Automatic defect classification of printed wiring board solder joints

1990 ◽  
Vol 13 (2) ◽  
pp. 331-340 ◽  
Author(s):  
M.R. Driels ◽  
D.J. Nolan
Keyword(s):  
Solder Joints ◽  
Defect Classification ◽  
Printed Wiring Board ◽  
Wiring Board

Life Prediction of SnPb and SnAg Solder Joints in PBGA Packages Using a Severity Metric

2003 ◽  
Author(s):  
Donghyun Kim ◽  
Andrew Mawer ◽  
Tess J. Moon ◽  
Glenn Y. Masada
Keyword(s):  
Life Prediction ◽  
Solder Joints ◽  
Mean Value ◽  
Printed Wiring Board ◽  
Geometric Configurations ◽  
Design And Manufacturing ◽  
Creep Time ◽  
Snag Solder ◽  
Wiring Board ◽  
Life Predictions

A severity metric is developed to predict the life of SnPb and SnAg solder joints in PBGA packages by quantitatively estimating the changes in damage arising from different board configurations and accelerated thermal cycle tests (ATC). Damage measures include time-dependent creep, time-independent plastic deformation, and an effective stress that is computed from the ATC parameters of temperatures, dwell-time, and ramp rates and from package geometries on the printed wiring board. Life prediction using this severity metric has been applied to 24 sets of test data on SnPb and SnAg solder joints in 357-PBGA packages and include three post-processing conditions (aged at 150/160°C, quenched at 0°C, and air-cooled), three ATC test conditions (0–100°C, −40–125°C, and −55–125°C), and four package-on-board geometric configurations. Statistical analysis is provided to compare the life predictions based upon the severity metric and from ATC testing—predicted joint life is well within one standard deviation of the experimental mean value of life for most of the 24 cases. The severity metric can be used to quantify the effects of design and manufacturing choices on joint life.

scholarly journals Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

2006 ◽  
Vol 49 (2) ◽  
pp. 220-228 ◽  
Author(s):  
Kohta NAGANO ◽  
Akihiro YAGUCHI ◽  
Takeshi TERASAKI ◽  
Kenichi YAMAMOTO
Keyword(s):  
Fatigue Strength ◽  
Solder Joints ◽  
Portable Device ◽  
Printed Wiring Board ◽  
Wiring Board

scholarly journals Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

2005 ◽  
Vol 71 (701) ◽  
pp. 177-184 ◽  
Author(s):  
Kohta NAGANO ◽  
Akihiro YAGUCHI ◽  
Takeshi TERASAKI ◽  
Munehiro YAMADA
Keyword(s):  
Fatigue Strength ◽  
Solder Joints ◽  
Portable Device ◽  
Printed Wiring Board ◽  
Wiring Board

Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability

1994 ◽  
Vol 116 (4) ◽  
pp. 242-248 ◽  
Author(s):  
Teh-Hua Ju ◽  
Wei Lin ◽  
Y. C. Lee ◽  
Jay J. Liu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Printed Wiring Board ◽  
Ceramic Ball ◽  
Solder Volume ◽  
Bga Package ◽  
Reliability Of Solder Joints ◽  
Wiring Board

The effects of manufacturing variations on the reliability of solder joints between a ceramic ball grid array (BGA) package and a printed wiring board (PWB) are investigated. Two cases are studied, namely, with and without spacers between the BGA package and the PWB to maintain the solder joint height. Manufacturing variations considered include changes in solder volume, joint height, and pad size. To evaluate the effect of manufacturing variations on reliability, every possible solder joint profile is first derived. The maximum strain is calculated next. Finally, the fatigue life is predicted. The calculations show that these manufacturing variations change the joint profile, and subsequently affect the fatigue life. Since the package is heavy, the use of spacers is necessary to control the solder joint height for reliable connections, and to maintain a large gap for cleaning. The solder joints formed with the use of spacers, may have convex, cylindrical or concave profiles. The concave solder joints are preferred, since they have long fatigue lives and are less sensitive to the manufacturing variations. For the convex solder joints, their fatigue lives are strongly affected by the joint height variation caused by package warpage and by the combined effects of solder volume and pad size.

scholarly journals Intelligent radar software defect classification approach based on the latent Dirichlet allocation topic model

2021 ◽  
Vol 2021 (1) ◽  
Author(s):  
Xi Liu ◽  
Yongfeng Yin ◽  
Haifeng Li ◽  
Jiabin Chen ◽  
Chang Liu ◽  
...  
Keyword(s):  
Latent Dirichlet Allocation ◽  
Topic Model ◽  
Recall Rate ◽  
Defect Classification ◽  
Software Defects ◽  
Classification Approach ◽  
Software Defect ◽  
Model Combining ◽  
Dirichlet Allocation

AbstractExisting software intelligent defect classification approaches do not consider radar characters and prior statistics information. Thus, when applying these appaoraches into radar software testing and validation, the precision rate and recall rate of defect classification are poor and have effect on the reuse effectiveness of software defects. To solve this problem, a new intelligent defect classification approach based on the latent Dirichlet allocation (LDA) topic model is proposed for radar software in this paper. The proposed approach includes the defect text segmentation algorithm based on the dictionary of radar domain, the modified LDA model combining radar software requirement, and the top acquisition and classification approach of radar software defect based on the modified LDA model. The proposed approach is applied on the typical radar software defects to validate the effectiveness and applicability. The application results illustrate that the prediction precison rate and recall rate of the poposed approach are improved up to 15 ~ 20% compared with the other defect classification approaches. Thus, the proposed approach can be applied in the segmentation and classification of radar software defects effectively to improve the identifying adequacy of the defects in radar software.

Feature extraction and selection for defect classification of pulsed eddy current NDT

2008 ◽  
Vol 41 (6) ◽  
pp. 467-476 ◽  
Author(s):  
Tianlu Chen ◽  
Gui Yun Tian ◽  
Ali Sophian ◽  
Pei Wen Que
Keyword(s):  
Feature Extraction ◽  
Eddy Current ◽  
Defect Classification ◽  
Pulsed Eddy Current ◽  
Feature Extraction And Selection ◽  
Selection For

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

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