scholarly journals The feasibility of Carbon Nanotubes for power delivery in 3-D Integrated Circuits

2012 ◽  
Author(s):  
Nauman H. Khan ◽  
Soha Hassoun
Keyword(s):  
Carbon Nanotubes ◽  
Integrated Circuits ◽  
Power Delivery

Electrothermal Analysis of Carbon Nanotubes Power Delivery Networks for Nanoscale Integrated Circuits

2016 ◽  
Vol 15 (3) ◽  
pp. 380-388 ◽  
Author(s):  
Alessandro Magnani ◽  
Massimiliano de Magistris ◽  
Aida Todri-Sanial ◽  
Antonio Maffucci
Keyword(s):  
Carbon Nanotubes ◽  
Integrated Circuits ◽  
Power Delivery ◽  
Power Delivery Networks ◽  
Delivery Networks

The Impact of Carbon Nanotubes and Graphene on Electronics Industry

2018 ◽  
pp. 2897-2907
Author(s):  
Rafael Vargas-Bernal ◽  
Gabriel Herrera-Pérez ◽  
Margarita Tecpoyotl-Torres
Keyword(s):  
Carbon Nanotubes ◽  
Electrical Properties ◽  
Integrated Circuits ◽  
Electronics Industry ◽  
Future Trends ◽  
Technology Roadmap ◽  
The World ◽  
Materials Used ◽  
Short Time ◽  
The Impact

Since its discovery in 1991 and 2004, carbon nanotubes (CNTs) by Sumio Iijima, and graphene by Andre Geim and Konstantin Novoselov in 2004, these materials have been extensively studied around the world. Both materials have electronic, thermal, magnetic, optical, chemical, and mechanical extraordinary properties. International Technology Roadmap for Semiconductors (ITRS) has predicted that these nanomaterials are potential replacements of the conventional materials used in the manufacture of integrated circuits. Two of the technological aspects that both materials share and have reduced their extensive use are processing and dispersion required to homogenize the electrical properties of the materials based on them. Fortunately, these problems are being solved thanks to the ongoing investigation, and in a short time the materials used in today's electronics industry will be replaced by devices based on these novel materials. The impact of the applications of both materials in the electronics industry, as well as future trends in the following decades are discussed in this paper.

Development of Backside Buried Metal Layer Technology for 3D-ICs

2019 ◽  
Vol 2019 (1) ◽  
pp. 000268-000273
Author(s):  
Naoya Watanabe ◽  
Yuuki Araga ◽  
Haruo Shimamoto ◽  
Katsuya Kikuchi ◽  
Makoto Nagata
Keyword(s):  
Integrated Circuits ◽  
Metal Layer ◽  
Three Dimensional ◽  
Chip Thickness ◽  
Power Delivery ◽  
Silicon Structure ◽  
Metal Insulator ◽  
3D Ics ◽  
Power Delivery Network ◽  
Global Power

Abstract In this study, we developed backside buried metal (BBM) layer technology for three-dimensional integrated circuits (3D-ICs). In this technology, a BBM layer for global power routing is introduced in the large vacant area on the backside of each chip and is parallelly connected with the frontside routing of the chip. The resistances of the power supply (VDD) and ground (VSS) lines consequently decrease. In addition, the BBM structure acts as a decoupling capacitor because it is buried in the Si substrate and has metal–insulator–silicon structure. Therefore, the impedance of power delivery network can be reduced by introducing the BBM layer. The fabrication process of the BBM layer for 3D-ICs was simple and compatible with the via-last through-silicon via (TSV) process. With this process, it was possible to fabricate the BBM layer consisting of electroplated Cu (thickness: approximately 10 μm) buried in the backside of the CMOS chip (thickness: 43 μm), which was connected with the frontside routing of the chip using 9 μm-diameter TSVs.

Modularized Construction of General Integrated Circuits on Individual Carbon Nanotubes

Nano Letters ◽  
2014 ◽  
Vol 14 (6) ◽  
pp. 3102-3109 ◽  
Author(s):  
Tian Pei ◽  
Panpan Zhang ◽  
Zhiyong Zhang ◽  
Chenguang Qiu ◽  
Shibo Liang ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Integrated Circuits

Cooling three-dimensional integrated circuits using power delivery networks

2012 ◽  
Author(s):  
Hai Wei ◽  
Tony F. Wu ◽  
Deepak Sekar ◽  
Brian Cronquist ◽  
Roger Fabian Pease ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Three Dimensional ◽  
Power Delivery ◽  
Power Delivery Networks ◽  
Delivery Networks

scholarly journals Enhancing electrical conductivity of multiwalled carbon nanotube/epoxy composites by graphene nanoplatelets

2018 ◽  
Vol 57 (4) ◽  
Author(s):  
Ieva Kranauskaitė ◽  
Jan Macutkevič ◽  
Anna Borisova ◽  
Alfonso Martone ◽  
Mauro Zarrelli ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Integrated Circuits ◽  
High Performance ◽  
Hybrid Composites ◽  
Graphene Nanoplatelets ◽  
Multiwalled Carbon ◽  
Temperature Range ◽  
Communication Devices ◽  
Hybrid Carbon

The need of high performance integrated circuits and high power density communication devices drives the development of materials enhancing the conductive performances by carbon nanoparticles. Among nanocomposites, the ternary hybrid carbon nanotubes/graphene nanoplatelets/polymer composites represent a debatable route to enhance the transport performances. In this study hybrid ternary nanocomposites were manufactured by direct mixing of multiwalled carbon nanotubes (MWCNTs) and graphene nanoplatelets (GNPs) at a fixed filler content (0.3 wt.%), but different relative combination, within an epoxy system. MWNT/epoxy nanocomposites were manufactured for comparison. The quality of dispersion was evaluated by optical and scanning electron microscopy (SEM). The electrical properties of hybrid composites were measured in the temperature range from 30 up to 300 K. The synergic combination of 1D/2D particles did not interfere with the percolative behaviour of MWCNTs but improved the overall electrical performances. The addition of a small amount of GNPs (0.05 wt.%) led to a strong increment of the sample conductivity over all the temperature range, compared to that of mono filler systems.

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