scholarly journals Quantitative analysis of compatible microstructure by electron backscatter diffraction

Author(s):  
Michael Chapman ◽  
Marc De Graef ◽  
Richard D. James ◽  
Xian Chen

We propose a scheme for assigning the martensite variant using electron backscatter diffraction in a martensite material that undergoes a solid–solid phase transformation. Based on the solutions of the crystallographic equations of martensite, we provide an algorithm to assign martensite variants to a particular microscopic region, and to check the elastic compatibility of the microstructure corresponding to low hysteresis and high reversibility in shape memory alloys. This article is part of the theme issue ‘Topics in mathematical design of complex materials’.

2008 ◽  
Vol 2008 ◽  
pp. 1-7 ◽  
Author(s):  
I. Lischewski ◽  
D. M. Kirch ◽  
A. Ziemons ◽  
G. Gottstein

A newly developed laser powered heating stage for commercial SEMs in combination with automated established electron backscatter diffraction (EBSD) data acquisition is presented. This novel experimental setup can be used to achieve more information about microstructure and orientation changes during grain growth, recrystallization, recovery, and phase transformations. First results on the α−γ−α phase transformation in steel within 886∘C–900∘C are presented.


Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


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