Comparing 2D and 3D numerical simulation results of gas flow velocity in convection reflow oven
Purpose – This paper aims to compare and study two-dimensional (2D) and three-dimensional (3D) computational fluid dynamics simulation results of gas flow velocity in a convection reflow oven and show the differences of the different modeling aspects. With the spread of finer surface-mounted devices, it is important to understand convection reflow soldering technology more deeply. Design/methodology/approach – Convection reflow ovens are divided into zones. Every zone contains an upper and a lower nozzle-matrix. The gas flow velocity field is one of the most important parameters of the local heat transfer in the oven. It is not possible to examine the gas flow field with classical experimental methods due to the extreme circumstances in the reflow oven. Therefore, numerical simulations are necessary. Findings – The heat transfer changes highly along the moving direction of the assembly, and it is nearly homogeneous along the traverse direction of the zones. The gas flow velocity values of the 2D model are too high due to the geometrical distortions of the 2D model. On the other hand, the calculated flow field of the 2D model is more accurate than in the 3D model due to the finer mesh. Research limitations/implications – Investigating the effects of tall components on a printed wiring board inside the gas flow field and further analysis of the mesh size effect on the models. Practical implications – The presented results can be useful during the design of a simulation study in a reflow oven (or in similar processes). Originality/value – The presented results provide a completely novel approach from the aspect of 2D and 3D simulations of a convection reflow oven. The results also reveal the heat transfer differences.