scholarly journals Thermodynamic analysis of point mutations inhibiting high-temperature reversible oligomer of PDZ3

2020 ◽  
Author(s):  
T. Saotome ◽  
T. Mezaki ◽  
B. Subbaian ◽  
S. Unzai ◽  
J. C. Martinez ◽  
...  

AbstractDifferential scanning calorimetry (DSC) indicated that PDZ3 undergoes a peculiar thermal denaturation exhibiting two endothermic peaks due to the formation of reversible oligomers at high temperature (N↔I6↔D). This contrasts sharply with the standard 2-state denaturation model observed for small, globular proteins. We performed an alanine scanning analysis by individually mutating three hydrophobic residues at the crystallographic oligomeric interface (Phe340, Leu342, Ile389) and one away from the interface (Leu349, as a control). DSC analysis indicated that PDZ3-F340A and PDZ3-L342A exhibited a single endothermic peak. Furthermore, PDZ3-L342A underwent a perfect 2-state denaturation, as evidenced by the single endothermic peak, and confirmed by detailed DSC analysis, including global fitting of data measured at different protein concentrations. Reversible oligomerization (RO) at high temperatures by small globular proteins is a rare event. While we designed the mutations based on our previous study showing that a point mutation Val380 to a nonhydrophobic amino acid inhibited RO in DEN4 ED3, the results are nevertheless surprising since high-temperature RO involves proteins in a denatured state, as assessed by circular dichroism. Future studies will determine how and why mutations designed using crystal structures determined at ambient temperatures influence the formation of RO at high temperatures, and whether high-temperature ROs are related to the propensity of proteins to aggregate or precipitate at lower temperatures, which would provide a novel and unique way of controlling protein solubility and aggregation.SignificanceDespite being a small globular protein, which normaly undergo a two-state unfolding, the thermal denaturation of PSD95-PDZ3, monitored by DSC, exhibited two endothermic peaks. The second peak resulted from a reversible oligomerization (RO) at high temperatures, which is, on its own, a rare phenomenon. In this study, we show that the substitution of a single hydrophobic residue to an alanine at the interface of the crystallographic tetramers inhibited high-temperature RO, resulting in a single endothermic peak. Future studies are required to determine why mutations designed using crystal structures determined at ambient temperatures can inhibit high-temperature RO, and whether the ROs are precursor of irreversible aggregation, If so, the present observations will provide an entirely new basis for creating aggregation-resistant proteins.

Author(s):  
J. L. Farrant ◽  
J. D. McLean

For electron microscope techniques such as ferritin-labeled antibody staining it would be advantageous to have available a simple means of thin sectioning biological material without subjecting it to lipid solvents, impregnation with plastic monomers and their subsequent polymerization. With this aim in view we have re-examined the use of protein as an embedding medium. Gelatin which has been used in the past is not very satisfactory both because of its fibrous nature and the high temperature necessary to keep its solutions fluid. We have found that globular proteins such as the serum and egg albumins can be cross-linked so as to yield blocks which are suitable for ultrathin sectioning.


2003 ◽  
Vol 762 ◽  
Author(s):  
A. Gordijn ◽  
J.K. Rath ◽  
R.E.I. Schropp

AbstractDue to the high temperatures used for high deposition rate microcrystalline (μc-Si:H) and polycrystalline silicon, there is a need for compact and temperature-stable doped layers. In this study we report on films grown by the layer-by-layer method (LbL) using VHF PECVD. Growth of an amorphous silicon layer is alternated by a hydrogen plasma treatment. In LbL, the surface reactions are separated time-wise from the nucleation in the bulk. We observed that it is possible to incorporate dopant atoms in the layer, without disturbing the nucleation. Even at high substrate temperatures (up to 400°C) doped layers can be made microcrystalline. At these temperatures, in the continuous wave case, crystallinity is hindered, which is generally attributed to the out-diffusion of hydrogen from the surface and the presence of impurities (dopants).We observe that the parameter window for the treatment time for p-layers is smaller compared to n-layers. Moreover we observe that for high temperatures, the nucleation of p-layers is more adversely affected than for n-layers. Thin, doped layers have been structurally, optically and electrically characterized. The best n-layer made at 400°C, with a thickness of only 31 nm, had an activation energy of 0.056 eV and a dark conductivity of 2.7 S/cm, while the best p-layer made at 350°C, with a thickness of 29 nm, had an activation energy of 0.11 V and a dark conductivity of 0.1 S/cm. The suitability of these high temperature n-layers has been demonstrated in an n-i-p microcrystalline silicon solar cell with an unoptimized μc-Si:H i-layer deposited at 250°C and without buffer. The Voc of the cell is 0.48 V and the fill factor is 70 %.


2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.


Alloy Digest ◽  
1995 ◽  
Vol 44 (3) ◽  

Abstract NICROFER 5520 Co is a nickel-chromium-cobalt-molybdenum alloy with excellent strength and creep properties up to high temperatures. Due to its balanced chemical composition the alloy shows outstanding resistance to high temperature corrosion in the form of oxidation and carburization. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance as well as forming, heat treating, machining, and joining. Filing Code: Ni-480. Producer or source: VDM Technologies Corporation.


Alloy Digest ◽  
1994 ◽  
Vol 43 (7) ◽  

Abstract Carlson Alloy C601 is characterized by high tensile, yield and creep-rupture strengths for high temperature service. The alloy is not embrittled by extended exposure to high temperatures and has excellent resistance to stress-corrosion cracking, to carburizing, nitriding and sulfur containing environments. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on forming, heat treating, machining, and joining. Filing Code: Ni-458. Producer or source: G.O. Carlson Inc.


Alloy Digest ◽  
2005 ◽  
Vol 54 (11) ◽  

Abstract Incotherm TD is a thermocouple-sheathing alloy with elements of silicon and rare earths to enhance oxidation resistance at high temperatures. This datasheet provides information on composition, physical properties, and tensile properties as well as deformation. It also includes information on high temperature performance and corrosion resistance as well as forming. Filing Code: Ni-628. Producer or source: Special Metals Corporation.


Alloy Digest ◽  
1954 ◽  
Vol 3 (12) ◽  

Abstract HASTELLOY Alloy X is a nickel-chromium-iron-molybdenum alloy recommended for high-temperature applications. It has outstanding oxidation resistance at high temperatures under most operating conditions, and good high-temperature strength. This datasheet provides information on composition, physical properties, and tensile properties as well as creep. It also includes information on forming, heat treating, and machining. Filing Code: Ni-14. Producer or source: Haynes Stellite Company.


Alloy Digest ◽  
2011 ◽  
Vol 60 (11) ◽  

Abstract Kubota Alloy HT is an iron-chromium-nickel alloy that has both strength and oxidation resistance at high temperatures. This datasheet provides information on composition, physical properties, and tensile properties as well as creep. It also includes information on high temperature performance as well as casting and joining. Filing Code: SS-1108. Producer or source: Kubota Metal Corporation, Fahramet Division.


Alloy Digest ◽  
1964 ◽  
Vol 13 (7) ◽  

Abstract Kentanium K138-A is a high temperature titanium carbide that greatly widens the scope of the engineering design where conditions of intermittent or continuous high temperatures in oxidizing atmospheres are combined with abrasion, and compressive or tensile loads. This datasheet provides information on composition, physical properties, hardness, elasticity, and compressive strength as well as fracture toughness, creep, and fatigue. It also includes information on machining and joining. Filing Code: Ti-40. Producer or source: Kennametal Inc..


Alloy Digest ◽  
1963 ◽  
Vol 12 (4) ◽  

Abstract RA 309 is a chromium-nickel heat and corrosion resistant steel recommended for high temperatures applications. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: SS-142. Producer or source: Rolled Alloys Inc..


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