Voltage Divider Networks for Photomultipliers (PM Bridge): High Voltage Thick Film Resistor System

1991 ◽  
Vol 8 (2) ◽  
pp. 65-66
Author(s):  
S. Schmitt ◽  
H. Kuznicki
2014 ◽  
Vol 2014 ◽  
pp. 1-5 ◽  
Author(s):  
Busi Rambabu ◽  
Y. Srinivasa Rao

The purpose of this paper is to study high voltage interactions in polymer thick film resistors, namely, polyvinyl chloride- (PVC-) graphite thick film resistors, and their applications in universal trimming of these resistors. High voltages in the form of impulses for various pulse durations and with different amplitudes have been applied to polymer thick film resistors and we observed the variation of resistance of these resistors with high voltages. It has been found that the resistance of polymer thick film resistors decreases in the case of higher resistivity materials and the resistance of polymer thick film resistor increases in the case of lower resistivity materials when high voltage impulses are applied to them. It has been also found that multiple high voltage pulse (MHVP) stressing can be used to trim the polymer thick film resistors either upwards or downwards.


1982 ◽  
Vol 1 (1) ◽  
pp. 24-27 ◽  
Author(s):  
I. Taitl

Fired resistors exhibit variations which are minimised by abrasive and laser trimming. The latter may cause unstable behaviour which is further aggravated by thermal shock. The chemical structure of a thick film resistor is analysed with respect to mechanical stress, and the theoretical conclusion that the coefficient of thermal expansion of the resistor should be equal to or smaller than that of the substrate is verified experimentally. The thermal behaviour of ruthenium dioxide is examined and a range of CTE values are determined for materials of varying chemical composition. The relationship between CTE and post laser trimming stability is demonstrated on four thick film resistors which differ in thermal expansion. It is pointed out that formulations with high metallic content can absorb tensile stress by elastic deformation, thus minimising the formation or propagation of laser induced cracks.


Sign in / Sign up

Export Citation Format

Share Document