◽

Multilayer Films ◽

Simple Synthesis ◽

Spin Coating Technique ◽

Silicon Substrates ◽

Coating Technique ◽

Cmos Compatible

A low-cost sol–gel spin-coating technique is used in this study for the simple synthesis of eco-friendly ZnO multilayer films deposited on (100)-oriented silicon substrates ranging from 150 to 600 nm by adjusting the spin coating rate.

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A Combined Slot and Roll Coating Technique

The Mechanics of Thin Film Coatings ◽

10.1142/9789814503914_0021 ◽

1996 ◽

Author(s):

S. Krauss ◽

F. Durst ◽

H. Raszillier

Keyword(s):

Roll Coating ◽

Coating Technique

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Fabrication and characterization - by High Resolution Electron Microscopy and atom probe microanalysis - of Co-based metallic multilayer films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s042482010017699x ◽

1990 ◽

Vol 48 (4) ◽

pp. 772-773

Author(s):

Amanda K. Petford-Long ◽

A. Cerezo ◽

M.G. Hetherington

Keyword(s):

Electron Microscopy ◽

High Resolution ◽

High Resolution Electron Microscopy ◽

Atom Probe ◽

Multilayer Films ◽

Interface Roughness ◽

Probe Field ◽

Resolution Electron ◽

Potential Applications ◽

Field Ion Microscope

The fabrication of multilayer films (MLF) with layer thicknesses down to one monolayer has led to the development of materials with unique properties not found in bulk materials. The properties of interest depend critically on the structure and composition of the films, with the interfacial regions between the layers being of particular importance. There are a number of magnetic MLF systems based on Co, several of which have potential applications as perpendicular magnetic (e.g Co/Cr) or magneto-optic (e.g. Co/Pt) recording media. Of particular concern are the effects of parameters such as crystallographic texture and interface roughness, which are determined by the fabrication conditions, on magnetic properties and structure.In this study we have fabricated Co-based MLF by UHV thermal evaporation in the prechamber of an atom probe field-ion microscope (AP). The multilayers were deposited simultaneously onto cobalt field-ion specimens (for AP and position-sensitive atom probe (POSAP) microanalysis without exposure to atmosphere) and onto the flat (001) surface of oxidised silicon wafers (for subsequent study in cross-section using high-resolution electron microscopy (HREM) in a JEOL 4000EX. Deposi-tion was from W filaments loaded with material in the form of wire (Co, Fe, Ni, Pt and Au) or flakes (Cr). The base pressure in the chamber was around 8×10−8 torr during deposition with a typical deposition rate of 0.05 - 0.2nm/s.

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Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

MRS Proceedings ◽

10.1557/proc-473-63 ◽

1997 ◽

Vol 473 ◽

Author(s):

H. S. Yang ◽

F. R. Brotzen ◽

D. L. Callahan ◽

C. F. Dunn

Keyword(s):

Thin Film ◽

Electron Microscopy ◽

Scanning Electron Microscopy ◽

Distribution Function ◽

Quantitative Measurement ◽

Multilayer Films ◽

Adhesion Testing ◽

Novel Technique ◽

Electrostatic Adhesion ◽

Scanning Electron

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

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