scholarly journals Influence of Thermal Aging on Lead-Free Solder Joints Reliability: A Review

2020 ◽  
Vol 864 ◽  
pp. 012183
Author(s):  
Chang May Shin ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Dewi Suriyani Che Halin
Keyword(s):  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

2019 ◽  
Author(s):  
Tusher Ahmed ◽  
Mohammad Motalab ◽  
Jeffrey C. Suhling
Keyword(s):  
Thermal Aging ◽  
Flip Chip ◽  
Solder Joints ◽  
Mass Diffusion ◽  
Lead Free ◽  
Small Scale ◽  
Time To Failure ◽  
Lead Free Solder ◽  
Aging Effects ◽  
Free Solder

Abstract Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issues found in electronic packages. This current investigation deals with the review of mechanical property degradations of SAC305(Sn-96.5Ag-3.0Cu-0.5) solder materials due to thermal aging and their effects on electromigration oriented failure of small scale flip chip solder bumps. Thermal aging causes significant degradation of ultimate strength as well as elastic modulus of the SAC solder material. This degradation in stress-strain relationship plays an utterly important role in electromigration oriented mass diffusion and subsequent failure in the solder joints. This research highlights the linkage between thermal aging oriented strength degradation and its effect on electromigration oriented void propagation rate and time to failure. Structural-electric diffusion analyses with a finite element analysis software have been performed and results derived from different aging conditions (1 to 60 days of aging at 100 °C) at different electromigration temperatures have revealed that mass diffusion due to electromigration and associated stress migration actually reduces with the increment of aging time and thus increases time to failure in case of a flip chip solder joint. Simulation results have been found to be in good agreement with the experimental results available in literatures. These results can pave way to further detailed experimental investigation on effect of thermal aging on electromigration.

1849 Thermal aging effects on fatigue crack propagation on lead-free solder joints

2005 ◽  
Vol 2005.6 (0) ◽  
pp. 275-276
Author(s):  
Masaki OMIYA ◽  
Satoshi Tsuchiya ◽  
Hirotsugu INOUE ◽  
Kikuo KISHIMOTO ◽  
Masazumi AMAGAI
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Aging Effects ◽  
Free Solder

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

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