Extrinsic base surface passivation in GaInP/GaAs heterojunction bipolar transistors

1993 ◽  
Vol 14 (6) ◽  
pp. 301-303 ◽  
Author(s):  
W. Liu ◽  
E. Beam ◽  
T. Henderson ◽  
S.-K. Fan
1993 ◽  
Vol 32 (Part 2, No. 10B) ◽  
pp. L1500-L1502 ◽  
Author(s):  
Hiroshi Ito ◽  
Osaake Nakajima ◽  
Koichi Nagata ◽  
Takashi Makimura ◽  
Tadao Ishibashi

1997 ◽  
Vol 18 (9) ◽  
pp. 426-428 ◽  
Author(s):  
R. Tang ◽  
J. Ford ◽  
B. Pryor ◽  
S. Anandakugan ◽  
P. Welch ◽  
...  

2003 ◽  
Vol 798 ◽  
Author(s):  
Toshiki Makimoto ◽  
Yoshiharu Yamauchi ◽  
Kazuhide Kumakura

ABSTRACTWe have investigated high-power characteristics of GaN/InGaN double heterojunction bipolar transistors on SiC substrates grown by metalorganic vapor phase epitaxy. The p-InGaN extrinsic base layers were regrown to improve ohmic characteristics of the base. Base-collector diodes showed low leakage current at their reverse bias voltages due to a wide bandgap of a GaN collector, resulting in a high-voltage transistor operation. A 90 μm × 50 μm device operated up to a collector-emitter voltage of 28 V and a collector current of 0.37 A in its common-emitter current-voltage characteristics at room temperature, which corresponds to a DC power of 10.4 W. A collector current density and a power density are as high as 8.2 kA/cm2 and 230 kW/cm2, respectively. These results show that nitride HBTs are promising for high-power electronic devices.


Sign in / Sign up

Export Citation Format

Share Document