High‐resolution integration of passives using micro‐contact printing (μCP)

2003 ◽  
Vol 20 (1) ◽  
pp. 52-55 ◽  
Author(s):  
Charles D.E. Lakeman ◽  
Patrick F. Fleig
Keyword(s):  
High Resolution ◽  
Thick Film ◽  
Large Range ◽  
Device Fabrication ◽  
Processing Conditions ◽  
Contact Printing ◽  
Passive Components ◽  
Materials Properties ◽  
New Methods ◽  
Near Net Shape

As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of board space. In this paper, we will describe the performance capabilities of TPL's micro‐contact printing (μCP) process to fabricate near‐net‐shape structures with feature sizes ranging from 100 microns to the sub‐micron scale. Like thick film processes, this novel process is compatible with a broad materials base, making a large range of materials properties available. Unlike thick film, however, this novel process employs powder‐free inks that can be patterned with high resolution. It is anticipated that this process will enable integration of passive components that show thin film performance at thick film cost. Emphasis in this paper will be placed on processing conditions, and materials properties to demonstrate the feasibility of this process for passive device fabrication.

Formation of Large, Orientation-Controlled, Nearly Single Crystalline Si Thin Films on SiO2 Using Contact Printing of Rolled and Annealed Nickel Tapes

2003 ◽  
Vol 762 ◽  
Author(s):  
Hwang Huh ◽  
Jung H. Shin
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
High Resolution ◽  
Amorphous Silicon ◽  
Tem Analysis ◽  
Contact Printing ◽  
Single Crystalline ◽  
High Resolution Tem ◽  
Lateral Crystallization ◽  
Si Films

AbstractAmorphous silicon (a-Si) films prepared on oxidized silicon wafer were crystallized to a highly textured form using contact printing of rolled and annealed nickel tapes. Crystallization was achieved by first annealing the a-Si film in contact with patterned Ni tape at 600°C for 20 min in a flowing forming gas (90 % N2, 10 % H2) environment, then removing the Ni tape and further annealing the a-Si film in vacuum for2hrsat600°C. An array of crystalline regions with diameters of up to 20 μm could be formed. Electron microscopy indicates that the regions are essentially single-crystalline except for the presence of twins and/or type A-B formations, and that all regions have the same orientation in all 3 directions even when separated by more than hundreds of microns. High resolution TEM analysis shows that formation of such orientation-controlled, nearly single crystalline regions is due to formation of nearly single crystalline NiSi2 under the point of contact, which then acts as the template for silicide-induced lateral crystallization. Furthermore, the orientation relationship between Si grains and Ni tape is observed to be Si (110) || Ni (001)

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Powder Metallurgy Aluminum Alloys: Structure and Porosity

2019 ◽  
Author(s):  
Will Judge ◽  
Georges Kipouros
Keyword(s):  
Powder Metallurgy ◽  
Aluminum Alloys ◽  
Material Properties ◽  
Cost Effective ◽  
High Reactivity ◽  
Commercial Production ◽  
Processing Conditions ◽  
Near Net Shape ◽  
And Performance ◽  
Production Conditions

The production of aluminum alloys through powder metallurgy (PM) processes allows for the manufacture of net- or near-net-shape components in a cost-effective and sustainable manner. The high reactivity of aluminum metal, however, complicates PM processing, and special attention must be given to certain steps during production, particularly sintering. PM processing conditions strongly affect the structure and porosity of aluminum PM alloys, which ultimately determine their material properties and performance. In this article, the fundamental aspects of the commercial production of aluminum PM alloys are presented, along with the effects of production conditions on the structure and porosity of aluminum PM alloys. The properties and performance of aluminum PM alloys are then analyzed and interpreted with respect to their structure and porosity.

EPD of Phosphors for Display and Solid State Lighting Technologies

2012 ◽  
Vol 507 ◽  
pp. 149-153 ◽  
Author(s):  
Jae Ik Choi ◽  
Esther Sluzky ◽  
Maria Anc ◽  
Alan Piquette ◽  
Mark E. Hannah ◽  
...  
Keyword(s):  
Solid State ◽  
High Resolution ◽  
Zeta Potential ◽  
Salt Concentration ◽  
Solid State Lighting ◽  
Processing Conditions ◽  
Nitrate Salt ◽  
Deposition Rates ◽  
Information Displays ◽  
Effects Of Ph

Electrophoretic deposition (EPD) has been used for phosphor screening for a variety of emissive information displays and more recently, for solid state lighting. EPD is well suited to deposit the fine (nanometer to micrometer diameter) phosphor particles needed for high resolution displays. The fundamentals of the EPD process in an isopropanol (IPA) bath have been characterized by the dissociation behavior of nitrate salts in IPA, measurement of the effects of pH and nitrate salt concentration on the zeta potential of the particles, studying of the processing conditions and modeling of the deposition rates. The electrochemical precipitation reactions form an adhesive agent for the particles and the adhesion strength can be enhanced by various methods to meet the requirements of these technologies.

High-Resolution Contact Printing with Dendrimers

Nano Letters ◽  
2002 ◽  
Vol 2 (4) ◽  
pp. 347-349 ◽  
Author(s):  
Hongwei Li ◽  
Dae-Joon Kang ◽  
Mark G. Blamire ◽  
Wilhelm T. S. Huck
Keyword(s):  
High Resolution ◽  
Contact Printing
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