Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2017.134 ◽

2017 ◽

Author(s):

Ivy Qin ◽

Oranna Yauw ◽

Gary Schulze ◽

Aashish Shah ◽

Bob Chylak ◽

...

Keyword(s):

Wire Bonding ◽

Wafer Level ◽

Die Stacking ◽

Bonding Technology ◽

Wafer Level Package

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Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology

2011 IEEE 24th International Conference on Micro Electro Mechanical Systems ◽

10.1109/memsys.2011.5734433 ◽

2011 ◽

Author(s):

A. C. Fischer ◽

H. Gradin ◽

S. Braun ◽

S. Schroder ◽

G. Stemme ◽

...

Keyword(s):

Shape Memory Alloy ◽

Shape Memory ◽

Wire Bonding ◽

Niti Shape Memory Alloy ◽

Wafer Level ◽

Bonding Technology

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A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00298 ◽

2020 ◽

Author(s):

SeungNam Son ◽

DongHyun Khim ◽

SeokHun Yun ◽

JunHwan Park ◽

EunTaek Jeong ◽

...

Keyword(s):

Wafer Bonding ◽

Wafer Level ◽

Bonding Technology ◽

Wafer Level Package

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A Promising Embedded Silicon Fan-Out Wafer Level Package with Laser Releasable Temporary Bonding Technology

2020 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic49141.2020.9282470 ◽

2020 ◽

Author(s):

Chengqian Wang ◽

Aibing Zhang ◽

Zhengfeng Li ◽

Shouwei Li ◽

Yang Li ◽

...

Keyword(s):

Wafer Level ◽

Temporary Bonding ◽

Bonding Technology ◽

Wafer Level Package

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Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202920 ◽

2020 ◽

Author(s):

Zuohuan Chen ◽

Mingchuan Zhang ◽

Kai Zhu ◽

Feng Jiang ◽

Daquan Yu

Keyword(s):

Thin Film ◽

Wafer Level ◽

Wafer Level Package

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High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

ECS Transactions ◽

10.1149/07509.0345ecst ◽

2016 ◽

Vol 75 (9) ◽

pp. 345-353 ◽

Author(s):

F. Kurz ◽

T. Plach ◽

J. Suss ◽

T. Wagenleitner ◽

D. Zinner ◽

...

Keyword(s):

Low Temperature ◽

High Precision ◽

Wafer Bonding ◽

Wafer Level ◽

3D Ics ◽

Direct Wafer Bonding ◽

Bonding Technology

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Development on integrated passive devices using wafer level package technologies

2010 12th Electronics Packaging Technology Conference ◽

10.1109/eptc.2010.5702727 ◽

2010 ◽

Author(s):

Byeung-Gee Kim ◽

Yun-Mook Park ◽

Jun-Kyu Lee ◽

In-Soo Kang

Keyword(s):

Wafer Level ◽

Passive Devices ◽

Wafer Level Package

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Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430583 ◽

2006 ◽

Author(s):

Shan Gao ◽

Jupyo Hong ◽

Taehoon Kim ◽

Seogmoon Choi ◽

Sung Yi

Keyword(s):

Acoustic Wave ◽

Surface Acoustic Wave ◽

Wafer Level ◽

Wafer Level Package

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Warpage characteristics of wafer-level package of MEMS with glass frit bonding

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756603 ◽

2013 ◽

Author(s):

Gaowei Xu ◽

Shuangfu Wang ◽

Chunsheng Zhu ◽

Jiaotuo Ye ◽

Wei Gai ◽

...

Keyword(s):

Wafer Level ◽

Wafer Level Package

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A new wafer level package for improved electrical and reliability performance

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. ◽

10.1109/iemt.2003.1225893 ◽

2004 ◽

Author(s):

S. Barrett ◽

J. Reche ◽

Deok-Hoon Kim ◽

D. Stepniak

Keyword(s):

Wafer Level ◽

Reliability Performance ◽

Wafer Level Package

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A novel wafer level package strategy for RF MEMS

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270766 ◽

2009 ◽

Author(s):

Zheng Wang ◽

Zewen Liu

Keyword(s):

Rf Mems ◽

Wafer Level ◽

Wafer Level Package

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